Works matching DE "THERMOCYCLING"

Results: 2257

A Gauss Laser Pinning Method for Enhancing the Thermal Shock Resistance of Sprayed NiCoCrAlY Coatings.

Published in:

Journal of Thermal Spray Technology, 2025, v. 34, n. 5, p. 2015, doi. 10.1007/s11666-025-02006-3

By:

Wang, Tao;
Yang, Zikun;
Chen, Siyu;
Sun, Peipei

Publication type:

Article

Comparative evaluation of fracture resistance of endodontically treated maxillary premolars restored with three different fibre-reinforced composites: An in vitro study.

Published in:

Endodontology (0970-7212), 2025, v. 37, n. 2, p. 199, doi. 10.4103/endo.endo_214_24

By:

Mavidi, Jagapathi Babu;
Varma, K. Madhu;
Sajjan, Girija S.;
Satish, R. Kalyan;
Dasari, Lokesh;
Ajjimera, Katyayani

Publication type:

Article

Comparative Evaluation of Microleakage Around Pre-Endodontic Buildup with Composite, Light Cured Glass Ionomer Cement, and Glass Ionomer Cement: An In-Vitro Study.

Published in:

Journal of Pharmacy & Bioallied Sciences, 2025, v. 17, p. S1662, doi. 10.4103/jpbs.jpbs_221_25

By:

Neema, Avneel;
Singh, Santosh K.;
Magwa, Khushboo;
Deopujari, Juhi;
Suri, Jasleen;
Mitna, Shriya

Publication type:

Article

In Vitro Evaluation of the Fracture Resistance of CAD/CAM Materials for Fixed Partial Dentures.

Published in:

Journal of Pharmacy & Bioallied Sciences, 2025, v. 17, p. S1511, doi. 10.4103/jpbs.jpbs_72_25

By:

Reddy, Papala Sesha;
Doddamani, Mallikarjun H.;
Singh, Ngangbam Johnson;
Arya, Ashtha;
Vijayakanth, K.;
Veerakumar, Vignesh

Publication type:

Article

Comparative Analysis of Shear Bond Strength between Orthodontic Brackets Adhered Using Self-Etching Adhesives and Conventional Adhesives.

Published in:

2025

By:

Asarsa, Shekhar K.;
Mehta, Mansi;
Tripathi, Manisha;
Johnson, Perala;
Shilpi, Mandeep;
Vengala, Sukruthi

Publication type:

Abstract

Comparative Study on Antibacterial Efficacy, Hydroxyapatite Crystal, Fluoride Release and Microleakage in Bioactive Restorative Materials.

Published in:

Journal of Pharmacy & Bioallied Sciences, 2025, v. 17, p. S1460, doi. 10.4103/jpbs.jpbs_1892_24

By:

Waghmode, Sonali;
Ingole, Ranu S.;
Hadakar, Savita;
Gaikwad, Prajakta;
Dogra, Ajay Kumar;
Gulia, Suman

Publication type:

Article

Comparative Study of Plasma Nitriding for Dental Implant with or Without Thermocycling.

Published in:

2025

By:

Kumar, Nitesh;
Sharma, Rohit;
Mahaparale, Rushikesh R.;
Rodrigues, Lishoy W.;
Rao, Akhil;
Joshi, Ravi

Publication type:

Abstract

Air Abrasion vs. Tribochemical Silica Coating: Effect on Translucent Zirconia Bond Strength.

Published in:

European Journal of Prosthodontics & Restorative Dentistry, 2025, v. 33, n. 2, p. 199, doi. 10.1922/EJPRD_2799Prochnow07

By:

Prochnow, Fernanda H. O.;
Weber, Katia R.;
Rezende, Carlos E. E.;
Kaizer, Marina R.;
Gonzaga, Carla C.

Publication type:

Article

Thermal Fatigue Behaviors of BGA Packages with an Optimized Solder Joint Layout.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 11, p. 2286, doi. 10.3390/electronics14112286

By:

Abdel Razzaq, Mohammed;
Meilunas, Michael;
Cao, Xian A.;
Wilcox, Jim;
Ramini, Abdallah

Publication type:

Article

A Study on Thermally Fatigued Phase Transformation and Bending Fracture Mechanisms of 310S Stainless Steel.

Published in:

Materials (1996-1944), 2025, v. 18, n. 11, p. 2654, doi. 10.3390/ma18112654

By:

Huang, Ying-Ting;
Yen, Yu-Wei;
Hung, Fei-Yi

Publication type:

Article

Assessment of the Drone Arm's Plastic–Metal Joint Mechanical Resistance Following Natural and Artificial Aging of the 3D-Printed Plastic Component.

Published in:

Materials (1996-1944), 2025, v. 18, n. 11, p. 2591, doi. 10.3390/ma18112591

By:

Vasić, Miloš R.;
Vučetić, Snežana;
Miljić, Vesna;
Vorkapić, Miloš;
Terzić, Anja;
Ćosić, Mladen;
Bajić, Danica M.

Publication type:

Article

Design for Sustainability by Additive Manufacturing: A Study of PLA-Based Door Handle Redesign.

Published in:

Sustainability (2071-1050), 2025, v. 17, n. 11, p. 4969, doi. 10.3390/su17114969

By:

Gebre, Nikodmose Moges;
Gallo, Pasquale;
Rossi, Stefano

Publication type:

Article

Energy pile displacements due to cyclic thermal loading at different mechanical load levels.

Published in:

Acta Geotechnica, 2025, v. 20, n. 6, p. 3067, doi. 10.1007/s11440-025-02556-4

By:

Rafai, Mouadh;
Salciarini, Diana;
Vardon, Philip J.

Publication type:

Article

Influences of Various Thermal Cyclic Behaviours on Thermo Adsorption/Mechanical Characteristics of Epoxy Composite Enriched with Basalt Fiber.

Published in:

Adsorption Science & Technology, 2023, v. 2023, p. 1, doi. 10.1155/2023/9716173

By:

Karthikeyan, P.;
Prabhu, L.;
Bhuvaneswari, B.;
Yokesvaran, K.;
Jerin, A.;
Saravanan, R.;
Raghuvaran, S.;
Negash, Kassu;
Sharma, Shubham;
Barik, Debabrata

Publication type:

Article

Effect of vacuum plasma treatment on the shear bond strength of 3D-printed resin and self-adhesive resin cement.

Published in:

Dental Materials Journal, 2025, v. 44, n. 2, p. 211, doi. 10.4012/dmj.2024-128

By:

LEE, Mintae;
KANG, You-Jung;
PARK, Yeseul;
JEON, Hyun Jeong;
KIM, Jee-Hwan

Publication type:

Article

CONTROL OPTIMIZATION OF TURBOCHARGED DIRECT INJECTION MILLER CYCLE HYBRID ENGINE.

Published in:

International Journal of Simulation Modelling (IJSIMM), 2025, v. 24, n. 2, p. 357, doi. 10.2507/IJSIMM24-2-CO9

By:

Chen, L.-C.;
He, H.-W.;
Zhang, X.;
Hu, Z.-Q.

Publication type:

Article

Evaluation of Color Stability and Marginal Integrity in Provisional Restorations: A Study of Milling, 3D Printing, and Conventional Fabrication Methods.

Published in:

Dentistry Journal, 2025, v. 13, n. 5, p. 189, doi. 10.3390/dj13050189

By:

Galbraith, Austin;
Doan, Mai;
Galbraith, Tyson;
Abubakr, Neamat Hassan

Publication type:

Article

A Compact Real-Time PCR System for Point-of-Care Detection Using a PCB-Based Disposable Chip and Open-Platform CMOS Camera.

Published in:

Sensors (14248220), 2025, v. 25, n. 10, p. 3159, doi. 10.3390/s25103159

By:

Kim, MinGin;
Yun, Sung-Hun;
Kim, Sun-Hee;
Kim, Jong-Dae

Publication type:

Article

Antifungal Efficacy and Surface Properties of Conventional and 3D-Printed Denture Base Materials Modified with Titanium Tetrafluoride (TiF 4): In Vitro Study.

Published in:

Polymers (20734360), 2025, v. 17, n. 10, p. 1403, doi. 10.3390/polym17101403

By:

Alzaher, Zahra A.;
Aldobais, Fatimah A.;
Albazroun, Zainab;
Alatiyyah, Fatimah M.;
Abualsaud, Reem;
Alalawi, Haidar;
Al-Thobity, Ahmad M.;
Khan, Soban Q.;
Gad, Mohammed M.

Publication type:

Article

The Influence of Thermocycling and Ultraviolet Aging on Surface Characteristics and the Repair Bond Strength of CAD/CAM Resin Nanoceramics.

Published in:

Journal of Functional Biomaterials, 2025, v. 16, n. 5, p. 156, doi. 10.3390/jfb16050156

By:

Unalan Degirmenci, Beyza;
Degirmenci, Alperen;
Seyfioglu Polat, Zelal

Publication type:

Article

Preparation, Microstructure, and Properties of Solar Energy-Absorbing and -Storing Integrated Forsterite-Based Ceramics.

Published in:

Crystals (2073-4352), 2025, v. 15, n. 5, p. 427, doi. 10.3390/cryst15050427

By:

Xu, Xiaohong;
Li, Yuntian;
Cheng, Tiantian;
Wu, Jianfeng;
Shen, Yaqiang;
Qiu, Saixi;
Yu, Jiaqi

Publication type:

Article

Effect of Additive and Subtractive Coping Production Techniques on Retention and Marginal Fit of Implant Supported Crowns.

Published in:

Journal of Oral Implantology, 2023, v. 49, n. 2, p. 157, doi. 10.1563/aaid-joi-D-20-00069

By:

Cesmeci, Hayriye Senturk;
Gumus, Hasan Onder;
Özcan, Mutlu

Publication type:

Article

Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling: Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi...: C.-L. Hsieh et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2657, doi. 10.1007/s11664-025-11747-4

By:

Hsieh, Chen-Lin;
Coyle, Richard J.;
Gourlay, Christopher M.

Publication type:

Article

Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 8066, doi. 10.1007/s11664-024-11420-2

By:

Shih, Meng-Kai;
Chen, Shi-Jie;
Lin, I. Hung;
Lou, Bai-Yao;
Ni, Tom

Publication type:

Article

The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5534, doi. 10.1007/s11664-024-11294-4

By:

Wu, Chencheng;
Liu, Yang;
Xue, Yuxiong;
Zhao, Xuewei;
Li, Nannan;
Zhu, Zhengqiang;
Xing, Chaoyang

Publication type:

Article

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2544, doi. 10.1007/s11664-024-10975-4

By:

Zhang, Q. K.;
An, C. W.;
Song, Z. L.

Publication type:

Article

Long-term stability and performance of nanostructured thermal barrier coatings deposited by magnetron sputtering on superalloys: A review.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 149, doi. 10.1177/02670844251328622

By:

Altaf, Syed Faizan;
Rahman, Atikur;
Wani, MF

Publication type:

Article

Research on microstructural and property evolution in laser cladded HAZ.

Published in:

Surface Engineering, 2021, v. 37, n. 12, p. 1514, doi. 10.1080/02670844.2021.1929737

By:

Pan, Cunliang;
Li, Xiaoqiang;
Zhang, Ruihua;
Lu, Chao;
Yang, Chao;
Yao, Dengzhi

Publication type:

Article

Characterization and oxidation behaviour of nanostructured La2(Zr0.7Ce0.3)2O7/YSZ coatings prepared by calcined precursor precipitate plasma spraying.

Published in:

Surface Engineering, 2021, v. 37, n. 7, p. 861, doi. 10.1080/02670844.2020.1860463

By:

Taleghani, Pejman Rezaei;
Valefi, Zia;
Ehsani, Naser

Publication type:

Article

Plasma-sprayed alumina coating on Inconel 600 for fast reactor neutron detector application.

Published in:

Surface Engineering, 2018, v. 34, n. 10, p. 721, doi. 10.1080/02670844.2017.1404695

By:

Ravi Shankar, A.;
Thyagarajan, K.;
Upadhyay, Chandrakanth;
Mallika, C.;
Kamachi Mudali, U.

Publication type:

Article

Preparation of the plasma-sprayed graded thermal barrier coating by co-injection of premixed powders through a single plasma torch.

Published in:

Surface Engineering, 2018, v. 34, n. 10, p. 728, doi. 10.1080/02670844.2017.1374634

By:

Ravi Shankar, A.;
Kamachi Mudali, U.

Publication type:

Article

Effect of cryogenic thermal cycling on SiC-modified C/C composites.

Published in:

Surface Engineering, 2017, v. 33, n. 3, p. 237, doi. 10.1080/02670844.2016.1216053

By:

Zhang, M.-Y.;
Li, K.-Z.;
Shi, X.-H.;
Liu, N.-K.

Publication type:

Article

Influence of thermocycle boroaluminising on strength of steel C30.

Published in:

Surface Engineering, 2014, v. 30, n. 2, p. 129, doi. 10.1179/1743294413Y.0000000208

By:

Sizov, I.;
Mishigdorzhiyn, U.;
Leyens, C.;
Vetter, B.;
Fuhrmann, T.

Publication type:

Article

Effect of Crown Preparation Height on Retention of a Prefabricated Primary Posterior Zirconia Crown.

Published in:

Pediatric Dentistry, 2019, v. 41, n. 3, p. 229

By:

Lin Jing;
Jung-Wei Chen;
Roggenkamp, Clyde;
Suprono, Montry S.

Publication type:

Article

The Effect of Fluoride Varnish on Enamel Shear Bond Strength of Pit and Fissure Sealants.

Published in:

Pediatric Dentistry, 2017, v. 39, n. 2, p. 155

By:

Frazer, Rebecca A.;
Platt, Jeffrey A.;
Sanders, Brian J.;
Yepes, Juan F.;
Jones, James E.

Publication type:

Article

Remote-Controlled Release of Singlet Oxygen by the Plasmonic Heating of Endoperoxide-Modified Gold Nanorods: Towards a Paradigm Change in Photodynamic Therapy.

Published in:

Angewandte Chemie, 2016, v. 128, n. 11, p. 3670, doi. 10.1002/ange.201510064

By:

Kolemen, Safacan;
Ozdemir, Tugba;
Lee, Dayoung;
Kim, Gyoung Mi;
Karatas, Tugce;
Yoon, Juyoung;
Akkaya, Engin U.

Publication type:

Article

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4

By:

Seo, Wonil;
Ko, Yong-Ho;
Kim, Young-Ho;
Yoo, Sehoon

Publication type:

Article

Cu-Ba0.7Sr0.3TiO3 composites for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 9022, doi. 10.1007/s10854-019-01231-1

By:

Kumar, Sanjay;
Pradeepkumar, Maurya Sandeep;
Dwivedi, Akansha;
Ahmad, Md. Imteyaz

Publication type:

Article

Relationship between the thermal stress and structures of thermal-cycling-induced cracks in electroless nickel plating on metalized substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5820, doi. 10.1007/s10854-019-00880-6

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Iwakiri, Shoji;
Hirao, Kiyoshi

Publication type:

Article

Thermal cycling aging effects on the tensile property and constitute behavior of Sn-3.0Ag-0.5Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 1, p. 867, doi. 10.1007/s10854-018-0358-5

By:

Yao, Yao;
Yu, Xuemei

Publication type:

Article

Reliability of fluoride phosphor K2XF6:Mn4+ (K2SiF6:Mn4+, K2(Si,Ge)F6:Mn4+, K2TiF6:Mn4+) for LED application.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 21061, doi. 10.1007/s10854-018-0253-0

By:

Zheng, Fei;
Zou, Jun;
Yang, Bobo;
Liu, Yiming;
Zhou, Heyu;
Shi, Mingming;
Li, Mengtian;
Qian, Xinglu;
Liu, Zizhuan;
Li, Yang

Publication type:

Article

Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 17, p. 15249, doi. 10.1007/s10854-018-9667-y

By:

Surendar, A.;
Samavatian, Vahid;
Maseleno, Andino;
Ibatova, Aygul Z.;
Samavatian, Majid

Publication type:

Article

Effect of thermal cycles on interface and mechanical property of low-Ag Sn1.0Ag0.5Cu(nano-Al)/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 12, p. 9757, doi. 10.1007/s10854-018-9014-3

By:

Sun, Lei;
Chen, Ming-he;
Wei, Chun-chun;
Zhang, Liang;
Yang, Fan

Publication type:

Article

Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 5025, doi. 10.1007/s10854-017-8464-3

By:

Zhu, Q. S.;
Gao, F.;
Ma, H. C.;
Liu, Z. Q.;
Guo, J. D.;
Zhang, L.

Publication type:

Article

Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3898, doi. 10.1007/s10854-017-8328-x

By:

Brincker, Mads;
Walter, Thomas;
Kristensen, Peter K.;
Popok, Vladimir N.

Publication type:

Article

Thermal-cycling-induced surface roughening and structural change of a metal layer bonded to silicon nitride by active metal brazing.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 16, p. 12168, doi. 10.1007/s10854-017-7031-2

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Iwakiri, Shoji;
Hirao, Kiyoshi

Publication type:

Article

Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8278, doi. 10.1007/s10854-017-6541-2

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Hirao, Kiyoshi;
Iwakiri, Shoji

Publication type:

Article

Enhancement of thermal stability and reliability of green LuAG phosphors by appropriate Y substitution.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 5, p. 4075, doi. 10.1007/s10854-016-6025-9

By:

Yang, Bobo;
Zou, Jun;
Shi, Mingming;
Wang, Fengchao;
Li, Yang;
Li, Wenbo;
Yang, Lei;
Lin, Yujie

Publication type:

Article

Enhancement of thermal stability and reliability of BaSrSiO:Eu phosphors by Ba doping.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 12, p. 13199, doi. 10.1007/s10854-016-5466-5

By:

Zou, Jun;
Yang, Bobo;
Zhu, Siman;
Li, Jierong;
Wang, Fengchao

Publication type:

Article

Properties and long-term behavior of nanoparticle based inkjet printed strain gauges.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10934, doi. 10.1007/s10854-016-5207-9

By:

Kravchuk, Oleksandr;
Reichenberger, Marcus

Publication type:

Article