Works matching IS 03615235 AND DT 2025 AND VI 54 AND IP 5


Results: 80
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    Interfacial Effects of Surface Roughness and Topography on the Bond Strength of Silver-Sintered Joints on Copper Substrates: Interfacial Effects of Surface Roughness and Topography on the Bond Strength of Silver-Sintered Joints on Copper Substrates: Stegmann, Durst, Bruder, Gunst, and Schwöbel

    Published in:
    Journal of Electronic Materials, 2025, v. 54, n. 5, p. 4143, doi. 10.1007/s11664-025-11842-6
    By:
    • Stegmann, Tamira;
    • Durst, Karsten;
    • Bruder, Enrico;
    • Gunst, Stefan;
    • Schwöbel, André
    Publication type:
    Article
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    Determining the Cost of Organic Photovoltaic Material and Its Impact on the Levelized Cost of Electricity: Determining the Cost of Organic Photovoltaic Material and Its Impact on the Levelized Cost of Electricity: J. Mattiasson Bjuggren et al.

    Published in:
    Journal of Electronic Materials, 2025, v. 54, n. 5, p. 3801, doi. 10.1007/s11664-025-11826-6
    By:
    • Mattiasson Bjuggren, Jonas;
    • Marsh, Tomas;
    • Al-Ahmad, Alaa;
    • Sivunova, Kamilla;
    • Bonham, Mitchell;
    • Clifton, Sam;
    • Nicolaidis, Nicolas;
    • Belcher, Warwick;
    • Dastoor, Paul
    Publication type:
    Article
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