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Thermal response of timber connections using densified wood dowels under fire.
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- Journal of Fire Sciences, 2024, v. 42, n. 6, p. 534, doi. 10.1177/07349041241257262
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- Article
阳春沟区块页岩气超临界 CO<sub>2</sub> 增能压裂 研究与应用.
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- Chemical Engineering of Oil & Gas / Shi You Yu Tian Ran Qi Hua Gong, 2024, v. 53, n. 5, p. 77, doi. 10.3969/j.issn.1007-3426.2024.05.009
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Development of novel sustainable biocomposite from polycaprolactone and Sesbania rostrata fiber.
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- Polymer Composites, 2024, v. 45, n. 16, p. 15125, doi. 10.1002/pc.28825
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- Article
Tuning thermal and structural properties of nano‐filled PDMS elastomer.
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- Polymer Composites, 2024, v. 45, n. 16, p. 14832, doi. 10.1002/pc.28804
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The investigation of the mechanical thermal and physical properties of using waste toner/MCC/old newspaper fiber in polypropylene hybrid composites.
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- Polymer Composites, 2024, v. 45, n. 16, p. 14757, doi. 10.1002/pc.28797
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- Article
A novel building thermal energy storage PCM: lauric acid-palmitic acid- tetradecyl alcohol/vitrified beads.
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- Journal of Materials Science, 2024, v. 59, n. 41, p. 19734, doi. 10.1007/s10853-024-10316-0
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- Article
树枝状 PA 6 的制备及其性能研究.
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- China Synthetic Fiber Industry, 2023, v. 46, n. 5, p. 51
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- Article
Dynamics of Intra‐Cell Thermal Front Propagation in Lithium‐Ion Battery Safety Issues.
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- Advanced Energy Materials, 2024, v. 14, n. 41, p. 1, doi. 10.1002/aenm.202400621
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- Article
On the suitability of the α‐relaxation as novel trigger for a shape memory polymer.
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- Journal of Applied Polymer Science, 2024, v. 141, n. 46, p. 1, doi. 10.1002/app.56241
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- Article
Aluminum Josephson junction microstructure and electrical properties modified by thermal annealing.
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- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-74071-7
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- Article
Harnessing Limestone powder to enhance the thermal crack resistance of manufactured sand.
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- PLoS ONE, 2024, v. 19, n. 10, p. 1, doi. 10.1371/journal.pone.0309105
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- Article
Effect of yeast protein on reduced‐fat ice cream: Sensory quality, rheological behaviour, thermal properties and fat destabilisation.
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- International Journal of Dairy Technology, 2024, v. 77, n. 4, p. 1136, doi. 10.1111/1471-0307.13112
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- Article
Structural and Physicochemical Characterization of Resistant Starch from Sixteen Banana Cultivars across Three Genome Groups.
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- Foods, 2024, v. 13, n. 20, p. 3277, doi. 10.3390/foods13203277
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- Article
Cross-Linked Polyimide Aerogels with Excellent Thermal and Mechanical Properties.
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- Gels (2310-2861), 2024, v. 10, n. 10, p. 667, doi. 10.3390/gels10100667
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- Article
Characterization of some physicochemical, textural, and antioxidant properties of muffins fortified with hydrolyzed whey protein.
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- Food Science & Nutrition, 2024, v. 12, n. 10, p. 8105, doi. 10.1002/fsn3.4422
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- Article
Modeling radio-frequency energy-induced heating due to the presence of transcranial electric stimulation setup at 3T.
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- MAGMA: Magnetic Resonance Materials in Physics, Biology & Medicine, 2020, v. 33, n. 6, p. 793, doi. 10.1007/s10334-020-00853-5
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- Article
Relaxation shrinkage of weft knitted fabrics.
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- Melliand International, 2010, v. 16, n. 4, p. 174
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Mechanical and thermal characteristics of polyester, cotton tri-layer weft knitted fabrics.
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- Melliand International, 2009, v. 15, n. 1/2, p. 37
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PTFE yarns: unique yarn properties achieved by exclusive production technology.
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- Melliand International, 2006, v. 12, n. 4, p. 273
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- Article
New Tencel lyocell fiber for filling.
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- Melliand International, 2006, v. 12, n. 2, p. 86
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- Article
Insight on the Electronic, Elastic and Thermal Properties of Au-Al Intermetallic Compounds Based on First-Principles Calculations.
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- Journal of Electronic Materials, 2024, v. 53, n. 7, p. 3809, doi. 10.1007/s11664-024-11121-w
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- Article
Sintering Behaviors, Microstructures, and Dielectric and Thermal Properties of CBS/Mg<sub>2</sub>SiO<sub>4</sub> Composite for LTCC Application.
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- Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2263, doi. 10.1007/s11664-024-10990-5
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- Article
Composition-Driven Structural, Optical, Thermal and Electrochemical Properties of Hybrid Perovskite-Structured Methylammonium-Tin-Chloride.
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- Journal of Electronic Materials, 2024, v. 53, n. 1, p. 94, doi. 10.1007/s11664-023-10777-0
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- Article
Effect of Sn Concentration on the Structural and Thermal Properties of Sn<sub>x</sub>Sb<sub>20</sub>Se<sub>80−x</sub> Glasses.
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- Journal of Electronic Materials, 2023, v. 52, n. 12, p. 7920, doi. 10.1007/s11664-023-10709-y
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Compositional Impact on Structural, Optical and Thermal Properties of Stable Cesium-Tin-Bromide-Chloride Perovskites for Optoelectronic Applications.
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- Journal of Electronic Materials, 2023, v. 52, n. 3, p. 1854, doi. 10.1007/s11664-022-10132-9
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- Article
Preparation of a Wood-Based Thermally Conductive Composite.
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- Journal of Electronic Materials, 2023, v. 52, n. 1, p. 540, doi. 10.1007/s11664-022-10023-z
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- Article
Enhanced Electronic Thermal Conductivity and Heat Capacity of Biased Bilayer Boron Phosphide with Magnetic Field.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 7240, doi. 10.1007/s11664-022-09966-0
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- Article
Enhanced Thermoelectric Properties of Sn<sub>x</sub>Sb<sub>2</sub>S<sub>y</sub> (1 ≤ x ≤ 3, 4 ≤ y ≤ 6) Thin Films.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 6770, doi. 10.1007/s11664-022-09936-6
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- Article
Study on Thermal Reliability of Ga-Based Liquid Metal as Thermal Interface Material Encapsulated with Fluororubber.
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- Journal of Electronic Materials, 2022, v. 51, n. 12, p. 6975, doi. 10.1007/s11664-022-09927-7
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- Article
Thermal Analysis of Gallium Oxide-Based Field-Effect Transistors on Different Substrates.
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- Journal of Electronic Materials, 2022, v. 51, n. 11, p. 6379, doi. 10.1007/s11664-022-09871-6
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- Article
Enhanced Mechanical and Thermal Properties of Ag Joints Sintered by Spark Plasma Sintering.
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- Journal of Electronic Materials, 2022, v. 51, n. 11, p. 6310, doi. 10.1007/s11664-022-09849-4
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- Article
Simultaneous Improvement of Electrical and Thermal Transport Properties of Titanium Oxide Ceramic Thermoelectric Materials.
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- Journal of Electronic Materials, 2022, v. 51, n. 7, p. 3504, doi. 10.1007/s11664-022-09642-3
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- Article
First-Principles Investigation of Elasticity, Thermal and Electronic Properties of Intermetallics Formed at the Interface of Al-Cu Composites.
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- Journal of Electronic Materials, 2022, v. 51, n. 7, p. 3782, doi. 10.1007/s11664-022-09612-9
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A Critical Review of the Role of Carbon Nanotubes in the Progress of Next-Generation Electronic Applications.
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- Journal of Electronic Materials, 2022, v. 51, n. 6, p. 2786, doi. 10.1007/s11664-022-09516-8
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- Article
Direction-Dependent Thermoelectric Properties of a Layered Compound In<sub>2</sub>Te<sub>5</sub> Single Crystal.
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- Journal of Electronic Materials, 2022, v. 51, n. 5, p. 2266, doi. 10.1007/s11664-022-09487-w
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- Article
Polyhedral Oligosilsesquioxane-Modified Alumina/Aluminum Nitride/Silicone Rubber Composites to Enhance Dielectric Properties and Thermal Conductivity.
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- Journal of Electronic Materials, 2022, v. 51, n. 5, p. 2308, doi. 10.1007/s11664-022-09465-2
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- Article
Improved Thermal Properties of Three-Dimensional Graphene Network Filled Polymer Composites.
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- Journal of Electronic Materials, 2022, v. 51, n. 1, p. 420, doi. 10.1007/s11664-021-09311-x
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- Article
Effect of Transient and Steady-State Current on the Photothermal Performance of a UVC-LED.
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- Journal of Electronic Materials, 2022, v. 51, n. 1, p. 119, doi. 10.1007/s11664-021-09268-x
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- Article
Synthesis, Molecular Spectroscopic Analyses, and Computational Investigation Using DFT:B3LYP/LANL2DZ Calculations for PVC/PANI/GO Composite.
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- Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4741, doi. 10.1007/s11664-021-09009-0
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- Article
Influence of Soldering Temperature on Microstructure and Thermal Properties of FC-LED Filaments Soldered with SAC0307.
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- Journal of Electronic Materials, 2021, v. 50, n. 7, p. 4186, doi. 10.1007/s11664-021-08957-x
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- Article
Low-Temperature Sintering of Gahnite Ceramic Using Cu-Nb-O Additive and Evaluation of Dielectric and Thermal Properties.
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- Journal of Electronic Materials, 2020, v. 49, n. 10, p. 6046, doi. 10.1007/s11664-020-08346-w
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- Article
The Electrical and Thermal Analyses of Aluminized PET for Use in Thermal Layers.
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- Journal of Electronic Materials, 2020, v. 49, n. 9, p. 5552, doi. 10.1007/s11664-020-08300-w
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- Article
Improved Electrical and Thermal Aging Properties of DBSA-Doped PANI Using MWCNT and GO.
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- Journal of Electronic Materials, 2020, v. 49, n. 9, p. 5326, doi. 10.1007/s11664-020-08256-x
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- Article
Melt-Processed Graphite-Polypropylene Composites for EMI Shielding Applications.
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- Journal of Electronic Materials, 2020, v. 49, n. 9, p. 5293, doi. 10.1007/s11664-020-08247-y
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- Article
Preparation and Enhanced Thermoelectric Properties of Cu/Bi0.5Sb1.5Te3 Composite Materials.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 2962, doi. 10.1007/s11664-020-08011-2
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- Article
Thermoelectric Transport in p-Type (Pb0.98Na0.02Te)1−x(Zn0.85Al0.15Te)x-Te Composites Fabricated Using a Combination of Hydrothermal Synthesis and Evacuating-and-Encapsulating Sintering.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 2954, doi. 10.1007/s11664-020-07994-2
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- Article
Effects of Ni Magnetic Nanoparticles on Thermoelectric Properties of n-Type Bi2Te2.7Se0.3 Materials.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 2881, doi. 10.1007/s11664-020-07956-8
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- Article
Preparation and Characterization of Ni/Bi0.5Sb1.5Te3 Heterogeneous Multilayered Thermoelectric Materials.
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- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 2689, doi. 10.1007/s11664-019-07745-y
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- Article
Microstructure Evolution, Thermal and Mechanical Property of Co Alloyed Sn-0.7Cu Lead-Free Solder.
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- Journal of Electronic Materials, 2020, v. 49, n. 4, p. 2660, doi. 10.1007/s11664-020-07960-y
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- Article
Enhanced Electrostrictive Properties and Thermal Stability in Zn-Modified 0.9Pb(Mg1/3Nb2/3)O3-0.1PbTiO3 Ceramics.
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- Journal of Electronic Materials, 2020, v. 49, n. 2, p. 1150, doi. 10.1007/s11664-019-07812-4
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- Article