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Highly Sensitive Reconfigurable Plasmonic Metasurface with Dual-Band Response for Optical Sensing and Switching in the Mid-Infrared Spectrum.
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 120, doi. 10.1007/s11664-020-08551-7
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- Article
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 283, doi. 10.1007/s11664-020-08595-9
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- Article
Overview of the Role of Alloying Modifiers on the Performance of Phase Change Memory Materials.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 1, doi. 10.1007/s11664-020-08590-0
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- Article
Sputter-Grown Pd-Capped CuO Thin Films for a Highly Sensitive and Selective Hydrogen Gas Sensor.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 192, doi. 10.1007/s11664-020-08588-8
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- Article
A Review of the Mg2(Si,Sn) Alloy System as Emerging Thermoelectric Material: Experimental and Modeling Aspects.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 25, doi. 10.1007/s11664-020-08591-z
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- Article
Enhanced Visible-Light Photocatalytic Activity and Mechanism of Ag@AgCl-Decorated TiO2 Nanotubes.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 352, doi. 10.1007/s11664-020-08552-6
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- Article
Enhancement on Charge Generation and Transfer Properties of Sb2S3 Quantum-Dot-Sensitized Solar Cells by ZnO Nanorods Optimization.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 100, doi. 10.1007/s11664-020-08542-8
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- Article
Gravitational Search Algorithm for Calculating Exciton Binding Energy in Monolayer Transition Metal Dichalcogenides.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 163, doi. 10.1007/s11664-020-08585-x
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- Article
Upconversion Luminescence, Laser Heating Effect and Temperature Sensing Properties of β-BiNbO4:Er3+/Yb3+.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 201, doi. 10.1007/s11664-020-08584-y
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- Article
Adsorption of Cs-O on Graphene: Modification of the Anderson–Newns Model for the Calculation of Work Function Variation.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 186, doi. 10.1007/s11664-020-08574-0
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- Article
Design and Analysis of a Dual-Metal-Implanted Triple-Material Cylindrical Gate-All-Around Nanowire FET with Negative Differential Resistance and Negative Transconductance Behaviors.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 170, doi. 10.1007/s11664-020-08572-2
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- Article
Power Generation Efficiency of Thermoelectric Elements with a Trapezoidal Section.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 346, doi. 10.1007/s11664-020-08569-x
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- Article
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 258, doi. 10.1007/s11664-020-08562-4
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- Article
Melt-Spun SiGe Nano-Alloys: Microstructural Engineering Towards High Thermoelectric Efficiency.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 364, doi. 10.1007/s11664-020-08560-6
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- Article
A Binary Particle Self-Assembly Sintering Method to Realize Controllable Synthesis of Fine-Grained Barium Titanate Ceramics.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 325, doi. 10.1007/s11664-020-08559-z
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- Article
Effect of Ni Doping on the Structural and Optical Properties of ZrO2 Thin Films.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 65, doi. 10.1007/s11664-020-08558-0
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- Article
Thermodynamic, Mechanical, Optical and Electronic Properties of Cu3VS4: An Ab Initio Study.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 336, doi. 10.1007/s11664-020-08557-1
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- Article
Correction to: Charge Density Analysis, Structural, Electrical and Magnetic Studies of (1 − x) BaTiO3 + x NiFe2O4 Ceramic Composite.
- Published in:
- 2021
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- Publication type:
- Correction Notice
The Construction of a ZnO/CdS Heterostructure with Synergistic Enhanced Effect in Photocatalytic and Self-Cleaning Performance.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 129, doi. 10.1007/s11664-020-08555-3
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- Article
Investigation of a Metamaterial Absorber with a Ground Plane by Impedance Analysis.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 389, doi. 10.1007/s11664-020-08554-4
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- Article
Structural, Optical and Magnetic Properties of Dy-doped In2O3 Nanoparticles.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 52, doi. 10.1007/s11664-020-08553-5
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- Article
Field-Effect Transistor Behavior of Synthesized In2O3/InP (100) Nanowires via the Vapor–Liquid–Solid Method.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 59, doi. 10.1007/s11664-020-08548-2
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- Article
Electrochemical Properties of CMC–PVA Polymer Blend Electrolyte for Solid State Electric Double Layer Capacitors.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 303, doi. 10.1007/s11664-020-08547-3
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- Article
Photoluminescence Quenching and Photo-Induced Charge Transfer Processes in Poly(3-octylthiophene) Polymer Based Hybrid Nano-composites by Ion Irradiation for Possible Optoelectronic Applications.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 85, doi. 10.1007/s11664-020-08545-5
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- Article
Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 233, doi. 10.1007/s11664-020-08514-y
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- Article
Ultraviolet Radiation-Emitting Gd3+-Doped Sr2ZnSi2O7 Host Lattice Prepared by Sol–Gel Procedure and Evaluation of Gamma-Ray Exposure Parameters.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 155, doi. 10.1007/s11664-020-08549-1
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- Article
Correction to: The Enzyme Free Uric Acid Sensor Based on Iron Doped CuO Nanostructures for the Determination of Uric Acid from Commercial Seafood.
- Published in:
- 2021
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- Publication type:
- Correction Notice
Study on Microstructure and Shear Property of Cu/In-xCu/Cu Transient Liquid Phase Bonding Joints.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 217, doi. 10.1007/s11664-020-08504-0
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- Publication type:
- Article
Influencing Factors of Fatigue Life of Nano-Silver Paste in Chip Interconnection.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 224, doi. 10.1007/s11664-020-08501-3
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- Article
Novel Dual-Metal Junctionless Nanotube Field-Effect Transistors for Improved Analog and Low-Noise Applications.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 108, doi. 10.1007/s11664-020-08541-9
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- Article
Unveiling the Phase Evolution of Sol–Gel Sulfurized Cu2ZnSnS4 Thin Films in ppm-Level H2S: From Binary Sulfides to Quaternary Cu-Zn-Sn-S System.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 314, doi. 10.1007/s11664-020-08539-3
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- Article
RF Analysis of Double-Gate Junctionless Tunnel FET for Wireless Communication Systems: A Non-quasi Static Approach.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 138, doi. 10.1007/s11664-020-08538-4
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- Article
Investigation of the Effects of Forming Gas Annealing on Al2O3/GaN Interface.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 80, doi. 10.1007/s11664-020-08532-w
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- Article
Design and Optimization of High-Performance Through Hole Based MEMS Energy Harvester Using PiezoMUMPs.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 375, doi. 10.1007/s11664-020-08528-6
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- Article
Investigations on Structural, Mechanical, Optical, Electrical, Third-Order Nonlinear Optical and Antibacterial Activity of 4-Aminopyridine Monophthalate Single Crystal.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 291, doi. 10.1007/s11664-020-08497-w
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- Publication type:
- Article
Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB).
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 263, doi. 10.1007/s11664-020-08525-9
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- Article
Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 249, doi. 10.1007/s11664-020-08523-x
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- Article
α Irradiation Response on the Electronic Transport Properties of p-B12P2.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 75, doi. 10.1007/s11664-020-08518-8
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- Article
The Effect of Thermal History on the Microstructure of SnAgCu/SnBiAg Mixed Assemblies.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 209, doi. 10.1007/s11664-020-08474-3
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- Publication type:
- Article
Correction to: A Dual-Type Electrochromic Device Based on Complementary Silica/Conducting Polymers Nanocomposite Films for Excellent Cycling Stability.
- Published in:
- 2021
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- Publication type:
- Correction Notice