Works matching Etching

Results: 5000

Low-Damage and Self-Limiting (Al)GaN Etching Process through Atomic Layer Etching Using O 2 and BCl 3 Plasma.

Published in:

Coatings (2079-6412), 2021, v. 11, n. 3, p. 268, doi. 10.3390/coatings11030268

By:

Hwang, Il-Hwan;
Cha, Ho-Young;
Seo, Kwang-Seok;
Patelli, Alessandro

Publication type:

Article

Monocrystalline Quartz ICP Etching: Road to High-Temperature Dry Etching.

Published in:

Plasma Chemistry & Plasma Processing, 2020, v. 40, n. 1, p. 423, doi. 10.1007/s11090-019-10025-6

By:

Osipov, Artem A.;
Iankevich, Gleb A.;
Alexandrov, Sergey E.

Publication type:

Article

The effect of pre-etching with 37% orthophosphoric acid on the shear bond strength of orthodontic brackets bonded using self-etching primer-adhesive system.

Published in:

2016

By:

Hamdani, Shaheen;
Anita, G.;
Sodawala, Javed;
Gandhi, Sumit;
Ali, Sayyed Muhammad

Publication type:

journal article

Investigation into SiO 2 Etching Characteristics Using Fluorocarbon Capacitively Coupled Plasmas: Etching with Radical/Ion Flux-Controlled.

Published in:

Nanomaterials (2079-4991), 2022, v. 12, n. 24, p. 4457, doi. 10.3390/nano12244457

By:

Jeong, Won-nyoung;
Lee, Young-seok;
Cho, Chul-hee;
Seong, In-ho;
You, Shin-jae

Publication type:

Article

Atomic layer etching of SiO2 with Ar and CHF 3 plasmas: A self‐limiting process for aspect ratio independent etching.

Published in:

Plasma Processes & Polymers, 2019, v. 16, n. 9, p. N.PAG, doi. 10.1002/ppap.201900051

By:

Dallorto, Stefano;
Goodyear, Andy;
Cooke, Mike;
Szornel, Julia E.;
Ward, Craig;
Kastl, Christoph;
Schwartzberg, Adam;
Rangelow, Ivo W.;
Cabrini, Stefano

Publication type:

Article

Producing Silicon Carbide Micro and Nanostructures by Plasma‐Free Metal‐Assisted Chemical Etching.

Published in:

Advanced Functional Materials, 2021, v. 31, n. 32, p. 1, doi. 10.1002/adfm.202103298

By:

Michaels, Julian A.;
Janavicius, Lukas;
Wu, Xihang;
Chan, Clarence;
Huang, Hsieh‐Chih;
Namiki, Shunya;
Kim, Munho;
Sievers, Dane;
Li, Xiuling

Publication type:

Article

蓝宝石晶体湿法刻蚀各向异性研究与机理分析.

Published in:

Journal of Synthetic Crystals, 2023, v. 52, n. 6, p. 1128

By:

张辉;
钱珺;
洪莉莉

Publication type:

Article

利用干燥空气改善熔融 KOH 对单晶碳化硅的腐蚀.

Published in:

Journal of Synthetic Crystals, 2023, v. 52, n. 5, p. 753

By:

孙帅;
宋华平;
杨军伟;
王文军;
屈红霞;
简基康

Publication type:

Article

Reactive Ion Etching and Ion Beam Etching for Ferroelectric Memories.

Published in:

Integrated Ferroelectrics, 2004, v. 61, n. 1, p. 213, doi. 10.1080/10584580490459288

By:

Tian-Qi Shao;
Tian-Ling Ren;
Li-Tian Liu;
Jun Zhu;
Zhi-Jian Li

Publication type:

Article

Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching.

Published in:

Micromachines, 2020, v. 11, n. 8, p. 744, doi. 10.3390/mi11080744

By:

Kim, Tae Kyoung;
Bae, Jee-Hwan;
Kim, Juyoung;
Cho, Min Kyung;
Kim, Yu-Chan;
Jin, Sungho;
Chun, Dongwon

Publication type:

Article

Fabrication of Ultra-High Aspect Ratio (>420:1) Al2O3 Nanotube Arraysby Sidewall TransferMetal Assistant Chemical Etching.

Published in:

Micromachines, 2020, v. 11, n. 4, p. 378, doi. 10.3390/mi11040378

By:

Li, Hailiang;
Xie, Changqing

Publication type:

Article

Removal of Dry-Etch-Induced Surface Layer Damage from p-GaN by Photoelectrochemical Etching.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 6, p. 3481, doi. 10.1007/s11664-020-07986-2

By:

Meyers, V.;
Rocco, E.;
Hogan, K.;
Tozier, S.;
McEwen, B.;
Mahaboob, I.;
Shahedipour-Sandvik, F.

Publication type:

Article

Study the Effect of Etching Time on the Characteristics of the Porous Silicon that Prepare from N-Type Silicon by Photoelectrochemical Etching Method .

Published in:

Journal of College of Education, 2022, n. 1, p. 12

By:

Abbas, Israa Akram;
Hazaa, Salah Qaddoori

Publication type:

Article

Formation Mechanisms and Crack Propagation Behaviors of White Etching Layers and Brown Etching Layers on Raceways of Failure Bearings.

Published in:

Lubricants (2075-4442), 2024, v. 12, n. 2, p. 59, doi. 10.3390/lubricants12020059

By:

Zhang, Xiaochen;
Wu, Di;
Zhang, Yaming;
Xu, Lijia;
Wang, Jianqiu;
Han, En-Hou

Publication type:

Article

Etching Patterns of Self-Etching Primers in Relation to Shear Bond Strength on Unground Enamel Samples.

Published in:

Dentistry Journal, 2021, v. 9, n. 11, p. 138, doi. 10.3390/dj9110138

By:

Brauchli, Lorenz;
Steineck, Markus

Publication type:

Article

Enamel bonding of self-etching and phosphoric acid-etching orthodontic adhesives in simulated clinical conditions: Debonding force and enamel surface.

Published in:

Dental Materials Journal, 2009, v. 28, n. 4, p. 419

By:

Horiuchi, Shiriya;
Kaneko, Kazuyuki;
Marl, Hiroko;
Kawakami, Emi;
Tsukahara, Takashi;
Yamamoto, Kohji;
Hamada, Kenichi;
Asaoka, Kenzo;
Tanaka, Eiji

Publication type:

Article

Highly Selective Plasma Etching Technique for Molybdenum.

Published in:

Plasma Chemistry & Plasma Processing, 2023, v. 43, n. 3, p. 697, doi. 10.1007/s11090-023-10318-x

By:

Osipov, Artem A.;
Andrianov, Nikolai A.;
Speshilova, Anastasia B.;
Gagaeva, Alina E.;
Risquez, Sarah;
Vorobyev, Alexandr;
Alexandrov, Sergey E.

Publication type:

Article

Correlation between the Grain Orientation Dependence of Color Etching and Chemical Etching.

Published in:

Microscopy & Microanalysis, 2012, v. 18, n. 6, p. 1389, doi. 10.1017/S1431927612013554

By:

Bonyár, Attila;
Szabó, Peter J.

Publication type:

Article

Excimer-ultraviolet-lamp-assisted selective etching of single-layer graphene and its application in edge-contact devices.

Published in:

Nano Convergence, 2024, v. 11, n. 1, p. 1, doi. 10.1186/s40580-024-00442-5

By:

Shin, Minjeong;
Kim, Jin Hong;
Ko, Jin-Yong;
Haidari, Mohd Musaib;
Jang, Dong Jin;
Lee, Kihyun;
Kim, Kwanpyo;
Kim, Hakseong;
Park, Bae Ho;
Choi, Jin Sik

Publication type:

Article

Investigation of a Macromolecular Additive on the Decrease of the Aluminum Horizontal Etching Rate in the Wet Etching Process.

Published in:

Metals (2075-4701), 2022, v. 12, n. 5, p. 813, doi. 10.3390/met12050813

By:

Ding, Jingxiu;
Zhang, Ruipeng;
Li, Yuchun;
Zhang, David Wei;
Lu, Hongliang

Publication type:

Article

Etching Characteristics of Hydrogen Environment Anisotropic Thermal Etching for GaN‐Based Functional Photonic Devices.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2024, v. 221, n. 13, p. 1, doi. 10.1002/pssa.202300688

By:

Honda, Takuto;
Akimoto, Mirai;
Kurabe, Umito;
Takano, Yamato;
Kikuchi, Akihiko

Publication type:

Article

Two‐Step Reactive Ion Etching Process for Diamond‐Based Nanophotonics Structure Formation.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2021, v. 218, n. 5, p. 1, doi. 10.1002/pssa.202000206

By:

Golovanov, Anton V.;
Luparev, Nikolay V.;
Troschiev, Sergey Yu.;
Tarelkin, Sergei A.;
Shcherbakova, Viktoriia S.;
Bormashov, Vitaly S.

Publication type:

Article

Combination of Reactive-Ion Etching and Chemical Etching as a Method for Optimizing the Surface Relief on AlGaInN Heterostructures.

Published in:

Semiconductors, 2020, v. 54, n. 10, p. 1310, doi. 10.1134/S1063782620100218

By:

Markov, L. K.;
Smirnova, I. P.;
Kukushkin, M. V.;
Pavluchenko, A. S.

Publication type:

Article

Dry Etching Characteristics of InGaZnO Thin Films Under Inductively Coupled Plasma–Reactive-Ion Etching with Hydrochloride and Argon Gas Mixture.

Published in:

Materials (1996-1944), 2024, v. 17, n. 24, p. 6241, doi. 10.3390/ma17246241

By:

Oh, Changyong;
Ju, Myeong Woo;
Jeong, Hojun;
Song, Jun Ho;
Kim, Bo Sung;
Lee, Dae Gyu;
Cho, ChoongHo

Publication type:

Article

Contribution of Ion Energy and Flux on High-Aspect Ratio SiO 2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C 4 F 8 Plasma: Individual Ion Energy and Flux Controlled.

Published in:

Materials (1996-1944), 2023, v. 16, n. 10, p. 3820, doi. 10.3390/ma16103820

By:

Jeong, Wonnyoung;
Kim, Sijun;
Lee, Youngseok;
Cho, Chulhee;
Seong, Inho;
You, Yebin;
Choi, Minsu;
Lee, Jangjae;
Seol, Youbin;
You, Shinjae

Publication type:

Article

Anisotropic Etching of InGaN Thin Films with Photoelectrochemical Etching to Form Quantum Dots.

Published in:

Materials (1996-1944), 2023, v. 16, n. 5, p. 1890, doi. 10.3390/ma16051890

By:

Wei, Xiongliang;
Al Muyeed, Syed Ahmed;
Xue, Haotian;
Wierer Jr., Jonathan J.

Publication type:

Article

Demineralization adjacent to orthodontic brackets after application of conventional and self-etching primer systems.

Published in:

Journal of Orofacial Orthopedics/Fortschritte der Kieferorthopadie, 2014, v. 75, n. 5, p. 358, doi. 10.1007/s00056-014-0233-9

By:

Visel, D.;
Jäcker, T.;
Jost-Brinkmann, P.-G.;
Präger, T.-M.

Publication type:

Article

Microstructural characterization and inductively coupled plasma-reactive ion etching resistance of Y2O3–Y4Al2O9 composite under CF4/Ar/O2 mixed gas conditions.

Published in:

Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-57697-5

By:

Ma, Ho Jin;
Kim, Seonghyeon;
Kim, Ha-Neul;
Kim, Mi-Ju;
Ko, Jae-Woong;
Lee, Jae-Wook;
Kim, Jung-Hyung;
Lee, Hyo-Chang;
Park, Young-Jo

Publication type:

Article

Effect of Phosphoric Acid Etching and Self-etching Primer Application Methods on Dentinal Shear Bond Strength.

Published in:

Journal of Adhesive Dentistry, 2008, v. 10, n. 5, p. 345

By:

Gokce, Kagan;
Aykor, Arzu;
Ersoy, Mustafa;
Ozel, Emre;
Soyman, Mubin

Publication type:

Article

Effect of Acid Etching Time and a Self-etching Adhesive on the Shear Bond Strength of Composite Resin to Porcelain.

Published in:

Journal of Adhesive Dentistry, 2006, v. 8, n. 1, p. 21

By:

Güler, Ahmet Umut;
Yilmaz, Fikret;
Yenisey, Murat;
Güler, Eda;
Ural, Çağri

Publication type:

Article

Study on the Influence of Etchant Composition and Etching Process on the Precision of Stainless-Steel Microchannel and Etching Mechanism.

Published in:

Advanced Engineering Materials, 2024, v. 26, n. 10, p. 1, doi. 10.1002/adem.202301731

By:

Yanni Wei;
Linghao Zhu;
Lei Jia;
Yu Chen;
Yaru Li

Publication type:

Article

Highly Anisotropic Fluorine‐Based Plasma Etching of Ultralow Expansion Glass.

Published in:

Advanced Engineering Materials, 2021, v. 23, n. 6, p. 1, doi. 10.1002/adem.202001336

By:

Weigel, Christoph;
Phi, Hai Binh;
Denissel, Felix Arthur;
Hoffmann, Martin;
Sinzinger, Stefan;
Strehle, Steffen

Publication type:

Article

Study of Eutectic Etching Process for Defects Analysis in n-type 4H-SiC.

Published in:

Defence Science Journal, 2020, v. 70, n. 5, p. 515, doi. 10.14429/dsj.70.16361

By:

Pal, Pooja;
Kumar, Sunil;
Singh, S. K.

Publication type:

Article

The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials.

Published in:

Nanomaterials (2079-4991), 2024, v. 14, n. 19, p. 1612, doi. 10.3390/nano14191612

By:

Majkowycz, Kinga;
Murawski, Krzysztof;
Kopytko, Małgorzata;
Nowakowski-Szkudlarek, Krzesimir;
Witkowska-Baran, Marta;
Martyniuk, Piotr

Publication type:

Article

Advanced Etching Techniques of LiNbO 3 Nanodevices.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 20, p. 2789, doi. 10.3390/nano13202789

By:

Shen, Bowen;
Hu, Di;
Dai, Cuihua;
Yu, Xiaoyang;
Tan, Xiaojun;
Sun, Jie;
Jiang, Jun;
Jiang, Anquan

Publication type:

Article

A Facile, Low-Cost Plasma Etching Method for Achieving Size Controlled Non-Close-Packed Monolayer Arrays of Polystyrene Nano-Spheres.

Published in:

Nanomaterials (2079-4991), 2019, v. 9, n. 4, p. 605, doi. 10.3390/nano9040605

By:

Chen, Yun;
Shi, Dachuang;
Chen, Yanhui;
Chen, Xun;
Gao, Jian;
Zhao, Ni;
Wong, Ching-Ping

Publication type:

Article

Noble gas effect on ACL etching selectivity to SiO2 films.

Published in:

Plasma Processes & Polymers, 2023, v. 20, n. 8, p. 1, doi. 10.1002/ppap.202300026

By:

Choi, Gilyoung;
Efremov, Alexander;
Son, Hye Jun;
Kwon, Kwang‐Ho

Publication type:

Article

High‐aspect‐ratio oxide etching using CF4/C6F12O plasma in an inductively coupled plasma etching system with low‐frequency bias power.

Published in:

Plasma Processes & Polymers, 2023, v. 20, n. 3, p. 1, doi. 10.1002/ppap.202200167

By:

Kim, Jinhyuk;
Choi, Gilyoung;
Kwon, Kwang‐Ho

Publication type:

Article

Damage recovery and low‐damage etching of ITO in H2/CO plasma: Effects of hydrogen or oxygen.

Published in:

Plasma Processes & Polymers, 2019, v. 16, n. 9, p. N.PAG, doi. 10.1002/ppap.201900029

By:

Hirata, Akiko;
Fukasawa, Masanaga;
Kugimiya, Katsuhisa;
Karahashi, Kazuhiro;
Hamaguchi, Satoshi;
Nagaoka, Kojiro

Publication type:

Article

A Review: Inductively Coupled Plasma Reactive Ion Etching of Silicon Carbide.

Published in:

Materials (1996-1944), 2022, v. 15, n. 1, p. 123, doi. 10.3390/ma15010123

By:

Racka-Szmidt, Katarzyna;
Stonio, Bartłomiej;
Żelazko, Jarosław;
Filipiak, Maciej;
Sochacki, Mariusz

Publication type:

Article

Ion-Enhanced Etching Characteristics of sp 2 -Rich Hydrogenated Amorphous Carbons in CF 4 Plasmas and O 2 Plasmas.

Published in:

Materials (1996-1944), 2021, v. 14, n. 11, p. 2941, doi. 10.3390/ma14112941

By:

Li, Jie;
Kim, Yongjae;
Han, Seunghun;
Chae, Heeyeop

Publication type:

Article

Comparison of shear bond strength of composite resin to enamel surface with laser etching versus acid etching: An in vitro evaluation.

Published in:

Journal of Conservative Dentistry, 2014, v. 17, n. 4, p. 320, doi. 10.4103/0972-0707.136438

By:

Hoshing, Upendra A.;
Patil, Suvarna;
Medha, Ashish;
Dattatray Bandekar, Siddhesh

Publication type:

Article

Unveiling the Dynamic Oxidative Etching Mechanisms of Nanostructured Metals/Metallic Oxides in Liquid Media Through In Situ Transmission Electron Microscopy.

Published in:

Advanced Functional Materials, 2022, v. 32, n. 36, p. 1, doi. 10.1002/adfm.202204976

By:

Zhang, Junyu;
Sun, Zhefei;
Kang, Zewen;
Lin, Haichen;
Liu, Haodong;
He, Yang;
Zeng, Zhiyuan;
Zhang, Qiaobao

Publication type:

Article

Self‐Replication of Deeply Buried Doped Silicon Structures, which Remotely Control the Etching Process: A New Method for Forming a Silicon Pattern from the Bottom Up.

Published in:

Advanced Functional Materials, 2021, v. 31, n. 25, p. 1, doi. 10.1002/adfm.202100105

By:

Schutzeichel, Christopher;
Kiriy, Nataliya;
Kiriy, Anton;
Voit, Brigitte

Publication type:

Article

耐等离子体刻蚀涂层材料与制备工艺研究进展.

Published in:

Nonferrous Metals Engineering, 2024, v. 14, n. 12, p. 39, doi. 10.3969/j.issn.20951744.2024.12.005

By:

马凯;
田飞;
李长久;
李成新

Publication type:

Article

Study on Improving the Adhesion Performance of Aluminum Alloy by Rapid Etching Method.

Published in:

Nonferrous Metals Engineering, 2024, v. 14, n. 2, p. 17, doi. 10.3969/j.issn.2095-1744.2024.02.003

By:

LIANG Zhiyong;
HUANG Qirui;
CHENG Pengjun;
JIANG Huajing;
LUO Neng;
YI Yajian;
ZHANG Han;
BI Rengui;
LI Jian

Publication type:

Article

Effects of different acids and etching times on the bond strength of glass fiber-reinforced composite root canal posts to composite core material.

Published in:

Quintessence International, 2012, v. 43, n. 1, p. e1

By:

Güler, Ahmet Umut;
Kurt, Murat;
Duran, Ibrahim;
Uludamar, Altay;
Inan, Ozgur

Publication type:

Article

Recent Advances and Perspectives of Lewis Acidic Etching Route: An Emerging Preparation Strategy for MXenes.

Published in:

Nano-Micro Letters, 2023, v. 15, n. 1, p. 1, doi. 10.1007/s40820-023-01039-z

By:

Huang, Pengfei;
Han, Wei-Qiang

Publication type:

Article

Analyst and etching protocol effects on the reproducibility of apatite confined fission-track length measurement, and ambient-temperature annealing at decadal timescales.

Published in:

American Mineralogist, 2019, v. 104, n. 10, p. 1421, doi. 10.2138/am-2019-7046

By:

Tamer, Murat T.;
Chung, Ling;
Ketcham, Richard A.;
Gleadow, Andrew J.W.

Publication type:

Article

EFFECTS OF EDGE ROUGHNESS ON SURFACE CHARGING IN PLASMA ETCHING.

Published in:

Surface Review & Letters, 2023, v. 30, n. 11, p. 1, doi. 10.1142/S0218625X23500798

By:

ZHANG, PENG

Publication type:

Article