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Molecule-Level Multiscale Design of Nonflammable Gel Polymer Electrolyte to Build Stable SEI/CEI for Lithium Metal Battery.
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- Nano-Micro Letters, 2024, v. 17, n. 1, p. 1, doi. 10.1007/s40820-024-01508-z
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- Article
Interfacial reaction behavior in blast furnace and analysis of influence mechanism.
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- Metallurgical Research & Technology, 2024, v. 121, n. 5, p. 1, doi. 10.1051/metal/2024059
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- Article
Thin‐Layer Diamond Coating on Si Wafer for Extended Alkaline ATR‐SEIRAS Investigations<sup>†</sup>.
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- Chinese Journal of Chemistry, 2024, v. 42, n. 23, p. 3063, doi. 10.1002/cjoc.202400499
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Interface kinetic manipulation enabling efficient and reliable Mg<sub>3</sub>Sb<sub>2</sub> thermoelectrics.
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- Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-53598-3
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- Article
飢页岩浸出及离子分离过程界面溶液 化学反应基础理论研究.
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- Nonferrous Metals (Extractive Metallurgy), 2024, n. 11, p. 165, doi. 10.3969/j.issn.1007-7545.2024.11.014
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- Article
Influence of Al 2 O 3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints.
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- Crystals (2073-4352), 2024, v. 14, n. 10, p. 894, doi. 10.3390/cryst14100894
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First-Principles Study on the Influence of Crystal Structures on the Interface Properties of Graphene/Titanium Composites.
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- Coatings (2079-6412), 2024, v. 14, n. 10, p. 1293, doi. 10.3390/coatings14101293
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- Article
Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6471, doi. 10.1007/s11664-024-11360-x
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- Article
Effect of Sn Orientation on Electromigration Failure in CuSn Solders.
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- Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6424, doi. 10.1007/s11664-024-11301-8
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Recent Advances in Metal–Organic Framework Electrode Materials for all-Metal-Ion Batteries.
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- Journal of Electronic Materials, 2024, v. 53, n. 7, p. 3642, doi. 10.1007/s11664-024-11126-5
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Sodium Formate as a Highly Efficient Sodium Compensation Additive for Sodium-Ion Batteries with a P2-Type Layered Oxide Cathode.
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- Journal of Electronic Materials, 2024, v. 53, n. 4, p. 1964, doi. 10.1007/s11664-024-10938-9
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- Article
The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal Aging.
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- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1264, doi. 10.1007/s11664-023-10865-1
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Ni/GeTe Interfacial Reactions and Ni-Ge-Te Phase Equilibria.
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- Journal of Electronic Materials, 2023, v. 52, n. 12, p. 8019, doi. 10.1007/s11664-023-10714-1
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- Article
Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 4000, doi. 10.1007/s11664-023-10390-1
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Interfacial Reactions in Ni/Sb<sub>2</sub>Te<sub>3</sub> and Co<sub>0.2</sub>Ni<sub>0.8</sub>/Sb<sub>2</sub>Te<sub>3</sub> Couples.
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- Journal of Electronic Materials, 2023, v. 52, n. 6, p. 3685, doi. 10.1007/s11664-023-10332-x
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Structure, Dielectric Properties, and Grain Growth Kinetics of MO-ZrO<sub>2</sub>-Ta<sub>2</sub>O<sub>5</sub> (M = Zn, Co) Microwave Ceramics.
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- Journal of Electronic Materials, 2023, v. 52, n. 4, p. 2614, doi. 10.1007/s11664-023-10224-0
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- Article
Interfacial Reactions in Sn/Cu<sub>2</sub>Se Couples.
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- Journal of Electronic Materials, 2022, v. 51, n. 5, p. 2475, doi. 10.1007/s11664-022-09486-x
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- Article
Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process.
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- Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6575, doi. 10.1007/s11664-021-09253-4
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Interfacial Reactions in Ni/Se-Sn, Ni/Se-Te, Ni/Sn-Te and Ni/Se-Sn-Te Couples.
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- Journal of Electronic Materials, 2021, v. 50, n. 8, p. 4346, doi. 10.1007/s11664-021-08843-6
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Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Sputter Cu-Ti Alloy Film UBM.
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- Journal of Electronic Materials, 2021, v. 50, n. 6, p. 3692, doi. 10.1007/s11664-021-08925-5
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- Article
Interfacial Reactions in Lead-Free Solder/Cu-2.0Be (Alloy 25) Couples.
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- Journal of Electronic Materials, 2021, v. 50, n. 3, p. 903, doi. 10.1007/s11664-020-08693-8
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Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging.
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- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 249, doi. 10.1007/s11664-020-08523-x
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Interfacial Reactions in Ni/PbSe.
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- Journal of Electronic Materials, 2020, v. 49, n. 10, p. 6068, doi. 10.1007/s11664-020-08344-y
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- Article
Microstructural Characterization of Multilayer Metal Stack on InGaAs/InP Contact.
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- Journal of Electronic Materials, 2020, v. 49, n. 8, p. 4659, doi. 10.1007/s11664-020-08226-3
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- Article
Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 257, doi. 10.1007/s11664-019-07752-z
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- Article
Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 128, doi. 10.1007/s11664-019-07688-4
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- Article
Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 88, doi. 10.1007/s11664-019-07455-5
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- Article
Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples.
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- Journal of Electronic Materials, 2020, v. 49, n. 1, p. 173, doi. 10.1007/s11664-019-07454-6
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- Article
Wear Rate and Thermal Conductivity of a Copper-Plated Graphite Flake/Aluminum Composite.
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- Journal of Electronic Materials, 2019, v. 48, n. 11, p. 7585, doi. 10.1007/s11664-019-07546-3
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Co/(Ag-41.0 at.%Sb)<sub>1−x</sub>Co<sub>x</sub> and Ni/(Ag-41.0 at.%Sb)<sub>1−x</sub>Ni<sub>x</sub> Interfacial Reactions.
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- Journal of Electronic Materials, 2019, v. 48, n. 9, p. 5743, doi. 10.1007/s11664-019-07385-2
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Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions.
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- Journal of Electronic Materials, 2019, v. 48, n. 8, p. 4773, doi. 10.1007/s11664-019-07286-4
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- Article
Highly Stable Single Crystals of Three‐Dimensional Porous Oligomer Frameworks Synthesized under Kinetic Conditions.
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- Angewandte Chemie, 2021, v. 133, n. 26, p. 14785, doi. 10.1002/ange.202103729
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- Article
Strategies for Mitigating Dissolution of Solid Electrolyte Interphases in Sodium‐Ion Batteries.
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- Angewandte Chemie, 2021, v. 133, n. 9, p. 4905, doi. 10.1002/ange.202013803
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- Article
Carbon‐Nanoplated CoS@TiO<sub>2</sub> Nanofibrous Membrane: An Interface‐Engineered Heterojunction for High‐Efficiency Electrocatalytic Nitrogen Reduction.
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- Angewandte Chemie, 2019, v. 131, n. 52, p. 19079, doi. 10.1002/ange.201912733
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Anisotropically Electrochemical–Mechanical Evolution in Solid‐State Batteries and Interfacial Tailored Strategy.
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- Angewandte Chemie, 2019, v. 131, n. 51, p. 18820, doi. 10.1002/ange.201910993
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- Article
Effect of Femtosecond‐Laser‐Induced Surface Textures on the Microstructure and Mechanical Properties of Mg/Ti Dissimilar Alloys Laser Lap Welds: A Numerical and Experimental Study.
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- Advanced Engineering Materials, 2024, v. 26, n. 11, p. 1, doi. 10.1002/adem.202302203
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- Article
In Situ Investigation of Deformation Mechanisms Induced by Boron Nitride Nanotubes and Nanointerphases in Ti–6Al–4V Alloy.
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- Advanced Engineering Materials, 2022, v. 24, n. 12, p. 1, doi. 10.1002/adem.202200610
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Blackening Mechanism and Mechanical Properties Variation of Zirconia Ceramic Induced by Active Metal Brazing.
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- Advanced Engineering Materials, 2022, v. 24, n. 9, p. 1, doi. 10.1002/adem.202200105
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- Article
Interfacial Reactions in the Bonding Zones of Explosively Welded Tantalum to Stainless Steel Sheets.
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- Advanced Engineering Materials, 2021, v. 23, n. 11, p. 1, doi. 10.1002/adem.202001521
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Controlled Interfacial Reactions and Superior Mechanical Properties of High Energy Ball Milled/Spark Plasma Sintered Ti–6Al–4V–Graphene Composite.
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- Advanced Engineering Materials, 2021, v. 23, n. 6, p. 1, doi. 10.1002/adem.202001411
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Boron Nitride Nanotube–Reinforced Titanium Composite with Controlled Interfacial Reactions by Spark Plasma Sintering.
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- Advanced Engineering Materials, 2020, v. 22, n. 12, p. 1, doi. 10.1002/adem.202000702
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- Article
Microstructural Evolution and Mechanical Behavior of Cu/Nb Multilayer Composites Processed by Accumulative Roll Bonding.
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- Advanced Engineering Materials, 2020, v. 22, n. 1, p. N.PAG, doi. 10.1002/adem.201900702
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- Article
Tailoring Structural Energetics for Enhanced Reactivity of Nano‐Aluminum Particles Based Microspheres.
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- Advanced Engineering Materials, 2019, v. 21, n. 8, p. N.PAG, doi. 10.1002/adem.201900176
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- Article
What happens to the interfacial reaction between fluoropolymer and nano aluminum below 1000 ℃?
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- Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 16, p. 8657, doi. 10.1007/s10973-021-11101-w
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- Article
Kinetic study on preparation of substoichiometric tungsten oxide WO<sub>2.72</sub> via hydrogen reduction process.
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- Journal of Thermal Analysis & Calorimetry, 2019, v. 137, n. 2, p. 389, doi. 10.1007/s10973-018-7966-4
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An experimentally validated numerical model of interface advance of the lithium sulfate monohydrate dehydration reaction.
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- Journal of Thermal Analysis & Calorimetry, 2016, v. 124, n. 2, p. 1109, doi. 10.1007/s10973-015-5210-z
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Polylacitde nanocomposites with better crystallinity, conductivity, stiffness and toughness balance by cooperation of MWCNT and reactive core–shell modifier.
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- Journal of Polymer Research, 2022, v. 29, n. 12, p. 1, doi. 10.1007/s10965-022-03350-6
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Influence of reaction compatibilization on mechanical and barrier properties of poly(lactic acid)/ethylene–methyl acrylate-glycidyl methacrylate terpolymer films.
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- Journal of Polymer Research, 2022, v. 29, n. 3, p. 1, doi. 10.1007/s10965-022-02932-8
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Improving efficiency and reducing enzyme inactivation during lipase-mediated epoxidation of α-pinene in a double-phase reaction system.
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- Bioprocess & Biosystems Engineering, 2023, v. 46, n. 9, p. 1331, doi. 10.1007/s00449-023-02902-4
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Morphological and thermal characterization of an immiscible catalyzed polymer blends (PC/PET).
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- Polymers & Polymer Composites, 2021, v. 29, p. S937, doi. 10.1177/09673911211025234
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- Article