Works matching IS 03615235 AND DT 2018 AND VI 47 AND IP 4
1
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2507, doi. 10.1007/s11664-018-6067-2
- YUKINORI ODA;
- NAOKI FUKUMURO;
- SHINJI YAE
- Article
2
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2499, doi. 10.1007/s11664-017-6038-z
- ZHUO CHEN;
- WENYA TIAN;
- JUNHUI LI;
- WENHUI ZHU
- Article
3
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2488, doi. 10.1007/s11664-017-6042-3
- HASNINE, M.;
- TOLLA, B.;
- VAHORA, N.
- Article
4
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2479, doi. 10.1007/s11664-017-6032-5
- JING HAN;
- PENGHAO GU;
- LIMIN MA;
- FU GUO;
- JIANPING LIU
- Article
5
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2468, doi. 10.1007/s11664-017-6034-3
- YOUSUF, SALEEM;
- GUPTA, DINESH C.
- Article
6
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2461, doi. 10.1007/s11664-018-6081-4
- MANSOURI, S.;
- COSKUN, B.;
- MIR, L. E. L.;
- AL-SEHEMI, ABDULLAH G.;
- AL-GHAMDI, AHMED;
- YAKUPHANOGLU, F.
- Article
7
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2454, doi. 10.1007/s11664-018-6082-3
- GAO, F.;
- LENG, S. L.;
- ZHU, Z.;
- LI, X. J.;
- HU, X.;
- SONG, H. Z.
- Article
8
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2447, doi. 10.1007/s11664-018-6087-y
- BOUGHIAS, OUIZA;
- BELKAID, MOHAMMED SAID;
- ZIRMI, RACHID;
- TRIGAUD, THIERRY;
- RATIER, BERNARD;
- AYOUB, NOUH
- Article
9
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2439, doi. 10.1007/s11664-018-6079-y
- HELEN, S. J.;
- DEVADASON, SUGANTHI;
- HARIS, M.;
- MAHALINGAM, T.
- Article
10
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2429, doi. 10.1007/s11664-018-6074-3
- BASHIR, MOHAMED BASHIR ALI;
- SAID, SUHANA MOHD;
- SABRI, MOHD FAIZUL MOHD;
- YUZURU MIYAZAKI;
- SHNAWAH, DHAFER ABDULAMEER;
- MASANORI SHIMADA;
- SALLEH, MOHD FAIZ MOHD;
- MAHMOOD, MOHAMAD SYAFIE;
- SALIH, ETHAR YAHYA;
- FITRIANI, FITRIANI;
- ELSHEIKH, MOHAMED HAMID
- Article
11
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2417, doi. 10.1007/s11664-018-6077-0
- SANDEEP, K.;
- THOMAS, JIJIMON K.;
- SOLOMON, SAM
- Article
12
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2411, doi. 10.1007/s11664-018-6080-5
- RUOYUAN CHEN;
- JIJUN ZHOU;
- LIANG ZHENG;
- HUI ZHENG;
- PENG ZHENG;
- ZHIHUA YING;
- JIANGXIA DENG
- Article
13
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2402, doi. 10.1007/s11664-018-6072-5
- VALIDŽIĆEMAIL, IVANA L. J.;
- POPOVIĆ, MAJA;
- LOJPUR, VESNA;
- BUNDALESKI, NENAD;
- RAKOČEVIĆ, ZLATKO
- Article
14
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2394, doi. 10.1007/s11664-018-6063-6
- MITTAL, JAGJIWAN;
- KWANG-LUNG LIN
- Article
15
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2386, doi. 10.1007/s11664-017-6030-7
- FENGJUN CHUN;
- BINBIN ZHANG;
- WEN LI;
- HONGGANG LIU;
- WEN DENG;
- XIANG CHU;
- OSMAN, HANAN;
- HAITAO ZHANG;
- WEIQING YANG
- Article
16
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2378, doi. 10.1007/s11664-018-6071-6
- SRIKANTH, K. S.;
- PATEL, SATYANARAYAN;
- VAISH, RAHUL
- Article
17
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2374, doi. 10.1007/s11664-017-6053-0
- KAYA WEI;
- HOBBIS, DEAN;
- HSIN WANG;
- NOLAS, GEORGE S.
- Article
18
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2366, doi. 10.1007/s11664-018-6062-7
- BILLAH, MD MUKTADIR;
- QUANFANG CHEN
- Article
19
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2359, doi. 10.1007/s11664-017-6059-7
- RAHMAN, GUL;
- OH-SHIM JOO;
- SANG YOUN CHAE;
- SHAH, ANWAR-UL-HAQ ALI;
- MIAN, SHABEER AHMAD
- Article
20
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2348, doi. 10.1007/s11664-018-6069-0
- SHAKERZADEH, EHSAN;
- KAZEMIMOGHADAM, FATEMEH;
- ANOTA, ERNESTO CHIGO
- Article
21
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2337, doi. 10.1007/s11664-017-6058-8
- OTHMAN, NURUL AIDA FARHANA;
- MUHAMAD HATTA, SHARIFAH FATMADIANA WAN;
- SOIN, NORHAYATI
- Article
22
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2330, doi. 10.1007/s11664-017-6060-1
- NORIZAN, MOHD NATASHAH;
- YOSHINOBU MIYAZAKI;
- YUJI OHISHI;
- HIROAKI MUTA;
- KEN KUROSAKI;
- SHINSUKE YAMANAKA
- Article
23
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2322, doi. 10.1007/s11664-018-6066-3
- BÍRÓ, FERENC;
- HAJNAL, ZOLTÁN;
- DÜCSÖ, CSABA;
- BARSONY, ISTVÁN
- Article
24
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2316, doi. 10.1007/s11664-017-6056-x
- BUONYAVONG SENGTHONG;
- HO VAN TUYEN;
- NGUYEN THI THAI AN;
- PHAN VAN DO;
- NGUYEN THI QUY HAI;
- PHAM THI MINH CHAU;
- VU XUAN QUANG
- Article
25
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2306, doi. 10.1007/s11664-017-6039-y
- PATEL, NAGABHUSHAN;
- DIAS, SANDRA;
- KRUPANIDHI, S. B.
- Article
26
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2298, doi. 10.1007/s11664-017-6054-z
- ULLAH, M. IRFAN;
- HASANAIN, S. K.;
- HUSSAIN, SHAHZAD;
- USMAN, M.
- Article
27
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2290, doi. 10.1007/s11664-017-6045-0
- MORSHEDI, HOSEIN;
- NASERI, MOSAYEB;
- HANTEHZADEH, MOHAMMAD REZA;
- ELAHI, SEYED MOHAMMAD
- Article
28
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2277, doi. 10.1007/s11664-017-6051-2
- SALEEM, JUNAID;
- HOSSAIN, S. K. SAFDAR;
- AL-AHMED, AMIR;
- RAHMAN, ATEEQUR;
- MCKAY, GORDON;
- HOSSAIN, MOHAMMED M.
- Article
29
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2271, doi. 10.1007/s11664-017-6043-2
- AGARWAL, S.;
- HASEMAN, M. S.;
- LEEDY, K. D.;
- WINARSKI, D. J.;
- SAADATKIA, P.;
- DOYLE, E.;
- ZHANG, L.;
- DANG, T.;
- VASILYEV, V. S.;
- SELIM, F. A.
- Article
30
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2263, doi. 10.1007/s11664-017-6052-1
- DONGZHI ZHANG;
- CHUANXING JIANG;
- JUN TONG;
- XIAOQI ZONG;
- WEI HU
- Article
31
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2257, doi. 10.1007/s11664-017-6046-z
- Article
32
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2249, doi. 10.1007/s11664-017-6047-y
- Article
33
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2241, doi. 10.1007/s11664-017-6050-3
- XIAOFEI DONG;
- JIANPING XU;
- HUI YANG;
- XIAOSONG ZHANG;
- ZHAOJUN MO;
- SHAOBO SHI;
- LAN LI;
- SHOUGEN YIN
- Article
34
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2237, doi. 10.1007/s11664-017-6037-0
- AN, N. T. M.;
- LIEN, N. T. H.;
- HOANG, N. D.;
- HOA, D. Q.
- Article
35
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2230, doi. 10.1007/s11664-017-6044-1
- XIN YIN;
- YINGLI GUAN;
- LIXIN SONG;
- XUEYAO XIE;
- PINGFAN DU;
- JIE XIONG
- Article
36
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2225, doi. 10.1007/s11664-017-6035-2
- GHASEMI, A.;
- HASHEMINIASARI, M.;
- MASOUDPANAH, S. M.;
- SAFIZADE, B.
- Article
37
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2215, doi. 10.1007/s11664-017-6036-1
- VU DUC CHINH;
- BROGGI, ALESSANDRA;
- DI PALMA, LUCA;
- SCARSELLA, MARCO;
- SPERANZA, GIORGIO;
- VILARDI, GIORGIO;
- PHAM NAM THANG
- Article
38
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2209, doi. 10.1007/s11664-017-6033-4
- Article
39
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2198, doi. 10.1007/s11664-018-6076-1
- AMIR, MD.;
- TUNESI, MAWADA M.;
- SOOMRO, RAZIUM A.;
- BAYKAL, ABDÜLHADI;
- KALWAR, NAZAR H.
- Article
40
- Journal of Electronic Materials, 2018, v. 47, n. 4, p. 2193, doi. 10.1007/s11664-017-6049-9
- TAKAFUMI YAO;
- TOMOKI MATSUDA;
- TOMOKAZU SANO;
- CHIAKI MORIKAWA;
- ATSUSHI OHBUCHI;
- HISASHI YASHIRO;
- AKIO HIROSE
- Article