Works matching DE "MICROELECTRONIC packaging"

Results: 160

Chipmakers to compete with assembly houses for SiP.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 51
Publication type:: Article

System-on-a-chip challenged by stacked system-in-a-package technology*.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 48

By:

Asakura, Hiroshi

Publication type:

Article

Advanced IC packaging: Markets and trends.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 44

By:

Winkler, Sandra

Publication type:

Article

Wafer-level packaging gains momentum.

Published in:

Solid State Technology, 1999, v. 42, n. 4, p. 45

By:

Elenius, Peter

Publication type:

Article

Assembly & packaging challenges.

Published in:

Solid State Technology, 1998, v. 41, n. 3, p. 90

By:

Chi Shih Chang;
Bracken, Ronald C.;
Oscilowski, Alex

Publication type:

Article

Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5486, doi. 10.1007/s11664-024-11235-1

By:

Lebda, H. I.;
Habashy, D. M.;
Mousa, M. M.

Publication type:

Article

GOOD VIBRATIONS.

Published in:

Electronics Systems & Software, 2005, v. 3, n. 4, p. 40

By:

Collins, Luke

Publication type:

Article

Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18838, doi. 10.1007/s10854-019-02240-w

By:

Hammad, A. E.;
Ragab, M.

Publication type:

Article

Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8371, doi. 10.1007/s10854-018-8848-z

By:

Shi, Qi-Yuan;
Liu, Zhi-Quan;
Wu, Di;
Zhang, Hao;
Ni, Ding-Rui;
Suganuma, Katsuaki

Publication type:

Article

Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8116, doi. 10.1007/s10854-017-6518-1

By:

Sharma, Ashutosh;
Kumar, Santosh;
Jung, Do-Hyun;
Jung, Jae

Publication type:

Article

Effect of Pd distribution on Pd-plated Cu wire using different electronic flame off settings.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 6, p. 4613, doi. 10.1007/s10854-016-6099-4

By:

Cheng, Pi-Ying;
Lai, Po-Ying;
Ye, Zheng-Jie;
Hsieh, Cheng-Li;
Ye, Jiun-Ming

Publication type:

Article

Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 7183, doi. 10.1007/s10854-015-3343-2

By:

Jiu, Jinting;
Zhang, Hao;
Koga, Shunsuke;
Nagao, Shijo;
Izumi, Yasuha;
Suganuma, Katsuaki

Publication type:

Article

Modifying the mechanical properties of lead-free solder by adding iron and indium and using a lap joint test.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 9, p. 1739, doi. 10.1007/s10854-012-0656-2

By:

Fallahi, H.;
Nurulakmal, M.;
Fallahi, A.;
Abdullah, Jamaluddin

Publication type:

Article

Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 74, doi. 10.1007/s10854-008-9610-8

By:

Sekhar, V. N.;
Chai, T. C.;
Balakumar, S.;
Lu Shen;
Sinha, S. K.;
Tay, A. A. O.;
Seung Wook Yoon

Publication type:

Article

High-Strength Welding of Silica Glass Using Double-Pulse Femtosecond Laser under Non-Optical Contact Conditions.

Published in:

Photonics, 2024, v. 11, n. 10, p. 945, doi. 10.3390/photonics11100945

By:

Gao, Zheng;
He, Jiahua;
Jia, Xianshi;
Yi, Zhaoxi;
Li, Cheng;
Zhang, Shifu;
Wang, Cong;
Duan, Ji'an

Publication type:

Article

Evolution of Non-Conventional MOS Device Structures: A Review.

Published in:

IUP Journal of Telecommunications, 2018, v. 10, n. 2, p. 48

By:

Kaur, Navneet;
Rattan, Munish;
Gill, Sandeep Singh

Publication type:

Article

The fractal nature analysis by applying grain formations of SAC305/OSP Cu and SAC305-0.05Ni/OSP Cu solder joints for microelectronic packaging.

Published in:

Modern Physics Letters B, 2021, v. 35, n. 33, p. 1, doi. 10.1142/S0217984921504273

By:

Mitić, Vojislav V.;
Fleshman, Collin;
Duh, Jenq-Gong;
Ilić, Ivana D.;
Lazović, Goran

Publication type:

Article

Testing Mobile Memories.

Published in:

EE: Evaluation Engineering, 2005, v. 44, n. 9, p. 12

By:

Gusinow, Kurt

Publication type:

Article

Modelling and simulation for the investigation on the ultrasonic propagation mechanism in advanced microelectronic packages.

Published in:

Insight: Non-Destructive Testing & Condition Monitoring, 2024, v. 66, n. 7, p. 415, doi. 10.1784/insi.2024.66.7.415

By:

Yuan Chen;
Dengxue Liu;
Yuhui Fan;
Zhongyang Wang;
Xiang Wan;
Ming Dong

Publication type:

Article

Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging.

Published in:

Materials Science (0137-1339), 2007, v. 25, n. 1, p. 45

By:

Felba, J.;
Falat, T.;
Wymysłowski, A.

Publication type:

Article

Electromagnetic properties of Si-C-N based ceramics and composites.

Published in:: International Materials Reviews, 2014, v. 59, n. 6, p. 326, doi. 10.1179/1743280414Y.0000000037
Publication type:: Article

Experiments and analysis for accurate controlling of an ultra-microvolume adhesive droplet in dispensing.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 5/6, p. 2271, doi. 10.1007/s00170-023-12097-3

By:

Liu, Huifang;
Zhao, Dingrui;
Chen, Xi;
Chang, Yunlong;
Yu, Xingfu;
Li, An

Publication type:

Article

Materials Technology for Environmentally Green Micro-electronic Packaging.

Published in:

Intel Technology Journal, 2008, v. 12, n. 1, p. 1, doi. 10.1535/itj.1201.01

By:

Renavikar, Mukul P.;
Patel, Neha;
Dani, Ashay;
Wakharkar, Vijay;
Arrigotti, George;
Vasudevan, Vasu;
Bchir, Omar;
Alur, Amruthavalli P.;
Gurumurthy, Charan K.;
Stage, Roger W.

Publication type:

Article

Future Package Technologies for Wireless Communication Systems.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 353, doi. 10.1535/itj.0904.08

By:

Telesphor Kamgaing;
Kinya Ichikawa;
Xiang Yin Zeng;
Kyu-Pyung Hwang;
Yongki Min;
Jiro Kubota

Publication type:

Article

Advanced Fault Isolation and Failure Analysis Techniques for Future Package Technologies.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 337, doi. 10.1535/itj.0904.07

By:

Pacheco, Mario;
Zhiyong Wang;
Skoglund, Lars;
Yongmei Liu;
Medina, Ariel;
Raman, Arun;
Dias, Rajen;
Goyal, Deepak;
Ramanathan, Shriram

Publication type:

Article

Pentium® 4 Processor High-Volume Land-Grid-Array Technology: Challenges and Future Trends.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 325, doi. 10.1535/itj.0904.06

By:

Baldwin, Chris;
Byquist, Tod;
Combs, Chris;
Pandey, Vinayak;
Stone, Brent;
Viswanath, Ram;
Watwe, Abhay;
Wojewoda, Leigh

Publication type:

Article

Materials Technologies for Thermomechanical Management of Organic Packages.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 309, doi. 10.1535/itj.0904.05

By:

Wakharkar, Vijay;
Matayabas, Chris;
Lehman, Ed;
Manepalli, Rahul;
Renavikar, Mukul;
Jayaraman, Saikumar;
LeBonheur, Vassou

Publication type:

Article

Finding Solutions to the Challenges in Package Interconnect Reliability.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 297, doi. 10.1535/itj.0904.04

By:

Garner, Luke;
Sane, Sandeep;
Suh, Daewoong;
Byrne, Tiffany;
Dani, Ashay;
Martin, Ted;
Mello, Michael;
Patel, Mitesh;
Williams, Richard

Publication type:

Article

Advanced Package Technologies for High-Performance Systems.

Published in:

Intel Technology Journal, 2005, v. 9, n. 4, p. 259, doi. 10.1535/itj.0904.01

By:

Mallik, Debendra;
Radhakrishnan, Kaladhar;
Jiangqi He;
Chia-Pin Chiu;
Kamgaing, Telesphor;
Searls, Damion;
Jackson, James D.

Publication type:

Article

Emerging Directions For Packaging Technologies.

Published in:

Intel Technology Journal, 2002, v. 6, n. 2, p. 62

By:

Mahajan, Ravi;
Nair, Raj;
Wakharkar, Vijay;
Swan, Johanna;
Tang, John;
Vandentop, Gilroy

Publication type:

Article

Investigation of packaging adhesive properties by molecular dynamics and experiments.

Published in:

Journal of Applied Polymer Science, 2021, v. 138, n. 1, p. 1, doi. 10.1002/app.49613

By:

Cao, Kaicong;
Zhou, Wu;
Chen, Lili;
He, Jiangbo;
Zhan, Li;
Chen, Qing;
Yu, Huijun;
He, Xiaoping

Publication type:

Article

Effect of Carbon Nanotube on Microstructure and Hardness of Sn96.5Ag3.0Cu0.5 Solder for Microelectronic Packaging.

Published in:

International Review of Mechanical Engineering, 2021, v. 15, n. 7, p. 346, doi. 10.15866/ireme.v15i7.20148

By:

Fatihah, I. A.;
Omar, G.;
Hamid, H. A.;
Salim, M. A.

Publication type:

Article

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 10, p. 5503, doi. 10.1007/s11664-017-5591-9

By:

Haseeb, A.;
Arafat, M.;
Tay, S.;
Leong, Y.

Publication type:

Article

Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4421, doi. 10.1007/s11664-014-3375-z

By:

Elmer, John;
Li, Yan;
Barth, Holly;
Parkinson, Dilworth;
Pacheco, Mario;
Goyal, Deepak

Publication type:

Article

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 4, p. 947, doi. 10.1007/s11664-013-2967-3

By:

Siow, Kim

Publication type:

Article

Copper Wire Bonding Concerns and Best Practices.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1

By:

Chauhan, Preeti;
Zhong, Z.;
Pecht, Michael

Publication type:

Article

Critical Current Density for Inhibiting (Cu,Ni)Sn Formation on the Ni Side of Cu/Solder/Ni Joints.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2653, doi. 10.1007/s11664-010-1299-9

By:

Wu, W.;
Chung, H.;
Chen, B.;
Ho, C.

Publication type:

Article

Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 356, doi. 10.1007/s11664-008-0587-0

By:

Wei Zhou;
Lijuan Liu;
Baoling Li;
Qinggong Song;
Ping Wu

Publication type:

Article

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 365, doi. 10.1007/s11664-008-0555-8

By:

Made, Riko I.;
Gan, Chee Lip;
Yan, Li Ling;
Aibin Yu;
Yoon, Seung Wook;
Lau, John H.;
Chengkuo Lee

Publication type:

Article

Thermal Stability Study of Cu(MoN x ) Seed Layer on Barrierless Si.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3

By:

Chu, J.P.;
Lin, C.H.;
Leau, W.K.;
John, V.S.

Publication type:

Article

Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6

By:

Shih, T. I.;
Duh, J. G.

Publication type:

Article

Impression Creep Characterization of 90Pb-10Sn Microelectronic Solder Balls at Subsolvus and Supersolvus Temperatures.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1040, doi. 10.1007/s11664-005-0093-6

By:

Pan, D.;
Dutta, I.;
Jadhav, S. G.;
Raiser, G. F.;
Ma, S.

Publication type:

Article

Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5% Ag-0.5% Cu Solder and Cu Metallization in Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 143, doi. 10.1007/s11664-005-0225-z

By:

Islam, M. N.;
Sharif, Ahmed;
Chan, Y. C.

Publication type:

Article

Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09649-w

By:

Zhang, Zhen;
Li, Jinglong;
Liu, Tao;
Tian, Wenhuai;
Li, Zhipeng

Publication type:

Article

Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 35, p. 26190, doi. 10.1007/s10854-022-09305-3

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Interfacial reactions between pure indium solder and Au/Ni metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13143, doi. 10.1007/s10854-022-08253-2

By:

Huang, Li-Chi;
Zhang, Yan-Ping;
Chen, Chih-Ming;
Hung, Liang-Yih;
Wang, Yu-Po

Publication type:

Article

Solid-state diffusion studies of lead-free solders on gold and in polymer films.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7679, doi. 10.1007/s10854-022-07917-3

By:

Gupte, Omkar;
Murtagian, Gregorio;
Kathaperumal, Mohanalingam;
Tummala, Rao;
Smet, Vanessa

Publication type:

Article

Bubble formation and growth during Transient Liquid Phase Bonding in Cu/SnAg system for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 5, p. 2360, doi. 10.1007/s10854-021-07435-8

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Viscoplastic behavior of bulk solder material under cyclic loading and compression of spherical joint-scale granules.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20640, doi. 10.1007/s10854-021-06573-3

By:

He, Xu;
Wang, Shaobing;
Wang, Yuexing;
Liu, Lu;
Dong, Yawei;
Yao, Yao

Publication type:

Article

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6199, doi. 10.1007/s10854-021-05336-4

By:

El-Taher, A. M.;
Abd El Azeem, S. E.;
Ibrahiem, A. A.

Publication type:

Article