Substitutional Atom Influence on the Electronic and Transport Properties of MnSi.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 761, doi. 10.1007/s11664-013-2936-x
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2014 AND VI 43 AND IP 3
Results: 20
1
2
High Performance Bottom-Gate-Type Amorphous InGaZnO Flexible Transparent Thin-Film Transistors Deposited on PET Substrates at Low Temperature.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 780, doi. 10.1007/s11664-013-2957-5
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- Publication type:
- Article
3
Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 671, doi. 10.1007/s11664-013-2669-x
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- Publication type:
- Article
4
Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 648, doi. 10.1007/s11664-013-2662-4
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- Publication type:
- Article
5
Effects of Annealing Temperature on the Electric Properties of 0.94(NaBi)TiO-0.06BaTiO Ferroelectric Thin Film.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 724, doi. 10.1007/s11664-013-2912-5
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- Publication type:
- Article
6
Strong Enhancement of Near-Band-Edge Photoluminescence of ZnO Nanowires Decorated with Sputtered Metallic Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 740, doi. 10.1007/s11664-013-2924-1
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- Publication type:
- Article
7
p-on- n HgCdTe Infrared Focal-Plane Arrays: From Short-Wave to Very-Long-Wave Infrared.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 802, doi. 10.1007/s11664-013-2809-3
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- Publication type:
- Article
8
Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation's Element of a New Electronic Component.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 702, doi. 10.1007/s11664-013-2876-5
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- Publication type:
- Article
9
Local and Global Properties of a Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 658, doi. 10.1007/s11664-013-2666-0
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- Publication type:
- Article
10
Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 685, doi. 10.1007/s11664-013-2710-0
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- Publication type:
- Article
11
Thermal Conductivity Measurement of Low- k Dielectric Films: Effect of Porosity and Density.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 746, doi. 10.1007/s11664-013-2949-5
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- Publication type:
- Article
12
Investigation of Structural and Electrical Properties of B-Site Complex Ion (MgNb)-Modified High-Curie-Temperature BiFeO-BaTiO Ceramics.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 755, doi. 10.1007/s11664-013-2952-x
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- Publication type:
- Article
13
Structural, Dielectric, and Electrical Properties of BiFeWO Ceramic.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 732, doi. 10.1007/s11664-013-2923-2
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- Publication type:
- Article
14
Effects of Thickness and Annealing on Optoelectronic Properties of Electrodeposited ZnS Thin Films for Photonic Device Applications.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 791, doi. 10.1007/s11664-013-2943-y
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- Publication type:
- Article
15
Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 717, doi. 10.1007/s11664-013-2956-6
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- Publication type:
- Article
16
Reduction of Dislocation Density in HVPE-Grown GaN Epilayers by Using In Situ-Etched Porous Templates.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 786, doi. 10.1007/s11664-013-2920-5
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- Publication type:
- Article
17
3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 708, doi. 10.1007/s11664-013-2964-6
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- Publication type:
- Article
18
Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 774, doi. 10.1007/s11664-013-2953-9
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- Publication type:
- Article
19
SiC Die Attach for High-Temperature Applications.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 695, doi. 10.1007/s11664-013-2718-5
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- Publication type:
- Article
20
Structure-Diffusion Relationship of Magnetron-Sputtered WTi Barriers Used in Indium Interconnections.
- Published in:
- Journal of Electronic Materials, 2014, v. 43, n. 3, p. 641, doi. 10.1007/s11664-013-2843-1
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- Publication type:
- Article