Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 3
Results: 28
Development and Status of Cu Ball/Wedge Bonding in 2012.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 558, doi. 10.1007/s11664-012-2383-0
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- Article
Effect of Temperature Cycling on Conduction Mechanisms in CdTe Thin Films.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 389, doi. 10.1007/s11664-012-2344-7
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- Article
Improvements in the Sintering Behavior and Microwave Dielectric Properties of Geikielite-Type MgTiO Ceramics.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 445, doi. 10.1007/s11664-012-2349-2
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- Article
Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 470, doi. 10.1007/s11664-012-2343-8
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- Article
Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 372, doi. 10.1007/s11664-012-2366-1
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- Article
Dielectric Tunability of DNA Biopolymer Films with Varying Amounts of Hexadecyltrimethylammonium Chloride.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 463, doi. 10.1007/s11664-012-2347-4
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- Article
Effects of Sintering Temperature on Structure and Properties of 0.997(KNN-LS-BF)-0.003VO Lead-Free Piezoelectric Ceramics.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 458, doi. 10.1007/s11664-012-2346-5
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- Article
Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 537, doi. 10.1007/s11664-012-2385-y
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- Article
Phase, Microstructure, and Microwave Dielectric Properties of NaCaSrNbO ( x = 0 to 4) Ceramics.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 452, doi. 10.1007/s11664-012-2387-9
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- Article
Erratum to: Thermoelectric Energy Harvesting from Transient Ambient Temperature Gradients.
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- 2013
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- Correction Notice
Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 485, doi. 10.1007/s11664-012-2350-9
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- Article
Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 492, doi. 10.1007/s11664-012-2351-8
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- Article
Effects of Solvents in the Polyethylene Glycol Series on the Bonding of Copper Joints Using AgO Paste.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 507, doi. 10.1007/s11664-012-2354-5
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- Article
Electrical Characteristics of Thin-Film Transistors Fabricated Utilizing a UV/Ozone-Treated TiO Channel Layer.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 398, doi. 10.1007/s11664-012-2348-3
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- Article
Screen-Printable Silver Pastes with Nanosized Glass Frits for Silicon Solar Cells.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 410, doi. 10.1007/s11664-012-2378-x
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- Article
Diffusion Soldering of Pb-Doped GeTe Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 359, doi. 10.1007/s11664-012-2345-6
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- Article
Performance Enhancement of Crystalline Silicon Solar Cells by Coating with Luminescent Silicon Nanostructures.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 403, doi. 10.1007/s11664-012-2369-y
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- Article
Comparison of the Microwave Performance of Transparent Wire Monopole Antennas Based on Silver Films.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 552, doi. 10.1007/s11664-012-2338-5
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- Article
Cu-Cu Hermetic Seal Enhancement Using Self-Assembled Monolayer Passivation.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 502, doi. 10.1007/s11664-012-2353-6
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- Article
Enhanced Thermoelectric Properties of (PbTe)(PbS) Composites by Sb Doping.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 366, doi. 10.1007/s11664-012-2352-7
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- Article
Creation of YbO Nanoprecipitates Through an Oxidation Process in Bulk Yb-Filled Skutterudites.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 382, doi. 10.1007/s11664-012-2370-5
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- Article
Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 545, doi. 10.1007/s11664-012-2381-2
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- Article
Enhancing the Ductility of Sn-Ag-Cu Lead-Free Solder Joints by Addition of Compliant Intermetallics.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 527, doi. 10.1007/s11664-012-2386-x
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- Article
Thermal Conductivity and ZT in Disordered Organic Thermoelectrics.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 355, doi. 10.1007/s11664-012-2374-1
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- Article
The Role of the Nickel Catalyst and Its Chemical and Structural Evolution During Carbon Nanopearl Growth.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 417, doi. 10.1007/s11664-012-2367-0
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- Article
Band Profile Comparison of the Cubic Perovskites CaCoO and SrCoO.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 438, doi. 10.1007/s11664-012-2377-y
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- Article
Electrical and Pyroelectric Properties of KPbGdWTiNbO Ferroelectrics.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 426, doi. 10.1007/s11664-012-2376-z
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- Article
Mechanisms of Creep Deformation in Pure Sn Solder Joints.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 516, doi. 10.1007/s11664-012-2380-3
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- Article