Works matching IS 03615235 AND DT 2013 AND VI 42 AND IP 3
1
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 558, doi. 10.1007/s11664-012-2383-0
- Schneider-Ramelow, Martin;
- Geißler, Ute;
- Schmitz, Stefan;
- Grübl, Wolfgang;
- Schuch, Bernhard
- Article
2
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 389, doi. 10.1007/s11664-012-2344-7
- Srivastav, V.;
- Pal, R.;
- Saini, N.;
- Saxena, R.;
- Bhan, R.;
- Sareen, L.;
- Singh, K.;
- Sharma, R.;
- Venkataraman, V.
- Article
3
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 445, doi. 10.1007/s11664-012-2349-2
- Wu, H.;
- Jiang, Y.;
- Cui, Y.;
- Zhang, X.;
- Jia, X.;
- Yue, Y.
- Article
4
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 470, doi. 10.1007/s11664-012-2343-8
- Shnawah, Dhafer;
- Sabri, Mohd;
- Badruddin, Irfan;
- Said, Suhana;
- Ariga, Tadashi;
- Che, Fa
- Article
5
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 372, doi. 10.1007/s11664-012-2366-1
- Barako, M.;
- Park, W.;
- Marconnet, A.;
- Asheghi, M.;
- Goodson, K.
- Article
6
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 463, doi. 10.1007/s11664-012-2347-4
- Aga, Roberto;
- Telek, Brian;
- Lombardi, Jack;
- Heckman, Emily;
- Bartsch, Carrie
- Article
7
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 458, doi. 10.1007/s11664-012-2346-5
- Wang, Hua;
- Zhai, Xia;
- Xu, Jiwen;
- Yuan, Changlai;
- Zhou, Changrong;
- Liu, Xinyu
- Article
8
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 537, doi. 10.1007/s11664-012-2385-y
- Agyakwa, P.A.;
- Marques, V.M.F.;
- Corfield, M.R.;
- Li, J.F.;
- Yang, L.;
- Johnson, C.M.
- Article
9
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 452, doi. 10.1007/s11664-012-2387-9
- Article
10
- 2013
- Moser, André;
- Erd, Metin;
- Kostic, Milos;
- Cobry, Keith;
- Kroener, Michael;
- Reindl, Leonhard;
- Woias, Peter
- Correction Notice
11
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 485, doi. 10.1007/s11664-012-2350-9
- Chidambaram, Vivek;
- Ling, Xie;
- Bangtao, Chen
- Article
12
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 492, doi. 10.1007/s11664-012-2351-8
- Sadiq, Muhammad;
- Pesci, Raphaël;
- Cherkaoui, Mohammed
- Article
13
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 507, doi. 10.1007/s11664-012-2354-5
- Takata, Shinya;
- Ogura, Tomo;
- Ide, Eiichi;
- Morita, Toshiaki;
- Hirose, Akio
- Article
14
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 398, doi. 10.1007/s11664-012-2348-3
- Article
15
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 410, doi. 10.1007/s11664-012-2378-x
- Shih, Yu-Chou;
- Lin, Yeong-Her;
- You, Jiun-Pyng;
- Shi, Frank
- Article
16
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 359, doi. 10.1007/s11664-012-2345-6
- Yang, C.L.;
- Lai, H.J.;
- Hwang, J.D.;
- Chuang, T.H.
- Article
17
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 403, doi. 10.1007/s11664-012-2369-y
- Basu, Tuhin;
- Ray, Mallar;
- Bandyopadhyay, Nil;
- Pramanick, Ashit;
- Hossain, Syed
- Article
18
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 552, doi. 10.1007/s11664-012-2338-5
- Hautcoeur, J.;
- Castel, X.;
- Colombel, F.;
- Himdi, M.;
- Motta Cruz, E.
- Article
19
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 502, doi. 10.1007/s11664-012-2353-6
- Lim, D.;
- Fan, J.;
- Peng, L.;
- Leong, K.;
- Tan, C.
- Article
20
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 366, doi. 10.1007/s11664-012-2352-7
- Li, J.Q.;
- Li, X.X.;
- Liu, F.S.;
- Ao, W.Q.;
- Li, H.T.
- Article
21
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 382, doi. 10.1007/s11664-012-2370-5
- Ding, Juan;
- Gu, Hui;
- Qiu, Pengfei;
- Chen, Xihong;
- Xiong, Zhen;
- Zheng, Qiang;
- Shi, Xun;
- Chen, Lidong
- Article
22
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 545, doi. 10.1007/s11664-012-2381-2
- Chuang, Tung-Han;
- Wang, Hsi-Ching;
- Chuang, Chien-Hsun;
- Lee, Jun-Der;
- Tsai, Hsing-Hua
- Article
23
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 527, doi. 10.1007/s11664-012-2386-x
- Article
24
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 355, doi. 10.1007/s11664-012-2374-1
- Article
25
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 417, doi. 10.1007/s11664-012-2367-0
- Pacley, S.;
- Mitchel, W.;
- Murray, P.;
- Anderson, D.;
- Smith, H.;
- Beck-Millerton, E.;
- Voevodin, A.
- Article
26
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 438, doi. 10.1007/s11664-012-2377-y
- Ali, Zahid;
- Ahmad, Iftikhar
- Article
27
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 426, doi. 10.1007/s11664-012-2376-z
- Padhee, R.;
- Das, Piyush;
- Parida, B.N.;
- Choudhary, R.N.P.
- Article
28
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 516, doi. 10.1007/s11664-012-2380-3
- Lee, K.;
- Morris, J.;
- Hua, Fay
- Article