Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 412, doi. 10.1007/s11664-011-1806-7
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- Article
Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 2
Results: 22
1
2
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV).
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 322, doi. 10.1007/s11664-011-1726-6
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- Article
3
Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 253, doi. 10.1007/s11664-011-1732-8
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- Article
4
Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 224, doi. 10.1007/s11664-011-1744-4
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- Article
5
Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 313, doi. 10.1007/s11664-011-1765-z
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- Article
6
Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on CuSn Voiding.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 302, doi. 10.1007/s11664-011-1764-0
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- Article
7
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 241, doi. 10.1007/s11664-011-1762-2
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- Article
8
Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 390, doi. 10.1007/s11664-011-1763-1
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- Article
9
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates: I. Effects of Loading and Processing Conditions.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 375, doi. 10.1007/s11664-011-1769-8
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- Publication type:
- Article
10
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 273, doi. 10.1007/s11664-011-1775-x
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- Article
11
Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 232, doi. 10.1007/s11664-011-1767-x
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- Article
12
Creep Behavior of Bi-Containing Lead-Free Solder Alloys.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 190, doi. 10.1007/s11664-011-1748-0
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- Article
13
In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 262, doi. 10.1007/s11664-011-1785-8
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- Article
14
Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 362, doi. 10.1007/s11664-011-1756-0
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- Article
15
The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 283, doi. 10.1007/s11664-011-1811-x
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- Article
16
Whisker Formation Induced by Component and Assembly Ionic Contamination.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 204, doi. 10.1007/s11664-011-1808-5
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- Article
17
Finite-Element Analysis of Current-Induced Thermal Stress in a Conducting Sphere.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 352, doi. 10.1007/s11664-011-1817-4
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- Article
18
The Effect of Random Voids in the Modified Gurson Model.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 177, doi. 10.1007/s11664-011-1816-5
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- Article
19
Martensitic Transformation in Sn-Rich SnIn Solder Joints.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 336, doi. 10.1007/s11664-011-1818-3
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- Article
20
A Model for Rapid Tin Whisker Growth on the Surface of ErSn Phase.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 184, doi. 10.1007/s11664-011-1820-9
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- Article
21
Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 398, doi. 10.1007/s11664-011-1804-9
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- Publication type:
- Article
22
Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique.
- Published in:
- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 425, doi. 10.1007/s11664-011-1837-0
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- Publication type:
- Article