Works matching IS 03615235 AND DT 2012 AND VI 41 AND IP 1

Results: 20

Interfacial Reactions in Sn/Fe- xNi Couples.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 144, doi. 10.1007/s11664-011-1727-5

By:

Yen, Yee-Wen;
Hsiao, Hsien-Ming;
Lin, Shih-Wei;
Huang, Pin-Ju;
Lee, Chiapyng

Publication type:

Article

Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu- xPd System.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 2, doi. 10.1007/s11664-011-1710-1

By:

Ho, C.;
Hsu, L.;
Lin, S.;
Rahman, M.

Publication type:

Article

Solid-Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 11, doi. 10.1007/s11664-011-1722-x

By:

Ho, C.;
Wu, W.;
Hsu, L.;
Lin, C.

Publication type:

Article

Phase Equilibria of the Sn-Bi-Te Ternary System.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 22, doi. 10.1007/s11664-011-1730-x

By:

Chiu, Chen-nan;
Hsu, Chia-ming;
Chen, Sinn-wen;
Wu, Hsin-jay

Publication type:

Article

Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 32, doi. 10.1007/s11664-011-1733-7

By:

Hashiba, M.;
Shinmei, W.;
Kajihara, M.

Publication type:

Article

Fast Concurrent Growth of NiSn and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 44, doi. 10.1007/s11664-011-1736-4

By:

Chung, Bo-Mook;
Choi, Jaeho;
Huh, Joo-Youl

Publication type:

Article

Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 153, doi. 10.1007/s11664-011-1740-8

By:

Lin, T.Y.;
Liao, C.N.;
Wu, Albert

Publication type:

Article

A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 115, doi. 10.1007/s11664-011-1761-3

By:

Jung, Inyu;
Jo, Yun;
Kim, Inyoung;
Lee, Hyuck

Publication type:

Article

A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 60, doi. 10.1007/s11664-011-1751-5

By:

Oh, Minsub;
Jeon, Seong-jae;
Jeon, Haseok;
Hyun, Seungmin;
Lee, Hoo-jeong

Publication type:

Article

Optical Properties and Durability of AlO-NiP/Al Solar Absorbers Prepared by Electroless Nickel Composite Plating.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 53, doi. 10.1007/s11664-011-1746-2

By:

Tsai, T.;
Hsueh, S.;
Lee, J.;
Fang, J.

Publication type:

Article

The Transparent Conductive Properties of Manganese-Doped Zinc Oxide Films Deposited by Chemical Bath Deposition.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 122, doi. 10.1007/s11664-011-1770-2

By:

Fang, J.S.;
Luo, W.H.;
Hsu, C.H.;
Yang, J.C.;
Tsai, T.K.

Publication type:

Article

Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 130, doi. 10.1007/s11664-011-1772-0

By:

Lu, C.;
Huang, T.S.;
Cheng, C.H.;
Tseng, H.W.;
Liu, C.Y.

Publication type:

Article

Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 86, doi. 10.1007/s11664-011-1757-z

By:

Gierlotka, Wojciech

Publication type:

Article

Foreword.

Published in:: Journal of Electronic Materials, 2012, v. 41, n. 1, p. 1, doi. 10.1007/s11664-011-1777-8
Publication type:: Article

A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 109, doi. 10.1007/s11664-011-1759-x

By:

Lee, Byunghoon;
Jeon, Haseok;
Jeon, Seong-Jae;
Kwon, Kee-Won;
Lee, Hoo-Jeong

Publication type:

Article

The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 67, doi. 10.1007/s11664-011-1752-4

By:

Li, D.;
Delsante, S.;
Watson, A.;
Borzone, G.

Publication type:

Article

Elucidating the Metal-Induced Crystallization and Diffusion Behavior of Al/a-Ge Thin Films.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 159, doi. 10.1007/s11664-011-1796-5

By:

Yeh, Chao-Nan;
Yang, Kewin;
Lee, Hsin-Yi;
Wu, Albert

Publication type:

Article

Low-Resistivity Ru-Ta-C Barriers for Cu Interconnects.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 138, doi. 10.1007/s11664-011-1797-4

By:

Fang, J.S.;
Lin, J.H.;
Chen, B.Y.;
Chen, G.S.;
Chin, T.S.

Publication type:

Article

Ni Interdiffusion Coefficient and Activation Energy in CuSn.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 172, doi. 10.1007/s11664-011-1821-8

By:

Huang, Kuan-Chih;
Shieu, Fuh-Sheng;
Hsiao, Y.;
Liu, C.

Publication type:

Article

Conductor Formation Through Phase Transformation in Ti-Oxide Thin Films.

Published in:

Journal of Electronic Materials, 2012, v. 41, n. 1, p. 166, doi. 10.1007/s11664-011-1822-7

By:

Liu, Y.;
Lin, Y.;
Wei, Y.;
Liu, C.

Publication type:

Article