Found: 16
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Electrical Conductivity of Parylene F at High Temperature.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 295, doi. 10.1007/s11664-010-1414-y
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- Article
Local Piezoelectricity and Polarity Distribution of Preferred c-Axis-Oriented ZnO Film Investigated by Piezoresponse Force Microscopy.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 253, doi. 10.1007/s11664-010-1415-x
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- Article
Dielectric Properties and Microstructure of MgO-TiO-ZnO-CaO Ceramics.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 355, doi. 10.1007/s11664-010-1478-8
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- Article
Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn- xAg/Cu Joints.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 315, doi. 10.1007/s11664-010-1459-y
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- Article
Laser Direct Writing of Conductive Silver Film on Polyimide Surface from Decomposition of Organometallic Ink.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 301, doi. 10.1007/s11664-010-1418-7
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- Article
Study of the Formation Mechanism of Cu/Ge/Pd Ohmic Contact to n-Type InGaAs.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 289, doi. 10.1007/s11664-010-1410-2
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- Article
Tailoring the Structural and Optoelectronic Properties of Al-Doped Nanocrystalline ZnO Thin Films.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 259, doi. 10.1007/s11664-010-1428-5
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- Article
Interfacial Reactions of Sn-3.5Ag- xZn Solders and Cu Substrate During Liquid-State Aging.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 306, doi. 10.1007/s11664-010-1445-4
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- Article
Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 324, doi. 10.1007/s11664-010-1460-5
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- Article
An Investigation of Diffusion Barrier Characteristics of an Electroless Co(W,P) Layer to Lead-Free SnBi Solder.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 330, doi. 10.1007/s11664-010-1488-6
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- Article
Preparation of BiNdFeO Nanotube Arrays by a Sol-Gel Template Method.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 340, doi. 10.1007/s11664-010-1495-7
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- Article
The Influence of Film Thickness on the Transparency and Conductivity of Al-Doped ZnO Thin Films Fabricated by Ion-Beam Sputtering.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 267, doi. 10.1007/s11664-010-1503-y
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- Article
Point Defects in CdZnTe Crystals Grown by Different Techniques.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 274, doi. 10.1007/s11664-010-1504-x
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- Article
The Distribution Tail of LWIR HgCdTe-on-Si FPAs: a Hypothetical Physical Mechanism.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 280, doi. 10.1007/s11664-010-1505-9
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- Article
Fabrication of Metal-Oxide-Diamond Field-Effect Transistors with Submicron-Sized Gate Length on Boron-Doped (111) H-Terminated Surfaces Using Electron Beam Evaporated SiO and AlO.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 247, doi. 10.1007/s11664-010-1500-1
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- Article
Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition.
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- Journal of Electronic Materials, 2011, v. 40, n. 3, p. 344, doi. 10.1007/s11664-011-1510-7
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- Article