Works matching IS 03615235 AND DT 2011 AND VI 40 AND IP 2
1
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 141, doi. 10.1007/s11664-010-1417-8
- Tang, Hailong;
- Zhong, Jiachun;
- Yang, Jian;
- Ma, Zhen;
- Liu, Xiaobo
- Article
2
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 189, doi. 10.1007/s11664-010-1433-8
- Zhou, M.;
- Ma, X.;
- Zhang, X.
- Article
3
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 213, doi. 10.1007/s11664-010-1447-2
- Kumar, Aditya;
- Chen, Zhong
- Article
4
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 195, doi. 10.1007/s11664-010-1425-8
- ÇadIrlI, E.;
- Böyük, U.;
- Kaya, H.;
- Maraşli, N.;
- Aksöz, S.;
- Ocak, Y.
- Article
5
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 109, doi. 10.1007/s11664-010-1422-y
- Zhang, Zhenli;
- Chatterjee, Alok;
- Grein, Christoph;
- Ciani, Anthony;
- Chung, Peter
- Article
6
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 127, doi. 10.1007/s11664-010-1420-0
- Wunderlich, Wilfried;
- Fujiwara, Hiroyuki
- Article
7
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 232, doi. 10.1007/s11664-010-1421-z
- Kim, Sun-Sik;
- Kim, Keun-Soo;
- Lee, KiJu;
- Kim, Seongjun;
- Suganuma, Katsuaki;
- Tanaka, Hirokazu
- Article
8
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 224, doi. 10.1007/s11664-010-1423-x
- Noh, Bo-In;
- Yoon, Jeong-Won;
- Ha, Sang-Ok;
- Jung, Seung-Boo
- Article
9
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 239, doi. 10.1007/s11664-010-1439-2
- Geissler, Ute;
- Funck, Jürgen;
- Schneider-Ramelow, Martin;
- Engelmann, Hans-Jürgen;
- Rooch, Ingrid;
- Müller, Wolfgang;
- Reichl, Herbert
- Article
10
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 176, doi. 10.1007/s11664-010-1430-y
- Yang, Ming;
- Li, Mingyu;
- Wang, Ling;
- Fu, Yonggao;
- Kim, Jongmyung;
- Weng, Lvqian
- Article
11
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 122, doi. 10.1007/s11664-010-1431-x
- Dhage, Sanjay;
- Kim, Hak-Sung;
- Hahn, H.
- Article
12
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 103, doi. 10.1007/s11664-010-1432-9
- Wei, J.;
- Barnes, J.;
- Guha, S.;
- Gonzalez, L.;
- Yeo, Y.;
- Hengehold, R.;
- Rajagopalan, G.
- Article
13
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 134, doi. 10.1007/s11664-010-1443-6
- Article
14
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 165, doi. 10.1007/s11664-010-1441-8
- Li, G.;
- Bi, X.;
- Chen, Q.;
- Shi, X.
- Article
15
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 157, doi. 10.1007/s11664-010-1440-9
- Tunç, Tuncay;
- Altındal, Şemsettin;
- Dökme, İlbilge;
- Uslu, Habibe
- Article
16
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 201, doi. 10.1007/s11664-010-1438-3
- Elmer, John;
- Specht, Eliot
- Article
17
- Journal of Electronic Materials, 2011, v. 40, n. 2, p. 149, doi. 10.1007/s11664-010-1448-1
- Pokhrel, B.;
- Kamrupi, I.;
- Maiti, J.;
- Adhikari, B.;
- Dolui, S.
- Article