Works matching DE "COPPER diffusion rate"

Results: 24

The formation and evolution of intermetallic compounds formed between Sn–Ag–Zn–In lead-free solder and Ni/Cu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 675, doi. 10.1007/s10854-008-9785-z

By:

Xu, R. L.;
Liu, Y. C.;
Han, Y. J.;
Wei, C.;
Wang, X.;
Yu, L. M.

Publication type:

Article

Erratum to: Copper diffusion in cable-insulating materials by chemiluminescence and DSC techniques.

Published in:

2016

By:

Jipa, Silviu;
Setnescu, Radu;
Zaharescu, Traian;
Setnescu, Tanta;
Gorghiu, Laura;
Băncuţă, Iulian;
Chelărescu, Elena

Publication type:

Erratum

Co-W nanocrystalline electrodeposits as barrier for interconnects.

Published in:

Journal of Solid State Electrochemistry, 2014, v. 18, n. 11, p. 3057, doi. 10.1007/s10008-014-2488-x

By:

Tsyntsaru, N.;
Kaziukaitis, G.;
Yang, C.;
Cesiulis, H.;
Philipsen, H.;
Lelis, M.;
Celis, J.-P.

Publication type:

Article

Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure.

Published in:

Journal of Materials Science, 2001, v. 36, n. 23, p. 5705, doi. 10.1023/A:1012590305144

By:

Khin Maung Latt;
Sher-Yi, C.;
Osipowicz, T.;
Lee, K.;
Lee, Y. K.

Publication type:

Article

Investigation of Cu Diffusivity in Fe by a Combination of Atom Probe Experiments and Kinetic Monte Carlo Simulation.

Published in:

Materials Transactions, 2021, v. 62, n. 7, p. 929, doi. 10.2320/matertrans.MT-M2021028

By:

Can Zhao;
Tomoaki Suzudo;
Takeshi Toyama;
Shigeto Nishitani;
Koji Inoue;
Yasuyoshi Nagai

Publication type:

Article

LOW STRESS TaN THIN FILM DEVELOPMENT FOR MEMS/SENSOR ELECTRODE APPLICATION.

Published in:

Journal of Circuits, Systems & Computers, 2013, v. 22, n. 9, p. 1, doi. 10.1142/S0218126613400173

By:

XIAOXU KANG;
QINGYUN ZUO;
CHAO YUAN;
SHOUMIAN CHEN;
YUHANG ZHAO

Publication type:

Article

A Method for the Estimation of the Interface Temperature in Ultrasonic Joining.

Published in:

Metallurgical & Materials Transactions. Part A, 2014, v. 45, n. 5, p. 2545, doi. 10.1007/s11661-014-2203-7

By:

Hu, Tianyu;
Zhalehpour, Soheil;
Gouldstone, Andrew;
Muftu, Sinan;
Ando, Teiichi

Publication type:

Article

Discussion of “The Development of the Concept of Vacancy-Mediated Substitutional Diffusion: The Important Contribution from Fredrick Seitz”.

Published in:

Metallurgical & Materials Transactions. Part A, 2013, v. 44, n. 12, p. 5622, doi. 10.1007/s11661-013-1922-5

By:

Paul, Aloke

Publication type:

Article

Microstructure evolution and elemental diffusion of SiCp/Al-Cu-Mg composites prepared from elemental powder during hot pressing.

Published in:

Journal of Materials Science, 2011, v. 46, n. 21, p. 6783, doi. 10.1007/s10853-011-5636-z

By:

Zhang, Q.;
Xiao, B. L.;
Liu, Z. Y.;
Ma, Z. Y.

Publication type:

Article

Influence of light on interstitial copper inp-type silicon.

Published in:

Applied Physics A: Materials Science & Processing, 2005, v. 80, n. 2, p. 201, doi. 10.1007/s00339-004-3038-7

By:

Belayachi, A.;
Heiser, T.;
Schunck, J. P.;
Kempf, A.

Publication type:

Article

Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs.

Published in:

Materials (1996-1944), 2016, v. 9, n. 8, p. 623, doi. 10.3390/ma9080623

By:

Shiben Hu;
Zhiqiang Fang;
Honglong Ning;
Ruiqiang Tao;
Xianzhe Liu;
Yong Zeng;
Rihui Yao;
Fuxiang Huang;
Zhengcao Li;
Miao Xu;
Lei Wang;
Linfeng Lan;
Junbiao Peng

Publication type:

Article

Rapid Na, Cu exchange between synthetic fluid inclusions and external aqueous solutions: evidence from LA-ICP-MS analysis.

Published in:

Geofluids, 2009, v. 9, n. 4, p. 321, doi. 10.1111/j.1468-8123.2009.00255.x

By:

LI, Y.;
AUDÉTAT, A.;
LERCHBAUMER, L.;
XIONG, X. L.

Publication type:

Article

A study of dynamical evolution of small two-dimensional Copper islands' diffusion on Ag(111) surface and observed surface effects.

Published in:

Modern Physics Letters B, 2017, v. 31, n. 33, p. -1, doi. 10.1142/S021798491750316X

By:

Hayat, Sardar Sikandar;
Rehman, Zakirur;
Shah, Zulfiqar Ali

Publication type:

Article

Ehrlich-Schwöbel barriers and adsorption of Au, Cu and Ag stepped (100) surfaces.

Published in:

Modern Physics Letters B, 2017, v. 31, n. 5, p. -1, doi. 10.1142/S0217984917500373

By:

Benlattar, M.;
Elkoraychy, E.;
Sbiaai, K.;
Mazroui, M.;
Boughaleb, Y.

Publication type:

Article

Phase diagram of Au-Al-Cu at 500 °C.

Published in:

Gold Bulletin, 2014, v. 47, n. 3, p. 167, doi. 10.1007/s13404-014-0140-2

By:

Li, Jyun;
Lo, Pei;
Ho, Ming;
Hsieh, Ker-Chang

Publication type:

Article

Cu redistribution during sintering of Fe-2Cu and Fe-2Cu-0·5C compacts.

Published in:

Powder Metallurgy, 2014, v. 57, n. 5, p. 373, doi. 10.1179/1743290114Y.0000000085

By:

Tahir, A. M.;
Amberg, G.;
Hedström, P.;
Bergman, O.;
Frisk, K.

Publication type:

Article

Stabilization of Oxidized Copper Nanoclusters in Confined Spaces.

Published in:

Topics in Catalysis, 2018, v. 61, n. 5/6, p. 419, doi. 10.1007/s11244-017-0879-9

By:

Akter, Nusnin;
Wang, Mengen;
Zhong, Jian-Qiang;
Liu, Zongyuan;
Kim, Taejin;
Lu, Deyu;
Boscoboinik, J. Anibal;
Stacchiola, Dario J.

Publication type:

Article

Antibacterial Activity of Cu Nanoparticles against E. coli, Staphylococcus aureus and Pseudomonas aeruginosa.

Published in:

Nano Biomedicine & Engineering, 2017, v. 9, n. 1, p. 9, doi. 10.5101/nbe.v9i1.p9-14

By:

Yadav, Lalit;
Tripathi, Ravi Mani;
Prasad, Ram;
Pudake, Ramesh Namdeo;
Mittal, Jagjiwan

Publication type:

Article

Mechanism of Copper Diffusion over the Si(110) Surface.

Published in:

Semiconductors, 2002, v. 36, n. 9, p. 958, doi. 10.1134/1.1507271

By:

Dolbak, A. E.;
Zhachuk, R. A.;
Olshanetsky, B. Z.

Publication type:

Article

Failure Analysis of Cracks Formed at Extrados of Bend Pipe of API 5L X65M Grade.

Published in:

Journal of Failure Analysis & Prevention, 2013, v. 13, n. 5, p. 531, doi. 10.1007/s11668-013-9721-2

By:

Shant, J.;
Pandey, Bijay;
Goyal, Rajesh;
Kathayat, T.

Publication type:

Article

Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 1, p. 602, doi. 10.1007/s11664-016-4957-8

By:

Mittal, Jagjiwan;
Lin, Kwang-Lung

Publication type:

Article

Growth Mechanism of a Ternary (Cu,Ni)Sn Compound at the Sn(Cu)/Ni(P) Interface.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2382, doi. 10.1007/s11664-010-1339-5

By:

Huang, T.;
Tseng, H.;
Lu, C.;
Hsiao, Y.;
Chuang, Y.;
Liu, C.

Publication type:

Article

Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg<sub>3.0</sub>Cu<sub>0.5</sub>/Cu Joints: Experimental and First-Principles Study.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 866, doi. 10.1007/s11664-009-0760-0

By:

Wei Zhou;
Lijuan Liu;
Baoling Li;
Ping Wu

Publication type:

Article

The Effect of Intermetallic Compound Morphology on Cu Diffusion in Sn-Ag and Sn-Pb Solder Bump on the Ni/Cu Under-Bump Metallization.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 1, p. 68, doi. 10.1007/s11664-005-0182-6

By:

Guh-Yaw Jang;
Jenq-Gong Duh

Publication type:

Article