Interfacial Reaction of Sn and Cu- xZn Substrates After Reflow and Thermal Aging.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 230, doi. 10.1007/s11664-009-0992-z
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2010 AND VI 39 AND IP 2
Results: 16
1
2
Photodefinable Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 149, doi. 10.1007/s11664-009-1031-9
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- Article
3
Chemical Vapor Deposition of α-Boron Layers on Silicon for Controlled Nanometer-Deep p<sup>+</sup> n Junction Formation.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 162, doi. 10.1007/s11664-009-1018-6
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- Publication type:
- Article
4
Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 238, doi. 10.1007/s11664-009-1003-0
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- Publication type:
- Article
5
Compositional and Strain Characterization of Ion-Beam-Synthesized Ge<sub> x</sub>Si<sub>1− x</sub> Thin Films.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 174, doi. 10.1007/s11664-009-1042-6
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- Publication type:
- Article
6
Using Phosphorus-Doped α-Si Gettering Layers to Improve NILC Poly-Si TFT Performance.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 157, doi. 10.1007/s11664-009-1027-5
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- Article
7
Preparation and Characterization of Epitaxial Conductive Nb-SrTiO<sub>3</sub> Thin Films on Si Substrates.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 187, doi. 10.1007/s11664-009-0949-2
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- Article
8
Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 200, doi. 10.1007/s11664-009-0959-0
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- Publication type:
- Article
9
Interfacial Reactions Between Sn-Zn Alloys and Ni Substrates.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 209, doi. 10.1007/s11664-009-0950-9
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- Publication type:
- Article
10
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 223, doi. 10.1007/s11664-009-0970-5
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- Article
11
Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al<sub>2</sub>O<sub>3</sub> Particles.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 215, doi. 10.1007/s11664-009-0971-4
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- Article
12
Preparation and Ferroelectric Properties of Ho<sup>3+</sup>/Mo<sup>6+</sup> Cosubstituted Bi<sub>4</sub>Ti<sub>3</sub>O<sub>12</sub> Thin Films by Sol–Gel Method.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 258, doi. 10.1007/s11664-009-0976-z
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- Publication type:
- Article
13
Comparison of Bowing Behaviors Between III–V and II–VI Common-Cation Semiconductor Ternary Alloys.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 178, doi. 10.1007/s11664-009-0972-3
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- Publication type:
- Article
14
Evolution of Annealing Twins in Sputtered Cu Films.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 191, doi. 10.1007/s11664-009-0998-6
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- Publication type:
- Article
15
Formation of Hybrid Inorganic/Organic Nanocomposites.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 145, doi. 10.1007/s11664-009-1024-8
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- Publication type:
- Article
16
Thermodynamic Descriptions for the Sn-Te and Pb-Sn-Te Systems.
- Published in:
- Journal of Electronic Materials, 2010, v. 39, n. 2, p. 246, doi. 10.1007/s11664-009-0985-y
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- Publication type:
- Article