Works matching DE "WIRE bonding (Electronic packaging)"
Results: 115
A finite element analysis of effects of ultrasonic welding parameters on the temperature distribution in wire bonding.
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- PAMM: Proceedings in Applied Mathematics & Mechanics, 2016, v. 16, n. 1, p. 375, doi. 10.1002/pamm.201610176
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Design and control of a novel linear wire bonding head.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9
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Design and development of a new machine vision wire bonding inspection system.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 3/4, p. 323, doi. 10.1007/s00170-006-0611-6
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A microslip model of the bonding process in ultrasonic wire bonders part II: steady teady state response.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 11/12, p. 1134, doi. 10.1007/s00170-005-0006-0
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A microslip model of the bonding process in ultrasonic wire bonders Part I: Transient response.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 860, doi. 10.1007/s00170-005-2587-z
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Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 7/8, p. 708, doi. 10.1007/s00170-004-2245-x
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Reducing non-stick on pad for wire bond: A review.
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- Australian Journal of Mechanical Engineering, 2012, v. 9, n. 2, p. 147, doi. 10.7158/M11-771.2012.9.2
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Electroless nickel/gold process bonds wire surfaces.
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- Advanced Materials & Processes, 2006, v. 164, n. 1, p. 27
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Bonding wire parameters.
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- Advanced Materials & Processes, 2000, v. 157, n. 3, p. 51
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Application research on the time--frequency analysis method in the quality detection of ultrasonic wire bonding.
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- International Journal of Distributed Sensor Networks, 2021, v. 17, n. 5, p. 1, doi. 10.1177/15501477211018346
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Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding.
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- Journal of Materials Science, 2012, v. 47, n. 19, p. 6801, doi. 10.1007/s10853-012-6624-7
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Operating an effective resource allocation for wire bonders in the semiconductor assembly industry.
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- Production Planning & Control, 2007, v. 18, n. 3, p. 226, doi. 10.1080/09537280601104715
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On an IC wire bonding machine production–inventory problem with time value of money.
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- International Journal of Production Research, 2017, v. 55, n. 9, p. 2431, doi. 10.1080/00207543.2016.1213914
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Automated bonding position inspection on multi-layered wire IC using machine vision.
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- International Journal of Production Research, 2010, v. 48, n. 23, p. 6977, doi. 10.1080/00207540903059497
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Prediction enhancement of the J-lead interconnection reliability of land grid array sockets.
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- Journal of Mechanical Science & Technology, 2015, v. 29, n. 5, p. 2187, doi. 10.1007/s12206-015-0439-9
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Quasi-Rigid Mode of Bond Head Assembly in Wire Bonding Machines and Its Improvement #.
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- Mechanics Based Design of Structures & Machines, 2005, v. 33, n. 3/4, p. 293, doi. 10.1080/15367730500374290
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TEMPERATURE DEPENDENCE OF MICROELECTRONIC DEVICE FAILURES.
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- Quality & Reliability Engineering International, 1990, v. 6, n. 4, p. 275, doi. 10.1002/qre.4680060410
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Analysis of frequency response of wire bond configurations joining two 50-Ω microstrip lines.
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- Microwave & Optical Technology Letters, 2010, v. 52, n. 2, p. 487, doi. 10.1002/mop.24919
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On wafer-scaled GaAs HEMTs: Direct and robust small signal modeling up to 50 GHz.
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- Microwave & Optical Technology Letters, 2009, v. 51, n. 8, p. 1958, doi. 10.1002/mop.24492
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A 3–10 GHz CMOS low-noise amplifier using wire bond inductors.
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- Microwave & Optical Technology Letters, 2009, v. 51, n. 2, p. 414, doi. 10.1002/mop.24082
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Enhanced adhesion and thermal stability of Al/Cr film on indium-tin-oxide (ITO)-coated glass.
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- Journal of Adhesion Science & Technology, 2003, v. 17, n. 15, p. 2085, doi. 10.1163/156856103322584227
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Laser Drop on Demand Micro Joining for High Temperature Wire Bonding Applications – System Technology And Mechanical Joint Performance.
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- Journal of Laser Micro / Nanoengineering, 2017, v. 12, n. 3, p. 239, doi. 10.2961/jlmn.2017.03.0012
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Investigation of Optical Interconnection by using Photonic Wire Bonding.
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- Journal of Laser Micro / Nanoengineering, 2015, v. 10, n. 2, p. 148, doi. 10.2961/jlmn.2015.02.0007
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Polymer Magnetic Composite Core Based Microcoils and Microtransformers for Very High Frequency Power Applications.
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- Micromachines, 2016, v. 7, n. 4, p. 60, doi. 10.3390/mi7040060
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Development of a Three Dimensional Neural Sensing Device by a Stacking Method.
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- Sensors (14248220), 2010, v. 10, n. 5, p. 4238, doi. 10.3390/s100504238
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Development of a Three Dimensional Neural Sensing Device by a Stacking Method.
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- Sensors (14248220), 2010, v. 10, n. 2, p. 4238, doi. 10.3390/s100504238
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Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications.
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- Sensors (14248220), 2009, v. 9, n. 6, p. 4986, doi. 10.3390/s90604986
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Corrosion-Induced Mass Loss of Cu<sub>9</sub>Al<sub>4</sub> at the Cu-Al Ball-Bond Interface: Explained Based on Full Immersion of Cu, Al, and Cu-Al Intermetallic Galvanic Couples.
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- Journal of Electronic Materials, 2019, v. 48, n. 1, p. 44, doi. 10.1007/s11664-018-6625-7
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Detecting the Internal Distribution and Structure of Pd-Doped Ag Wire Bonds Using an RF Technique.
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- Journal of Electronic Materials, 2018, v. 47, n. 12, p. 7258, doi. 10.1007/s11664-018-6661-3
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The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6130, doi. 10.1007/s11664-016-5044-x
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The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2507, doi. 10.1007/s11664-015-3812-7
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Review of Capabilities of the ENEPIG Surface Finish.
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- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 3885, doi. 10.1007/s11664-014-3322-z
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Effects of Bonding Wires and Epoxy Molding Compound on Gold and Copper Ball Bonds Intermetallic Growth Kinetics in Electronic Packaging.
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- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 1017, doi. 10.1007/s11664-014-3011-y
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Copper Wire Bonding Concerns and Best Practices.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1
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Effect of Thickness and Phosphorus Content on Au/Pd/Ni(P) Metal Finish of Printed Circuit Board.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2648, doi. 10.1007/s11664-013-2609-9
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Development and Status of Cu Ball/Wedge Bonding in 2012.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 558, doi. 10.1007/s11664-012-2383-0
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- Article
Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires.
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- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 537, doi. 10.1007/s11664-012-2385-y
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Microstructural Investigation of Interfacial Features in Al Wire Bonds.
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- Journal of Electronic Materials, 2012, v. 41, n. 12, p. 3436, doi. 10.1007/s11664-012-2215-2
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Tensile and Fatigue Behavior of Al-1Si Wire Used in Wire Bonding.
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- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1422, doi. 10.1007/s11664-011-1592-2
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Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 834, doi. 10.1007/s11664-009-0762-y
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In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal.
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- Journal of Electronic Materials, 2009, v. 38, n. 5, p. 647, doi. 10.1007/s11664-009-0732-4
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- Article
Suppressing Growth of the Cu<sub>5</sub>Zn<sub>8</sub> Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0
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- Article
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 70, doi. 10.1007/s11664-008-0574-5
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The Feasibility of Au Ball Bonding on Sn-Plated Cu.
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- Journal of Electronic Materials, 2007, v. 36, n. 6, p. 682, doi. 10.1007/s11664-007-0121-9
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Electromigration Effects on Intermetallic Growth at Wire-Bond Interfaces.
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- Journal of Electronic Materials, 2006, v. 35, n. 11, p. 1961, doi. 10.1007/s11664-006-0300-0
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Solid-State Reaction in an Au Wire Connection with an Al-Cu Pad During Aging.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 323, doi. 10.1007/BF02692453
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Innovative Wire Bonding Method Using a Chemically Reacted Thin Layer for Chips with Copper Interconnects.
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- Journal of Electronic Materials, 2006, v. 35, n. 2, p. 279, doi. 10.1007/BF02692447
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In-Situ Cleaning and Passivation of Oxidized Cu Surfaces by Alkanethiols and Its Application to Wire Bonding.
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- Journal of Electronic Materials, 2004, v. 33, n. 9, p. 1005, doi. 10.1007/s11664-004-0027-8
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Thermosonic Bonding of Gold Wire onto a Copper Pad with Titanium Thin-Film Deposition.
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- Journal of Electronic Materials, 2004, v. 33, n. 4, p. 290, doi. 10.1007/s11664-004-0135-5
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Process Windows for Low-Temperature Au Wire Bonding.
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- Journal of Electronic Materials, 2004, v. 33, n. 2, p. 146, doi. 10.1007/s11664-004-0285-5
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