Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 7
1
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1331, doi. 10.1007/s11664-008-0642-x
- Article
2
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1423, doi. 10.1007/s11664-008-0643-9
- Saramat, Ali;
- Toberer, Eric;
- May, Andrew F.;
- Snyder, G. Jeffery
- Article
3
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1491, doi. 10.1007/s11664-008-0638-6
- Leonov, V.;
- Vullers, R. J. M.
- Article
4
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 960, doi. 10.1007/s11664-008-0639-5
- Zebarjadi, Mona;
- Zhixi Bian;
- Singh, Rajeev;
- Shakouri, Ali;
- Wortman, Robert;
- Rawat, Vijay;
- Sands, Tim
- Article
5
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1371, doi. 10.1007/s11664-009-0657-y
- Shimizu, K.;
- Takase, Y.;
- Takeda, M.
- Article
6
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1392, doi. 10.1007/s11664-008-0654-6
- Yamanaka, S.;
- Ishimaru, M.;
- Charoenphakdee, A.;
- Matsumoto, H.;
- Kurosaki, K.
- Article
7
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1068, doi. 10.1007/s11664-009-0667-9
- Zhu, T. J.;
- Yu, C.;
- He, J.;
- Zhang, S. N.;
- Zhao, X. B.;
- Tritt, Terry M.
- Article
8
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1337, doi. 10.1007/s11664-009-0663-0
- Mallik, Ramesh;
- Stiewe, Christian;
- Karpinski, Gabriele;
- Hassdorf, Ralf;
- Müller, Eckhard
- Article
9
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1504, doi. 10.1007/s11664-009-0669-7
- Jovovic, V.;
- Heremans, J. P.
- Article
10
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1350, doi. 10.1007/s11664-009-0664-z
- Matsumoto, H.;
- Kurosaki, K.;
- Muta, H.;
- Yamanaka, S.
- Article
11
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1354, doi. 10.1007/s11664-009-0662-1
- Article
12
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1287, doi. 10.1007/s11664-009-0660-3
- Ohta, Michihiro;
- Hirai, Shinji
- Article
13
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 981, doi. 10.1007/s11664-008-0624-z
- Jiangying Peng;
- Jian He;
- Alboni, Paola N.;
- Tritt, Terry M.
- Article
14
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1239, doi. 10.1007/s11664-009-0744-0
- Sandoz-Rosado, Emil;
- Stevens, Robert
- Article
15
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1483, doi. 10.1007/s11664-008-0649-3
- Article
16
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1176, doi. 10.1007/s11664-008-0653-7
- Min-Young Kim;
- Tae-Sung Oh
- Article
17
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1013, doi. 10.1007/s11664-009-0666-x
- Shibasaki, S.;
- Takahashi, Y.;
- Terasaki, I.
- Article
18
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 954, doi. 10.1007/s11664-008-0656-4
- Zebarjadi, Mona;
- Esfarjani, Keivan;
- Shakouri, Ali;
- Zhixi Bian;
- Je-Hyeong Bahk;
- Zeng, Gehong;
- Bowers, John;
- Hong Lu;
- Zide, Joshua;
- Gossard, Art
- Article
19
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1214, doi. 10.1007/s11664-009-0665-y
- Freunek, Michael;
- Müller, Monika;
- Ungan, Tolgay;
- Walker, William;
- Reindl, Leonhard
- Article
20
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1273, doi. 10.1007/s11664-009-0668-8
- Yan, Y.;
- Tang, X.;
- Liu, H.;
- Zhang, Q.
- Article
21
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1056, doi. 10.1007/s11664-008-0630-1
- Article
22
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1268, doi. 10.1007/s11664-008-0628-8
- Qiang Li;
- Zhiwei Lin;
- Juan Zhou
- Article
23
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1221, doi. 10.1007/s11664-008-0626-x
- Skoug, Eric;
- Chen Zhou;
- Yanzhong Pei;
- Morelli, Donald
- Article
24
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1252, doi. 10.1007/s11664-008-0627-9
- Crane, Nathan B.;
- Mishra, Pradeep;
- Murray Jr., Jeffrey L.;
- Nolas, G. S.
- Article
25
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1078, doi. 10.1007/s11664-008-0625-y
- Doumerc, J. P.;
- Blangero, M.;
- Pollet, M.;
- Carlier, D.;
- Darriet, J.;
- Berthelot, R.;
- Delmas, C.;
- Decourt, R.
- Article
26
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1472, doi. 10.1007/s11664-008-0637-7
- Lertsatitthanakorn, Charoenporn;
- Wiset, Lamul;
- Atthajariyakul, Surat
- Article
27
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1052, doi. 10.1007/s11664-008-0629-7
- Nolas, G. S.;
- Lin, X.;
- Martin, J.;
- Beekman, M.;
- Wang, H.
- Article
28
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1030, doi. 10.1007/s11664-008-0623-0
- Hong Xu;
- Holgate, Tim;
- Jian He;
- Zhe Su;
- Tritt, Terry M.;
- Kleinke, Holger
- Article
29
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1127, doi. 10.1007/s11664-008-0631-0
- Kang, J.-S.;
- Lee, H. J.;
- Kim, D. H.;
- Fujii, T.;
- Terasaki, I.;
- Park, H. L.;
- Jeong, Y. H.;
- Min, B. I.
- Article
30
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 985, doi. 10.1007/s11664-008-0644-8
- Stefanoski, S.;
- Reshetova, L. N.;
- Shevelkov, A.V.;
- Nolas, G. S.
- Article
31
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1089, doi. 10.1007/s11664-008-0640-z
- Kinemuchi, Yoshiaki;
- Aoki, Tomohiro;
- Kaga, Hisashi;
- Okanoue, Kumi;
- Ishiguro, Hirohide;
- Watari, Koji
- Article
32
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1136, doi. 10.1007/s11664-008-0641-y
- Beekman, M.;
- Sebastian, C. P.;
- Grin, Yu.;
- Nolas, G. S.
- Article
33
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 930, doi. 10.1007/s11664-008-0650-x
- Shi, X.;
- Salvador, J. R.;
- Yang, J.;
- Wang, H.
- Article
34
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1002, doi. 10.1007/s11664-008-0651-9
- Cui, Yanjie;
- Salvador, James R.;
- Jihui Yang;
- Hsin Wang;
- Amow, Gisele;
- Kleinke, Holger
- Article
35
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1478, doi. 10.1007/s11664-008-0652-8
- Gelbstein, Y.;
- Ben-Yehuda, O.;
- Pinhas, E.;
- Edrei, T.;
- Sadia, Y.;
- Dashevsky, Z.;
- Dariel, M.
- Article
36
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1315, doi. 10.1007/s11664-008-0648-4
- Article
37
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1154, doi. 10.1007/s11664-009-0773-8
- Morimura, Takao;
- Hasaka, Masayuki;
- Yoshida, Syotaro;
- Nakashima, Hiromichi
- Article
38
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1142, doi. 10.1007/s11664-009-0779-2
- Zhang, S. N.;
- He, J. He;
- Ji, X.;
- Su, Z.;
- Yang, S. H.;
- Zhu, T. J.;
- Zhao, X. B.;
- Tritt, Terry M.
- Article
39
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1387, doi. 10.1007/s11664-009-0792-5
- Nakatsugawa, H.;
- Nagasawa, K.;
- Okamoto, Y.;
- Yamaguchi, S.;
- Fukuda, S.;
- Kitagawa, H.
- Article
40
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1320, doi. 10.1007/s11664-009-0806-3
- Hasaka, Masayuki;
- Morimura, Takao;
- Sato, Hanae;
- Nakashima, Hiromichi
- Article
41
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1171, doi. 10.1007/s11664-009-0791-6
- Itahara, H.;
- Maesato, M.;
- Asahi, R.;
- Yamochi, H.;
- Saito, G.
- Article
42
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1072, doi. 10.1007/s11664-009-0774-7
- Zhou, A. J.;
- Zhao, X. B.;
- Zhu, T. J.;
- Cao, Y. Q.;
- Stiewe, C.;
- Hassdorf, R.;
- Mueller, E.
- Article
43
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1224, doi. 10.1007/s11664-009-0776-5
- Li, H.;
- Tang, X.;
- Zhang, Q.
- Article
44
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 964, doi. 10.1007/s11664-009-0788-1
- Kobayashi, W.;
- Tamura, W.;
- Terasaki, I.
- Article
45
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1282, doi. 10.1007/s11664-009-0775-6
- Nozaki, T.;
- Hayashi, K.;
- Kajitani, T.
- Article
46
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 944, doi. 10.1007/s11664-009-0781-8
- Hasegawa, Yasuhiro;
- Murata, Masayuki;
- Nakamura, Daiki;
- Komine, Takashi;
- Taguchi, Takashi;
- Nakamura, Shinichiro
- Article
47
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1450, doi. 10.1007/s11664-009-0832-1
- Ebling, D. G.;
- Jacquot, A.;
- Böttner, H.;
- Kirste, L.;
- Schmidt, J.;
- Aguirre, M.
- Article
48
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1278, doi. 10.1007/s11664-009-0805-4
- Yan, Y.;
- Tang, X.;
- Li, P.;
- Zhang, Q.
- Article
49
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1326, doi. 10.1007/s11664-009-0819-y
- Kurosaki, J.;
- Yamamoto, A.;
- Tanaka, S.;
- Cannon, J.;
- Miyazaki, K.;
- Tsukamoto, H.
- Article
50
- Journal of Electronic Materials, 2009, v. 38, n. 7, p. 1104, doi. 10.1007/s11664-009-0815-2
- Guilmeau, E.;
- Maignan, A.;
- Martin, C.
- Article