Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 6

Results: 28

Impact of Ti Sputter Target Denitridation on the Crystallographic Orientation of Single Ti Layers and Ti/TiN/AlCu Layer Stacks on Different Oxides.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 797, doi. 10.1007/s11664-009-0745-z

By:

Wolansky, D.;
Zaumseil, P.

Publication type:

Article

A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 742, doi. 10.1007/s11664-009-0797-0

By:

Arun, A.;
Salet, P.;
Ionescu, A. M.

Publication type:

Article

Temperature Dependence of Epitaxial Graphene Formation on SiC(0001).

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 718, doi. 10.1007/s11664-008-0584-3

By:

Luxmi;
Nie, Shu;
Fisher, P. J.;
Feenstra, R. M.;
Gu, Gong;
Sun, Yugang

Publication type:

Article

Field Emission and Electric Discharge of Nanocrystalline Diamond Films.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 750, doi. 10.1007/s11664-009-0706-6

By:

Bohr-Ran Huang;
Jou, Shyankay;
Meng-Chang wu

Publication type:

Article

Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 737, doi. 10.1007/s11664-009-0713-7

By:

Houston, S.;
Brown, G. J.;
Murray, T.;
Fairchild, S.;
Eyink, K.;
Smetana, A.

Publication type:

Article

Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 778, doi. 10.1007/s11664-009-0741-3

By:

Rajarathinam, Venmathy;
Lightsey, C. Hunter;
Osborn, Tyler;
Knapp, Brian;
Elce, Edmund;
Bidstrup Allen, Sue Ann;
Kohl, Paul A.

Publication type:

Article

Growth and Characterization of Zn-Incorporated Copper Oxide Films.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 787, doi. 10.1007/s11664-009-0728-0

By:

Engin, M.;
Atay, F.;
Kose, S.;
Bilgin, V.;
Akyuz, I.

Publication type:

Article

Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 860, doi. 10.1007/s11664-009-0723-5

By:

Fengshun Wu;
Bo Wang;
Du, Bin;
An, Bing;
Yiping Wu

Publication type:

Article

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 902, doi. 10.1007/s11664-009-0737-z

By:

Noh, Bo-In;
Yoon, Jeong-Won;
Hong, Won-Sik;
Jung, Seung-Boo

Publication type:

Article

Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 772, doi. 10.1007/s11664-009-0739-x

By:

Oder, T. N.;
Sung, T. L.;
Barlow, M.;
Williams, J. R.;
Ahyi, A. C.;
Isaacs-Smith, T.

Publication type:

Article

Growth of Graphene-Like Structures on an Oxidized SiC Surface.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 731, doi. 10.1007/s11664-009-0715-5

By:

Weijie Lu;
Mitchel, W. C.;
Boeckl, J. J.;
Crenshaw, Tiffany R.;
Collins, W. E.;
Chang, R. P. H.;
Feldman, L. C.

Publication type:

Article

Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 896, doi. 10.1007/s11664-009-0738-y

By:

Kim, Sun Sik;
Kim, Keun Soo;
Kim, Seong Jun;
Suganuma, Katsuaki

Publication type:

Article

Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 767, doi. 10.1007/s11664-009-0750-2

By:

Bau-Ming Wang;
Yewchung Wu

Publication type:

Article

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 884, doi. 10.1007/s11664-008-0610-5

By:

Wong, E. H.;
Seah, S. K. W.;
Selvanayagam, C. S.;
Rajoo, R.;
Driel, W. D.;
Caers, J. F. J. M.;
Zhao, X. J.;
Owens, N.;
Leoni, M.;
Tan, L. C.;
Lai, Y. -S.;
Yeh, C. -L.

Publication type:

Article

Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 810, doi. 10.1007/s11664-009-0766-7

By:

Ping-Feng Yang;
Sheng-Rui Jian;
Yi-Shao Lai;
Rong-Sheng Chen

Publication type:

Article

Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 761, doi. 10.1007/s11664-009-0754-y

By:

You, Jiun Pying;
Tran, Nguyen T.;
Lin, Yuan-Chang;
He, Yongzhi;
Shi, Frank G.

Publication type:

Article

Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 834, doi. 10.1007/s11664-009-0762-y

By:

Wan Ho Song;
Chunjin Hang;
Pequegnat, Andrew;
Mayer, Michael;
Zhou, Norman Y.;
Young-Kyu Song;
Persic, John

Publication type:

Article

Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 866, doi. 10.1007/s11664-009-0760-0

By:

Wei Zhou;
Lijuan Liu;
Baoling Li;
Ping Wu

Publication type:

Article

Microstructure Evolution and the Constitutive Relations of High-Temperature Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 802, doi. 10.1007/s11664-009-0767-6

By:

Schoeller, Harry;
Bansal, Shubhra;
Knobloch, Aaron;
Shaddock, David;
Cho, Junghyun

Publication type:

Article

Foreword.

Published in:

2009

By:

Capano, Mike;
Xing, Huili

Publication type:

Editorial

Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 756, doi. 10.1007/s11664-009-0777-4

By:

Masui, Hisashi;
Cruz, Samantha C.;
Nakamura, Shuji;
DenBaars, Steven P.

Publication type:

Article

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 873, doi. 10.1007/s11664-009-0770-y

By:

Kim, Seongjun;
Kim, Keun-Soo;
Suganuma, Katsuaki;
Izuta, Goro

Publication type:

Article

Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 852, doi. 10.1007/s11664-009-0769-4

By:

Zhang, Q. K.;
Zou, H. F.;
Zhang, Z. F.

Publication type:

Article

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 843, doi. 10.1007/s11664-009-0772-9

By:

Nousiainen, Olli;
Kangasvieri, Tero;
Rautioaho, Risto;
Vähäkangas, Jouko

Publication type:

Article

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 828, doi. 10.1007/s11664-008-0611-4

By:

Zhao, N.;
Pan, X. M.;
D. Q. Yu;
Ma, H. T.;
L. Wang

Publication type:

Article

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z

By:

Weiqiang Wang;
Choubey, Anupam;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 725, doi. 10.1007/s11664-009-0803-6

By:

Shivaraman, Shriram;
Chandrashekhar, M. V. S.;
Boeckl, John J.;
Spencer, Michael G.

Publication type:

Article

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 908, doi. 10.1007/s11664-009-0778-3

By:

Lin, Chi-pu;
Chen, Chih-ming

Publication type:

Article

Works matching IS 03615235 AND DT 2009 AND VI 38 AND IP 6

Impact of Ti Sputter Target Denitridation on the Crystallographic Orientation of Single Ti Layers and Ti/TiN/AlCu Layer Stacks on Different Oxides.

A Study of Deterministic Positioning of Carbon Nanotubes by Dielectrophoresis.

Temperature Dependence of Epitaxial Graphene Formation on SiC(0001).

Field Emission and Electric Discharge of Nanocrystalline Diamond Films.

Growth and Characterization of Carbon Nanopearls on a Si Substrate by CVD Process.

Aqueous-Develop, Photosensitive Polynorbornene Dielectric: Properties and Characterization.

Growth and Characterization of Zn-Incorporated Copper Oxide Films.

Effect of Stand-Off Height on Microstructure and Tensile Strength of the Cu/Sn9Zn/Cu Solder Joint.

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes.

Improved Ni Schottky Contacts on n-Type 4H-SiC Using Thermal Processing.

Growth of Graphene-Like Structures on an Oxidized SiC Surface.

Microstructural Changes of the Ag-Epoxy ICA/Sn Interface in a High-Humidity Environment.

Improved Gettering Efficiency of Ni from Nickel-Mediated Crystallization Silicon Using Phosphorus-Doped Amorphous Silicon.

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies.

Nanotribological Characteristics of Cu<sub>6</sub>Sn<sub>5</sub>, Cu<sub>3</sub>Sn, and Ni<sub>3</sub>Sn<sub>4</sub> Intermetallic Compounds.

Phosphor-Concentration-Dependent Characteristics of White LEDs in Different Current Regulation Modes.

Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability.

Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg<sub>3.0</sub>Cu<sub>0.5</sub>/Cu Joints: Experimental and First-Principles Study.

Microstructure Evolution and the Constitutive Relations of High-Temperature Solders.

Foreword.

Geometrical Characteristics and Surface Polarity of Inclined Crystallographic Planes of the Wurtzite and Zincblende Structures.

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates.

Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints.

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C.

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders.

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.

Thickness Estimation of Epitaxial Graphene on SiC Using Attenuation of Substrate Raman Intensity.

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.