Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 3

Results: 12

Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 258, doi. 10.1007/s11664-007-0094-8

By:

Tsukimoto, S.;
Kabe, T.;
Ito, K.;
Murakami, M.

Publication type:

Article

Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 197, doi. 10.1007/s11664-007-0093-9

By:

Chen, S.-W.;
Chiu, C.-N.;
Hsieh, K.-C.

Publication type:

Article

Failure Morphology after the Drop Impact Test of the Ball Grid Array Package with Lead-Free Sn-3.8Ag-0.7Cu on Cu and Ni Under-Bump Metallurgies.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 207, doi. 10.1007/s11664-007-0089-5

By:

Jang, J. W.;
Lin, J. K.;
Frear, D. R.

Publication type:

Article

Hygrothermal Delaminations in Lead-Free Solder Reflow of Electronic Packages.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 226, doi. 10.1007/s11664-007-0088-6

By:

Lam, D. C. C.;
Wang, J.

Publication type:

Article

Interfacial Chemistry of InP/GaAs Bonded Pairs.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 179, doi. 10.1007/s11664-006-0077-1

By:

Liu, N.;
Kuech, T. F.

Publication type:

Article

Hillock and Whisker Growth on Sn and SnCu Electrodeposits on a Substrate Not Forming Interfacial Intermetallic Compounds.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 214, doi. 10.1007/s11664-006-0071-7

By:

Williams, M. E.;
Moon, K.-W.;
Boettinger, W. J.;
Josell, D.;
Deal, A. D.

Publication type:

Article

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 232, doi. 10.1007/s11664-006-0066-4

By:

Nousiainen, O.;
Putaala, J.;
Kangasvieri, T.;
Rautioaho, R.;
Vähäkangas, J.

Publication type:

Article

A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 242, doi. 10.1007/s11664-006-0058-4

By:

Bhattacharya, Swapan K.;
Varadarajan, Mahesh G.;
Chahal, Premjeet;
Jha, Gopal C.;
Tummala, Rao R.

Publication type:

Article

Microstructure of External Stress Whiskers and Mechanical Indentation Test Method.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 220, doi. 10.1007/s11664-006-0030-3

By:

Moriuchi, Hiroyuki;
Tadokoro, Yoshihiro;
Sato, Masahide;
Furusawa, Takeshi;
Suzuki, Noboru

Publication type:

Article

Memory Effect of Metal-Insulator-Silicon Capacitor with HfO2-Al2O3 Multilayer and Hafnium Nitride Gate.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 253, doi. 10.1007/s11664-006-0003-6

By:

Shi-Jin Ding;
Min Zhang;
Wei Chen;
Wei Zhang, David;
Li-Kang Wang

Publication type:

Article

Synthesis of Nanometric-Sized Barium Titanate Powders Using Acetylacetone as the Chelating Agent in a Sol-Precipitation Process.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 245, doi. 10.1007/s11664-006-0027-y

By:

Kun Ming Hung;
Ching Shieh Hsieh;
Wein Duo Yang;
Hui Ju Tsai

Publication type:

Article

Understanding the Effects of Stress on the Crystallization of Amorphous Silicon.

Published in:

Journal of Electronic Materials, 2007, v. 36, n. 3, p. 191, doi. 10.1007/s11664-006-0012-5

By:

Li Cai;
Min Zou;
Abu-Safe, Husam;
Naseem, Hameed;
Brown, William

Publication type:

Article