Found: 14
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Novel Abrasive-Free Planarization of 4H-SiC (0001) Using Catalyst.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 8, p. L11, doi. 10.1007/s11664-006-0218-6
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- Article
Structural and Optical Properties of Zn<sub>1-x</sub>Mg<sub>x</sub>O Thin Films Synthesized with Metal Organic Chemical Vapor Deposition.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1680, doi. 10.1007/s11664-006-0217-7
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- Article
Strengthening Effects of ZrO<sub>2</sub> Nanoparticles on the Microstructure and Microhardness of Sn-3.5Ag Lead-Free Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1672, doi. 10.1007/s11664-006-0216-8
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- Article
Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallization with Sn-Ag-Cu Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1665, doi. 10.1007/s11664-006-0215-9
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- Article
Growth of Intermetallic Compounds in the Sn-9Zn/Cu Joint.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1660, doi. 10.1007/s11664-006-0214-x
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- Article
Study of Electromigration in Eutectic SnPb Solder Stripes Using the Edge Displacement Method.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1655, doi. 10.1007/s11664-006-0213-y
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- Article
Analysis of Leakage Currents in MOCVD Grown GaInAsSb Based Photodetectors Operating at 2 µm.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1613, doi. 10.1007/s11664-006-0206-x
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- Article
Epitaxial Growth of CdTe on (211) Silicon Mesas Formed by Deep Reactive Ion Etching.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1636, doi. 10.1007/s11664-006-0210-1
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- Article
Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1628, doi. 10.1007/s11664-006-0209-7
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- Article
Geometrical Effect of Bump Resistance for Flip-Chip Solder Joints: Finite-Element Modeling and Experimental Results.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1647, doi. 10.1007/s11664-006-0212-z
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- Article
Abnormal Growth of Tin Whiskers in a Sn3Ag0.5Cu0.5Ce Solder Ball Grid Array Package.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1621, doi. 10.1007/s11664-006-0208-8
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- Article
Effect of Electrode Material on Transport and Chemical Sensing Characteristics of Metal/Carbon Nanotube Contacts.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1641, doi. 10.1007/s11664-006-0211-0
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- Article
Pure Germanium Epitaxial Growth on Thin Strained Silicon-Germanium Graded Layers on Bulk Silicon Substrate for High-Mobility Channel Metal-Oxide-Semiconductor Field-Effect Transistors.
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- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1607, doi. 10.1007/s11664-006-0205-y
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- Article
Nanoparticle Ordering by Dewetting of Co on SiO<sub>2</sub>.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1618, doi. 10.1007/s11664-006-0207-9
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- Article