Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 8

Results: 14

Novel Abrasive-Free Planarization of 4H-SiC (0001) Using Catalyst.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. L11, doi. 10.1007/s11664-006-0218-6

By:

Hara, Hideyuki;
Sano, Yasuhisa;
Mimura, Hidekazu;
Arima, Kenta;
Kubota, Akihisa;
Yagi, Keita;
Murata, Junji;
Yamauch, Kazuto

Publication type:

Article

Structural and Optical Properties of Zn1-xMgxO Thin Films Synthesized with Metal Organic Chemical Vapor Deposition.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1680, doi. 10.1007/s11664-006-0217-7

By:

Park, S.-H.;
Kim, K.-B.;
Seo, S.-Y.;
Kim, S.-H.;
Han, S.-W.

Publication type:

Article

Strengthening Effects of ZrO2 Nanoparticles on the Microstructure and Microhardness of Sn-3.5Ag Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1672, doi. 10.1007/s11664-006-0216-8

By:

Shen, J.;
Liu, Y. C.;
Han, Y. J.;
Tian, Y. M.;
Gao, H. X.

Publication type:

Article

Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallization with Sn-Ag-Cu Solder.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1665, doi. 10.1007/s11664-006-0215-9

By:

Yung-Chi Lin;
Jenq-Gong Duh

Publication type:

Article

Growth of Intermetallic Compounds in the Sn-9Zn/Cu Joint.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1660, doi. 10.1007/s11664-006-0214-x

By:

Lee, C. S.;
Shieu, F. S.

Publication type:

Article

Study of Electromigration in Eutectic SnPb Solder Stripes Using the Edge Displacement Method.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1655, doi. 10.1007/s11664-006-0213-y

By:

Chou, C. K.;
Hsu, Y. C.;
Chih Chen

Publication type:

Article

Geometrical Effect of Bump Resistance for Flip-Chip Solder Joints: Finite-Element Modeling and Experimental Results.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1647, doi. 10.1007/s11664-006-0212-z

By:

Liang, S. W.;
Chang, Y. W.;
Chih Chen;
Liu, Y. C.;
Chen, K. H.;
Lin, S. H.

Publication type:

Article

Effect of Electrode Material on Transport and Chemical Sensing Characteristics of Metal/Carbon Nanotube Contacts.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1641, doi. 10.1007/s11664-006-0211-0

By:

Jones, F. E.;
Talin, A. A.;
Léonard, F.;
Dentinger, P. M.;
Clift, W. M.

Publication type:

Article

Epitaxial Growth of CdTe on (211) Silicon Mesas Formed by Deep Reactive Ion Etching.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1636, doi. 10.1007/s11664-006-0210-1

By:

Molstad, Jay;
Boyd, Phil;
Markunas, Justin;
Smith, David J.;
Smith, Ed;
Gordon, Eli;
Dinan, J. H.

Publication type:

Article

Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1628, doi. 10.1007/s11664-006-0209-7

By:

Howe, Timothy A.;
Chia-Ken Leong;
Chung, D. D. L.

Publication type:

Article

Abnormal Growth of Tin Whiskers in a Sn3Ag0.5Cu0.5Ce Solder Ball Grid Array Package.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1621, doi. 10.1007/s11664-006-0208-8

By:

Tung-Han Chuang;
Shiu-Fang Yen

Publication type:

Article

Nanoparticle Ordering by Dewetting of Co on SiO2.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1618, doi. 10.1007/s11664-006-0207-9

By:

Favazza, C.;
Trice, J.;
Gangopadhyay, A. K.;
Garcia, H.;
Sureshkumar, R.;
Kalyanaraman, Ramki

Publication type:

Article

Analysis of Leakage Currents in MOCVD Grown GaInAsSb Based Photodetectors Operating at 2 µm.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1613, doi. 10.1007/s11664-006-0206-x

By:

Bhagwat, Vinay;
Xiao, Yegao;
Bhat, Ishwara;
Dutta, Partha;
Refaat, Tamer F.;
Abedin, M. Nurul;
Kumar, Vikram

Publication type:

Article

Pure Germanium Epitaxial Growth on Thin Strained Silicon-Germanium Graded Layers on Bulk Silicon Substrate for High-Mobility Channel Metal-Oxide-Semiconductor Field-Effect Transistors.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1607, doi. 10.1007/s11664-006-0205-y

By:

Dey, S.;
Joshi, S.;
Garcia-Gutierrez, D.;
Chaumont, M.;
Campion, A.;
Jose-Yacaman, M.;
Banerjee, S. K.

Publication type:

Article

Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 8

Novel Abrasive-Free Planarization of 4H-SiC (0001) Using Catalyst.

Structural and Optical Properties of Zn<sub>1-x</sub>Mg<sub>x</sub>O Thin Films Synthesized with Metal Organic Chemical Vapor Deposition.

Strengthening Effects of ZrO<sub>2</sub> Nanoparticles on the Microstructure and Microhardness of Sn-3.5Ag Lead-Free Solder.

Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallization with Sn-Ag-Cu Solder.

Growth of Intermetallic Compounds in the Sn-9Zn/Cu Joint.

Study of Electromigration in Eutectic SnPb Solder Stripes Using the Edge Displacement Method.

Geometrical Effect of Bump Resistance for Flip-Chip Solder Joints: Finite-Element Modeling and Experimental Results.

Effect of Electrode Material on Transport and Chemical Sensing Characteristics of Metal/Carbon Nanotube Contacts.

Epitaxial Growth of CdTe on (211) Silicon Mesas Formed by Deep Reactive Ion Etching.

Comparative Evaluation of Thermal Interface Materials for Improving the Thermal Contact between an Operating Computer Microprocessor and Its Heat Sink.

Abnormal Growth of Tin Whiskers in a Sn3Ag0.5Cu0.5Ce Solder Ball Grid Array Package.

Nanoparticle Ordering by Dewetting of Co on SiO<sub>2</sub>.

Analysis of Leakage Currents in MOCVD Grown GaInAsSb Based Photodetectors Operating at 2 µm.

Pure Germanium Epitaxial Growth on Thin Strained Silicon-Germanium Graded Layers on Bulk Silicon Substrate for High-Mobility Channel Metal-Oxide-Semiconductor Field-Effect Transistors.