Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 4
1
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 533, doi. 10.1007/s11664-007-0099-3
- Xi, Y. A.;
- Chen, K. X.;
- Mont, F.;
- Kim, J. K.;
- Schubert, E. F.;
- Wetzel, C.;
- Liu, W.;
- Li, X.;
- Smart, J. A.
- Article
2
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 529, doi. 10.1007/s11664-007-0110-z
- Wu, P.;
- Saraf, G.;
- Lu, Y.;
- Hill, D. H.;
- Arena, D. A.;
- Bartynski, R. A.;
- Cosandey, F.;
- Al-Sharab, J. F.;
- Wielunski, L.;
- Gateau, R.;
- Dvorak, J.;
- Moodenbaugh, A.;
- Raley, J. A.;
- Yung Kee Yeo
- Article
3
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 436, doi. 10.1007/s11664-006-0086-0
- Kai Qiu;
- Li, X. H.;
- Zhong, F.;
- Yin, Z. J.;
- Luo, X. D.;
- Ji, C. J.;
- Han, Q. F.;
- Chen, J. R.;
- Cao, X. C.;
- Xie, X. J.;
- Wang, Y. Q.
- Article
4
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 332, doi. 10.1007/s11664-006-0084-2
- Dhanaraj, Govindhan;
- Yi Chen;
- Hui Chen;
- Dang Cai;
- Hui Zhang;
- Dudley, Michael
- Article
5
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 312, doi. 10.1007/s11664-006-0083-3
- Mohammad, F. A.;
- Cao, Y.;
- Porter, L. M.
- Article
6
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 267, doi. 10.1007/s11664-006-0082-4
- Stahlbush, Robert;
- Jena, Debdeep;
- Phillips, Jamie
- Article
7
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 483, doi. 10.1007/s11664-006-0081-5
- Avrutin, V.;
- Özgür, Ü.;
- Chevtchenko, S.;
- Litton, C.;
- Morkoc, H.
- Article
8
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 340, doi. 10.1007/s11664-006-0080-6
- Evwaraye, A. O.;
- Smith, S. R.;
- Mitchel, W. C.;
- Capano, M. A.
- Article
9
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 524, doi. 10.1007/s11664-006-0079-z
- Mridha, S.;
- Ghosh, R.;
- Basak, D.
- Article
10
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 277, doi. 10.1007/s11664-006-0078-0
- Gao, M.;
- Tsukimoto, S.;
- Goss, S. H.;
- Tumakha, S. P.;
- Onishi, T.;
- Murakami, M.;
- Brillson, L. J.
- Article
11
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 285, doi. 10.1007/s11664-006-0076-2
- Bishop, S. M.;
- Reynolds Jr., C. L.;
- Liliental-Weber, Z.;
- Uprety, Y.;
- Zhu, J.;
- Wang, D.;
- Park, M.;
- Molstad, J. C.;
- Barnhardt, D. E.;
- Shrivastava, A.;
- Sudarshan, T. S.;
- Davis, R. F.
- Article
12
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 272, doi. 10.1007/s11664-006-0075-3
- Kung-Yen Lee;
- Capano, Michael A.
- Article
13
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 403, doi. 10.1007/s11664-006-0074-4
- Takizawa, Toshiyuki;
- Shimizu, Jun;
- Ueda, Tetsuzo
- Article
14
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 420, doi. 10.1007/s11664-006-0073-5
- Schuette, Michael L.;
- Wu Lu
- Article
15
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 426, doi. 10.1007/s11664-006-0072-6
- Limb, J. B.;
- Lee, W.;
- Ryou, J.-H.;
- Yoo, D.;
- Dupuis, R. D.
- Article
16
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 397, doi. 10.1007/s11664-006-0070-8
- Green, R. T.;
- Tan, W. S.;
- Houston, P. A.;
- Wang, T.;
- Parbrook, P. J.
- Article
17
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 353, doi. 10.1007/s11664-006-0069-1
- Dongwon Yoo;
- Jae Boum Limb;
- Jae-Hyun Ryou;
- Wonseok Lee;
- Dupuis, Russell D.
- Article
18
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 494, doi. 10.1007/s11664-006-0068-2
- Zhu, G. P.;
- Xu, C. X.;
- Wu, X. F.;
- Yang, Y.;
- Sun, X. W.;
- Cui, Y. P.
- Article
19
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 442, doi. 10.1007/s11664-006-0063-7
- Claflin, B.;
- Look, D. C.;
- Norton, D. R.
- Article
20
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 409, doi. 10.1007/s11664-006-0061-9
- Alivov, Y. I.;
- Özgür, Ü.;
- Gu, X.;
- Liu, C.;
- Moon, Y.;
- Morkoç, H.;
- Lopatiuk, O.;
- Chernyak, L.;
- Litton, C. W.
- Article
21
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 297, doi. 10.1007/s11664-006-0059-3
- Liu, Kendrick X.;
- Stahlbush, Robert E.;
- Twigg, Mark E.;
- Caldwell, Joshua D.;
- Glaser, Evan R.;
- Hobart, Karl D.;
- Kub, Francis J.
- Article
22
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 457, doi. 10.1007/s11664-006-0056-6
- Pan, M.;
- Nause, J.;
- Rengarajan, V.;
- Rondon, R.;
- Park, E. H.;
- Ferguson, I. T.
- Article
23
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 346, doi. 10.1007/s11664-006-0055-7
- Weng, X.;
- Acord, J. D.;
- Jain, A.;
- Dickey, E. C.;
- Redwing, J. M.
- Article
24
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 384, doi. 10.1007/s11664-006-0054-8
- Voss, L. F.;
- Stafford, L.;
- Thaler, G. T.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Chen, J.-J.;
- Ren, F.
- Article
25
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 452, doi. 10.1007/s11664-006-0053-9
- Mei, Z. X.;
- Du, X. L.;
- Wang, Y.;
- Ying, M. J.;
- Zeng, Z. Q.;
- Yuan, H. T.;
- Jia, J. F.;
- Xue, Q. K.;
- Zhang, Z.
- Article
26
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 446, doi. 10.1007/s11664-006-0052-x
- Saraf, Gaurav;
- Jian Zhong;
- Dulub, Olga;
- Diebold, Ulrike;
- Siegrist, Theo;
- Yicheng Lu
- Article
27
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 472, doi. 10.1007/s11664-006-0051-y
- Kennedy, J.;
- Markwitz, A.;
- Trodahl, H. J.;
- Ruck, B. J.;
- Durbin, S. M.;
- Gao, W.
- Article
28
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 359, doi. 10.1007/s11664-006-0050-z
- Ho Gyoung Kim;
- Deb, Parijat;
- Sands, Tim
- Article
29
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 498, doi. 10.1007/s11664-006-0047-7
- Yang, L. L.;
- Ye, Z. Z.;
- Zhu, L. P.;
- Zeng, Y. J.;
- Lu, Y. F.;
- Zhao, B. H.
- Article
30
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 507, doi. 10.1007/s11664-006-0046-8
- Schuler, Leo P.;
- Valanoor, Nagarajan;
- Miller, Paul;
- Guy, Ian;
- Reeves, Roger J.;
- Alkaisi, Maan M.
- Article
31
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 431, doi. 10.1007/s11664-006-0045-9
- Article
32
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 414, doi. 10.1007/s11664-006-0044-x
- Dalmau, R.;
- Collazo, R.;
- Mita, S.;
- Sitar, Z.
- Article
33
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 268, doi. 10.1007/s11664-006-0043-y
- Garces, N. Y.;
- Carlos, W. E.;
- Glaser, E. R.;
- Fanton, M. A.
- Article
34
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 502, doi. 10.1007/s11664-006-0042-z
- Shoubin Xue;
- Huizhao Zhuang;
- Chengshan Xue;
- Lijun Hu;
- Baoli Li;
- Shiying Zhang
- Article
35
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 373, doi. 10.1007/s11664-006-0041-0
- Dimakis, E.;
- Iliopoulos, E.;
- Kayambaki, M.;
- Tsagaraki, K.;
- Kostopoulos, A.;
- Konstantinidis, G.;
- Georgakilas, A.
- Article
36
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 391, doi. 10.1007/s11664-006-0040-1
- Hite, J. K.;
- Frazier, R. M.;
- Davies, R. P.;
- Thaler, G. T.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Zavada, J. M.;
- Brown, E.;
- Hömmerich, U.
- Article
37
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 488, doi. 10.1007/s11664-006-0039-7
- Wright, J. S.;
- Stafford, L.;
- Gila, B. P.;
- Norton, D. P.;
- Pearton, S. J.;
- Hung-Ta Wang;
- Ren, F.
- Article
38
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 318, doi. 10.1007/s11664-006-0038-8
- Caldwell, Joshua D.;
- Liu, Kendrick X.;
- Tadjer, Marko J.;
- Glembocki, Orest J.;
- Stahlbush, Robert E.;
- Hobart, Karl D.;
- Kub, Fritz
- Article
39
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 368, doi. 10.1007/s11664-006-0037-9
- Chen, J.-J.;
- Hlad, M.;
- Gerger, A. P.;
- Gila, B. P.;
- Ren, F.;
- Abernathy, C. R.;
- Pearton, S. J.
- Article
40
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 379, doi. 10.1007/s11664-006-0036-x
- Khanna, Rohit;
- Stafford, L.;
- Pearton, S. J.;
- Anderson, T. J.;
- Ren, F.;
- Kravchenko, I. I.;
- Dabiran, Amir;
- Osinsky, A.;
- Joon Yeob Lee;
- Kwan-Young Lee;
- Jihyun Kim
- Article
41
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 519, doi. 10.1007/s11664-006-0035-y
- Allums, K. K.;
- Hlad, M.;
- Gerger, A. P.;
- Gila, B. P.;
- Abernathy, C. R.;
- Pearton, S. J.;
- Ren, F.;
- Dwivedi, R.;
- Fogarty, T. N.;
- Wilkins, R.
- Article
42
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 462, doi. 10.1007/s11664-006-0034-z
- Pearton, S. J.;
- Norton, D. P.;
- Ivill, M. P.;
- Hebard, A. F.;
- Zavada, J. M.;
- Chen, W. M.;
- Buyanova, I. A.
- Article
43
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 324, doi. 10.1007/s11664-006-0032-1
- Sundaresan, Siddarth G.;
- Rao, Mulpuri V.;
- Yonglai Tian;
- Schreifels, John A.;
- Wood, Mark C.;
- Jones, Kenneth A.;
- Davydov, Albert V.
- Article
44
- Journal of Electronic Materials, 2007, v. 36, n. 4, p. 307, doi. 10.1007/s11664-006-0031-2
- Fang, Z.-Q.;
- Claflin, B.;
- Look, D. C.;
- Farlow, G. C.
- Article