Local Melting during Electromigration in Cu Conductor Lines.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 117, doi. 10.1007/s11664-006-0067-3
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2007 AND VI 36 AND IP 2
Results: 11
1
2
Impact of Thermal, Moisture, and Mechanical Loading Conditions on Interfacial Fracture Toughness of Adhesively Bonded Joints.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 110, doi. 10.1007/s11664-006-0065-5
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- Publication type:
- Article
3
Three-Dimensional Thermoelectrical Simulation in Flip-Chip Solder Joints with Thick Underbump Metallizations during Accelerated Electromigration Testing.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 159, doi. 10.1007/s11664-006-0060-x
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- Publication type:
- Article
4
InAlSb/InAs/AlGaSb Quantum Well Heterostructures for High-Electron-Mobility Transistors.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 99, doi. 10.1007/s11664-006-0057-5
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- Publication type:
- Article
5
Isothermal Fatigue Behavior of the Near-Eutectic Sn-Ag-Cu Alloy between -25°C and 125°C.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 173, doi. 10.1007/s11664-006-0048-6
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- Publication type:
- Article
6
Wafer-Lever Hermetic Package with Through-Wafer Interconnects.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 105, doi. 10.1007/s11664-006-0016-1
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- Publication type:
- Article
7
Solder/Substrate Interfacial Reactions in the Sn-Cu-Ni Interconnection System.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 136, doi. 10.1007/s11664-006-0028-x
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- Publication type:
- Article
8
Electromigration-Induced Bi Segregation in Eutectic SnBi Solder Joint.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 168, doi. 10.1007/s11664-006-0025-0
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- Publication type:
- Article
9
Electrical Characteristics of the Three-Dimensional Interconnection Structure for the Chip Stack Package with Cu through Vias.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 123, doi. 10.1007/s11664-006-0020-5
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- Publication type:
- Article
10
Structural and Passivative Behaviors of Cu(In) Thin Film.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 129, doi. 10.1007/s11664-006-0017-0
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- Publication type:
- Article
11
Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples.
- Published in:
- Journal of Electronic Materials, 2007, v. 36, n. 2, p. 147, doi. 10.1007/s11664-006-0029-9
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- Publication type:
- Article