Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 2

Results: 13

Effect of Rapid Solidification and Small Additions of Zn and Bi on the Structure and Properties of Sn-Cu Eutectic Alloy.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 212, doi. 10.1007/s11664-005-0234-y

By:

El-Ashram, Tarek;
Shalaby, R. M.

Publication type:

Article

Tensile Creep and Microstructural Characterization of Bulk Sn3.9Ag0.6Cu Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 196, doi. 10.1007/s11664-005-0233-z

By:

Qiang Xiao;
Armstrong, William D.

Publication type:

Article

Creep Deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi Solder Joints.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 188, doi. 10.1007/s11664-005-0232-0

By:

Shin, S. W.;
Jin Yu

Publication type:

Article

Controlling the Microstructures from the Gold-Tin Reaction.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 182, doi. 10.1007/s11664-005-0231-1

By:

Tsai, J. Y.;
Chang, C. W.;
Shieh, Y. C.;
Hu, Y. C.;
Kao, C. R.

Publication type:

Article

Nitrogen-Doped Ge2Sb2Te5 Films for Nonvolatile Memory.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 176, doi. 10.1007/s11664-005-0230-2

By:

Yunfeng Lai;
Baowei Qiao;
Jie Feng;
Yun Ling;
Lianzhang Lai;
Yinyin Lin;
Ting'Ao Tang;
Bingchu Cai;
Bomy Chen

Publication type:

Article

Thermal Behavior of Silver Nanoparticles for Low-Temperature Interconnect Applications.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 168, doi. 10.1007/s11664-005-0229-8

By:

Kyoung-Sik Moon;
Hai Dong;
Maric, Radenka;
Pothukuchi, Suresh;
Hunt, Andrew;
Yi Li;
Wong, C. P.

Publication type:

Article

Influence of Interfacial Reaction Layer on Reliability of Chip-Scale Package Joint from Using Sn-37Pb and Sn-8Zn-3Bi Solder.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 161, doi. 10.1007/s11664-005-0228-9

By:

Chung-Hee Yu;
Kyung-Seob Kim;
Hyung-Il Kim;
Hyo-Joeng Jeon

Publication type:

Article

Growth and Optimization of Extremely High-Pulse-Power Graded-Index Separate Confinement Heterostructure Quantum Well AlGaAs/InGaAs Diode Lasers with Broadened Waveguides.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 156, doi. 10.1007/s11664-005-0227-x

By:

Li, J. Z.;
Martinelli, R. U.;
Khalfin, V. B.;
Shellenbarger, Z.;
Braun, A. M.;
Capewell, D.;
Willner, B. I.;
Abeles, J. H.

Publication type:

Article

Spray Deposition and Characterization of Zirconium-Oxide Thin Films.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 150, doi. 10.1007/s11664-005-0226-y

By:

Ortiz, A.;
Alonso, J. C.;
Haro-Poniatowski, E.

Publication type:

Article

Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5% Ag-0.5% Cu Solder and Cu Metallization in Microelectronic Packaging.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 143, doi. 10.1007/s11664-005-0225-z

By:

Islam, M. N.;
Sharif, Ahmed;
Chan, Y. C.

Publication type:

Article

Microstructural Development of Sn-Ag-Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 137, doi. 10.1007/s11664-005-0224-0

By:

Fix, Andreas R.;
López, Gabriel A.;
Brauer, Ingo;
Nüchter, Wolfgang;
Mittemeijer, Eric J.

Publication type:

Article

Surface Modification of Silicon by Laser Surface Treatment: Improvement of Adhesion and Copper Deposition.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 132, doi. 10.1007/s11664-005-0223-1

By:

Cheon Lee;
Dong-Yong Kim;
Jae-Hong Kim;
Kyoung-Cheol Lee;
Chang-Su Hui

Publication type:

Article

Study of Intermetallic Crystal Growth between Nb and Molten 52ln-48Sn Solder.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 125, doi. 10.1007/s11664-005-0222-2

By:

Mannan, Samjid H.;
Clode, Mike P.;
Dagher, Mohamed

Publication type:

Article