Direct Sub-100-nm Patterning of an Organic Low-k Dielectric for Electrical and Optical Interconnects.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. L12, doi. 10.1007/s11664-005-0221-3
- By:
- Publication type:
- Article
Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 3
Results: 15
1
2
Increase Mechanism of Indium-Tin-Oxide Work Function by KrF Excimer Laser Irradiation.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. L9, doi. 10.1007/s11664-005-0220-4
- By:
- Publication type:
- Article
3
Effect of Off-Orientation of Seed Crystal on Silicon Carbide (SiC) Single-crystal Growth on the (1120) Surface.
- Published in:
- 2005
- Publication type:
- Correction Notice
4
Microstructure and Mechanical Properties Predicted by Indentation Testing of Lead-Free Solders.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 311, doi. 10.1007/s11664-005-0218-y
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- Publication type:
- Article
5
Solderability Testing of Sn-Ag-XCu Pb-Free Solders on Copper and Au-Ni-Plated Kovar Substrates.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 299, doi. 10.1007/s11664-005-0217-z
- By:
- Publication type:
- Article
6
Electro-Thermal Resistance of GaAs Interconnects.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 294, doi. 10.1007/s11664-005-0216-0
- By:
- Publication type:
- Article
7
Effect of Firing Atmosphere on Air-Fireable Glass-Free Electrically Conductive Thick Film.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 287, doi. 10.1007/s11664-005-0215-1
- By:
- Publication type:
- Article
8
Investigation of Ga Oxide Films Directly Grown on n-Type GaN by Photoelectrochemical Oxidation Using He-Cd Laser.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 282, doi. 10.1007/s11664-005-0214-2
- By:
- Publication type:
- Article
9
Characterization Study of Time- and Temperature-Dependent Mechanical Behavior of Polyimide Materials in Electronic Packaging Applications.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 272, doi. 10.1007/s11664-005-0213-3
- By:
- Publication type:
- Article
10
Adherence of Self-Assembled Monolayers on Gold and Their Effects for High-Performance Anisotropic Conductive Adhesives.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 266, doi. 10.1007/s11664-005-0212-4
- By:
- Publication type:
- Article
11
Real-Time Scanning Electron Microscopy and Auger Spectroscopy of Wetting in Sn-3.3Ag-4.8Bi Solder Paste Wetted to Ni-Au.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 248, doi. 10.1007/s11664-005-0211-5
- By:
- Publication type:
- Article
12
Synthesis of Silicon Dioxide Film Using High-Concentration Ozone and Evaluation of the Film Quality.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 240, doi. 10.1007/s11664-005-0210-6
- By:
- Publication type:
- Article
13
Reprocessing of Thermally Oxidized Aluminum Arsenide (AlAs) in Epitaxial Multilayers without Delamination.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 232, doi. 10.1007/s11664-005-0209-z
- By:
- Publication type:
- Article
14
Electrical Properties of Titanium-HgCdTe Contacts.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 225, doi. 10.1007/s11664-005-0208-0
- By:
- Publication type:
- Article
15
Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu Solder Joint.
- Published in:
- Journal of Electronic Materials, 2005, v. 34, n. 3, p. 217, doi. 10.1007/s11664-005-0207-1
- By:
- Publication type:
- Article