Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 5

Results: 32

The Effects of Boron in the Cu(B)/Ti/SiO2 System on the Cu-Ti Reaction, Resistivity, and Diffusion Barrier Properties.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 643, doi. 10.1007/s11664-005-0078-5

By:

Yang, H. J.;
Lee, S.;
Park, J. B.;
Lee, H. M.;
Lee, E. G.;
Lee, C. M.;
Hong, H. N.;
Mori, S.;
Lee, J. H.;
Lee, J. G.

Publication type:

Article

Experimental Investigation and Thermodynamic Calculation of Phase Equilibria in the Sn-Au-Ni System.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 670, doi. 10.1007/s11664-005-0082-9

By:

Liu, X. J.;
Kinaka, M.;
Takaku, Y.;
Ohnuma, I.;
Kainuma, R.;
Ishida, K.

Publication type:

Article

Interfacial Reactions of Cu-Containing Lead-Free Solders with Au/NiP Metallization.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 662

By:

Islami, M. N.;
Chan, Y. C.

Publication type:

Article

Molecular Beam Epitaxial Growth and Characterization of Cd-Based II-VI Wide-Bandgap Compounds on Si Substrates.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 655, doi. 10.1007/s11664-005-0080-y

By:

Brill, G.;
Chen, Y.;
Amirtharaj, P. M.;
Sarney, W.;
Chandler-Horowitz, D.;
Dhar, N. K.

Publication type:

Article

Encapsulation of Lead-Free Sn/Zn/Bi Solder Alloy Particles by Coating with Wax Powder for Improving Oxidation Resistance.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 647, doi. 10.1007/s11664-005-0079-4

By:

Iwasaki, Tomohiro;
Jeong Hwan Kim;
Mizuhashi, Shohei;
Satoh, Munetake

Publication type:

Article

Nanostructured Thermoelectric Materials.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. L19, doi. 10.1007/s11664-005-0083-8

By:

Harman, T. C.;
Walsh, M. P.;
Laforge, B. E.;
Turner, G. W.

Publication type:

Article

Oxidation Study of Pure Tin and Its Alloys via Electrochemical Reduction Analysis.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 635, doi. 10.1007/s11664-005-0077-6

By:

Sungil Cho;
Jin Yu;
Kang, Sung K.;
Da-Yuan Shih

Publication type:

Article

Fluxless Fabrications of Sn-Au Solder Microbumps by a Hydrogen Plasma Reflow Technique.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 630, doi. 10.1007/s11664-005-0076-7

By:

Ishii, Takao;
Aoyama, Shinji

Publication type:

Article

Thermal and Mechanical Stability of Electrically Conductive Adhesive Joints.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 625, doi. 10.1007/s11664-005-0075-8

By:

Xiao, Jun;
Chung, D. D. L.

Publication type:

Article

The Anomalous Microstructural, Tensile, and Aging Response of Thin-Cast Sn3.9Ag0.6Cu Lead-Free Solder.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 617, doi. 10.1007/s11664-005-0074-9

By:

Qiang Xiao;
Luu Nguyen;
Armstrong, William D.

Publication type:

Article

Study of Threading Dislocations in the Plan-View Sample of SiGe/Si(001) Superlattices by Transmission Electron Microscopy.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 612, doi. 10.1007/s11664-005-0073-x

By:

Atici, Yusuf

Publication type:

Article

Investigation of Microstructure and V-Defect Formation in InxGa1-xN/GaN MQW Grown Using Temperature-Gradient Metalorganic Chemical Vapor Deposition.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 605, doi. 10.1007/s11664-005-0072-y

By:

Johnson, M. C.;
Liliental-Weber, Z.;
Zakharov, D. N.;
McCready, D. E.;
Jorgenson, R. J.;
Wu, J.;
Shan, W.;
Bourret-Courchesne, E. D.

Publication type:

Article

Novel Interconnection Method Using Electrically Conductive Paste with Fusible Filler.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 600, doi. 10.1007/s11664-005-0071-z

By:

Jong-Min Kim;
Yasuda, Kiyokazu;
Fujimoto, Kozo

Publication type:

Article

Formation of Ti Diffusion Barrier Layers in Thin Cu(Ti) Alloy Films.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 592, doi. 10.1007/s11664-005-0070-0

By:

Tsukimoto, S.;
Morita, T.;
Moriyama, M.;
Ito, Kazuhiro;
Murakami, Masanori

Publication type:

Article

Numerical Simulation of Thermal Wave Propagation during Laser Processing of Thin Films.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 583, doi. 10.1007/s11664-005-0069-6

By:

Ai, X.;
Li, B. Q.

Publication type:

Article

Surface Modification of Ferrous Alloys with Boron.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 575, doi. 10.1007/s11664-005-0068-7

By:

Petrova, Roumiana S.;
Suwattananont, Naruemon

Publication type:

Article

Progress in Crystalline Multijunction and Thin-Film Photovoltaics.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 571, doi. 10.1007/s11664-005-0067-8

By:

Senft, Donna Cowell

Publication type:

Article

Dielectric Films for Si Solar Cell Applications.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 564, doi. 10.1007/s11664-005-0066-9

By:

Sopori, Bhushan

Publication type:

Article

Three-Dimensional Simulation of Microstructure Evolution in Damascene Interconnects: Effect of Overburden Thickness.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 559, doi. 10.1007/s11664-005-0065-x

By:

Jung-Kyu Jung;
Nong-Moon Hwang;
Young-Joon Park;
Young-Chang Joo

Publication type:

Article

Characterization of Environmental Stability of Pulsed Laser Deposited Oxide Ceramic Coatings.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 551, doi. 10.1007/s11664-005-0064-y

By:

Adams, Thad M.;
Duncan, Andrew J.;
Fitz-Gerald, James

Publication type:

Article

Fabrication of Potential NiMoP Diffusion Barrier/Seed Layers for Cu Interconnects via Electroless Deposition.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 541, doi. 10.1007/s11664-005-0063-z

By:

Wu, Y.;
Wan, C. C.;
Wang, Y. Y.

Publication type:

Article

Toward a Better Understanding of Synthesis and Processing of Ceramic/Self-Assembled Monolayer Bilayer Coatings.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 534, doi. 10.1007/s11664-005-0062-0

By:

Salami, T. O.;
Yang, Q.;
Chitre, K.;
Zarembo, S.;
Cho, J.;
Oliver, S. R. J.

Publication type:

Article

Microstructure and Mechanical Properties of Ceramic/ Self-Assembled Monolayer Bilayer Coatings.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 528, doi. 10.1007/s11664-005-0061-1

By:

Chitre, K.;
Yang, Q.;
Salami, T. O.;
Oliver, S. R.;
Cho, J.

Publication type:

Article

Modeling and Experiments on Epitaxially Grown Multilayers with Implications to Critical Thickness.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 522, doi. 10.1007/s11664-005-0060-2

By:

Vanamu, Ganesh;
Robbins, Joshua;
Khraishi, Tariq A.;
Datye, Abhaya K.;
Zaidi, Saleem H.

Publication type:

Article

Some Silicon-Based Heterostructures for Optical Applications.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 515, doi. 10.1007/s11664-005-0059-8

By:

Willander, M.;
Zhao, Q. X.;
Nur, O.;
Hu, Q.-H.

Publication type:

Article

Textural and Microstructural Transformation of Cu Damascene Interconnects after Annealing.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 506, doi. 10.1007/s11664-005-0058-9

By:

Jae-Young Cho;
Hyo-Jong Lee;
Hyoungbae Kim;
Szpunar, Jerzy A.

Publication type:

Article

Analysis of Thermal Stresses in Copper Interconnect/Low-k Dielectric Structures.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 497, doi. 10.1007/s11664-005-0057-x

By:

Shen, Y.-L.

Publication type:

Article

Novel Pulsed-Laser-Deposition--VO2 Thin Films for Ultrafast Applications.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 491, doi. 10.1007/s11664-005-0056-y

By:

Liu, H.;
Vasquez, O.;
Santiago, V. R.;
Diaz, L.;
Rua, A. J.;
Fernandez, F. E.

Publication type:

Article

Silicon-Integrated Uncooled Infrared Detectors: Perspectives on Thin Films and Microstructures.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 484, doi. 10.1007/s11664-005-0055-z

By:

Mehta, V. R.;
Shet, S.;
Ravindra, N. M.;
Fiory, A. T.;
Lepselter, M. P.

Publication type:

Article

Fluxon Pinning in the Nodeless Pairing State of Superconducting YBa2Cu3O7.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 474, doi. 10.1007/s11664-005-0054-0

By:

Fiory, A. T.;
Harshman, D. R.;
Jung, J.;
Isaac, I.-Y.;
Kossler, W. J.;
Greer, A. J.;
Noakes, D. R.;
Stronach, C. E.;
Koster, E.;
Dow, John D.

Publication type:

Article

Ion Beam Mixing of Silicon-Germanium Thin Films.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 468, doi. 10.1007/s11664-005-0053-1

By:

Abedrabbo, Sufian;
Arafah, D.-E.;
Salem, S.

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 5, p. 467, doi. 10.1007/s11664-005-0052-2

By:

Ravindra, N. M.;
Choong-Un Kim;
Zribi, Anis;
Kang, Seung H.

Publication type:

Article

Works matching IS 03615235 AND DT 2005 AND VI 34 AND IP 5

The Effects of Boron in the Cu(B)/Ti/SiO<sub>2</sub> System on the Cu-Ti Reaction, Resistivity, and Diffusion Barrier Properties.

Experimental Investigation and Thermodynamic Calculation of Phase Equilibria in the Sn-Au-Ni System.

Interfacial Reactions of Cu-Containing Lead-Free Solders with Au/NiP Metallization.

Molecular Beam Epitaxial Growth and Characterization of Cd-Based II-VI Wide-Bandgap Compounds on Si Substrates.

Encapsulation of Lead-Free Sn/Zn/Bi Solder Alloy Particles by Coating with Wax Powder for Improving Oxidation Resistance.

Nanostructured Thermoelectric Materials.

Oxidation Study of Pure Tin and Its Alloys via Electrochemical Reduction Analysis.

Fluxless Fabrications of Sn-Au Solder Microbumps by a Hydrogen Plasma Reflow Technique.

Thermal and Mechanical Stability of Electrically Conductive Adhesive Joints.

The Anomalous Microstructural, Tensile, and Aging Response of Thin-Cast Sn3.9Ag0.6Cu Lead-Free Solder.

Study of Threading Dislocations in the Plan-View Sample of SiGe/Si(001) Superlattices by Transmission Electron Microscopy.

Investigation of Microstructure and V-Defect Formation in In<sub>x</sub>Ga<sub>1-x</sub>N/GaN MQW Grown Using Temperature-Gradient Metalorganic Chemical Vapor Deposition.

Novel Interconnection Method Using Electrically Conductive Paste with Fusible Filler.

Formation of Ti Diffusion Barrier Layers in Thin Cu(Ti) Alloy Films.

Numerical Simulation of Thermal Wave Propagation during Laser Processing of Thin Films.

Surface Modification of Ferrous Alloys with Boron.

Progress in Crystalline Multijunction and Thin-Film Photovoltaics.

Dielectric Films for Si Solar Cell Applications.

Three-Dimensional Simulation of Microstructure Evolution in Damascene Interconnects: Effect of Overburden Thickness.

Characterization of Environmental Stability of Pulsed Laser Deposited Oxide Ceramic Coatings.

Fabrication of Potential NiMoP Diffusion Barrier/Seed Layers for Cu Interconnects via Electroless Deposition.

Toward a Better Understanding of Synthesis and Processing of Ceramic/Self-Assembled Monolayer Bilayer Coatings.

Microstructure and Mechanical Properties of Ceramic/ Self-Assembled Monolayer Bilayer Coatings.

Modeling and Experiments on Epitaxially Grown Multilayers with Implications to Critical Thickness.

Some Silicon-Based Heterostructures for Optical Applications.

Textural and Microstructural Transformation of Cu Damascene Interconnects after Annealing.

Analysis of Thermal Stresses in Copper Interconnect/Low-k Dielectric Structures.

Novel Pulsed-Laser-Deposition--VO<sub>2</sub> Thin Films for Ultrafast Applications.

Silicon-Integrated Uncooled Infrared Detectors: Perspectives on Thin Films and Microstructures.

Fluxon Pinning in the Nodeless Pairing State of Superconducting YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7</sub>.

Ion Beam Mixing of Silicon-Germanium Thin Films.

Foreword.