Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 2


Results: 11
    1

    Process Windows for Low-Temperature Au Wire Bonding.

    Published in:
    Journal of Electronic Materials, 2004, v. 33, n. 2, p. 146, doi. 10.1007/s11664-004-0285-5
    By:
    • Yu Hin Chan, L.;
    • Jang-Kyo Kim;
    • Deming Liu;
    • Liu, Peter C. K.;
    • Yiu Ming Cheung, Peter C. K.;
    • Ming Wai Ng, Peter C. K.
    Publication type:
    Article
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