Electrical and Luminescent Properties and the Spectra of Deep Centers in GaMnN/InGaN Light-Emitting Diodes.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 241, doi. 10.1007/s11664-004-0186-7
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- Publication type:
- Article
Works matching IS 03615235 AND DT 2004 AND VI 33 AND IP 3
Results: 13
1
2
Reactive Interdiffusion between a Lead-Free Solder and Ti/Ni/Ag Thin-Film Metallizations.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 229, doi. 10.1007/s11664-004-0185-8
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- Publication type:
- Article
3
Effect of Spin Coating on the Curing Rate of Epoxy Adhesive for the Fabrication of a Polymer Optical Waveguide.
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- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 224, doi. 10.1007/s11664-004-0184-9
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- Publication type:
- Article
4
Study on Cu Particles-Enhanced SnPb Composite Solder.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 218, doi. 10.1007/s11664-004-0183-x
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- Publication type:
- Article
5
Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 171, doi. 10.1007/s11664-004-0176-9
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- Publication type:
- Article
6
Wafer Bonding and Epitaxial Transfer of GaSb-Based Epitaxy to GaAs for Monolithic Interconnection of Thermophotovoltaic Devices.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 213, doi. 10.1007/s11664-004-0182-y
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- Publication type:
- Article
7
Effects of Different Printed-Circuit-Board Surface Finishes on the Formation and Growth of Intermetallics at Thermomechanically Fatigued, Small Outline J Leads/Sn-Ag-Cu Interfaces.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 157, doi. 10.1007/s11664-004-0174-y
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- Publication type:
- Article
8
Pressure Electrical Contact Improved by Carbon Black Paste.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 203, doi. 10.1007/s11664-004-0180-0
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- Publication type:
- Article
9
The Contact Characteristics of SiCN Films for Opto-Electrical Devices Applications.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 181, doi. 10.1007/s11664-004-0177-8
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- Publication type:
- Article
10
Oxygen Segregation and Ge Diffusion in Annealed Oxygen Ion-Implanted Relaxed SiGe/Si Heterostructures.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 207, doi. 10.1007/s11664-004-0181-z
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- Publication type:
- Article
11
A Novel Structure of Woven Continuous-Carbon Fiber Composites with High Electromagnetic Shielding.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 162, doi. 10.1007/s11664-004-0175-x
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- Publication type:
- Article
12
Comparative Study of Electrically Conductive Thick Films with and without Glass.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 194, doi. 10.1007/s11664-004-0179-6
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- Publication type:
- Article
13
Characterization Survey of Ga<sub>x</sub>In<sub>1-x</sub>As/InAs<sub>y</sub>P<sub>1-y</sub> Double Heterostructures and InAs<sub>y</sub>P<sub>1-y</sub> Multilayers Grown on InP.
- Published in:
- Journal of Electronic Materials, 2004, v. 33, n. 3, p. 185, doi. 10.1007/s11664-004-0178-7
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- Publication type:
- Article