Works matching DE "HIGH temperature electronics"

Results: 101

Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 2988, doi. 10.1007/s11664-024-11021-z

By:

Ma, Limin;
Lu, Ziyi;
Jia, Qiang;
Cui, Ze;
Wang, Yishu;
Li, Dan;
Zhang, Hongqiang;
Zou, Guisheng;
Guo, Fu

Publication type:

Article

Growth kinetics of bismuth nickel intermetallics.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19034, doi. 10.1007/s10854-018-0029-6

By:

Sheikhi, Roozbeh;
Cho, Junghyun

Publication type:

Article

Thermoelectric properties of MgSiSb (0 ≤ x ≤ 0.025) synthesized by the high-temperature high-pressure method.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 13, p. 9535, doi. 10.1007/s10854-017-6700-5

By:

Zhu, Yaju;
Li, Jialiang;
Duan, Bo;
Li, Yao;
Zhai, Pengcheng;
Li, Peng

Publication type:

Article

A review of high-temperature electronics technology and applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9226, doi. 10.1007/s10854-015-3459-4

By:

Watson, Jeff;
Castro, Gustavo

Publication type:

Article

Directional fabricating of flexible and compressible cellulose nanofibril composite cryogel with excellent thermal insulation, flame-retardancy and radiative cooling for efficient thermal management.

Published in:

Cellulose, 2022, v. 29, n. 18, p. 9671, doi. 10.1007/s10570-022-04861-7

By:

Zhao, Jiaojiao;
Zhou, Jianhua;
Li, Hong;
Xiao, Anguo

Publication type:

Article

Electrode kinetics at the Pt, O|LaSrScO interface.

Published in:

Journal of Solid State Electrochemistry, 2017, v. 21, n. 8, p. 2457, doi. 10.1007/s10008-017-3593-4

By:

Antonova, E.;
Bronin, D.

Publication type:

Article

Crystal structure and high-temperature electrical conductivity of novel perovskite-related gallium and indium oxides.

Published in:

Journal of Solid State Electrochemistry, 2014, v. 18, n. 5, p. 1415, doi. 10.1007/s10008-013-2190-4

By:

Istomin, S.;
Antipov, E.;
Fedotov, Yu.;
Bredikhin, S.;
Lyskov, N.;
Shafeie, S.;
Svensson, G.;
Liu, Y.;
Shen, Z.

Publication type:

Article

Regulation of Pore Structure and High-temperature Fracture Behavior of CAC-bonded Alumina-Spinel Castables Based on Hydration Design.

Published in:

China's Refractories, 2024, v. 33, n. 3, p. 22, doi. 10.19691/j.cnki.1004-4493.2024.03.004

By:

Wenjing LIU;
Ning LIAO;
Yawei LI

Publication type:

Article

Performance Assessment on Corrosion Resistance of Refractory Materials Based on High-temperature Machine Vision Technology.

Published in:

China's Refractories, 2024, v. 33, n. 3, p. 42, doi. 10.19691/j.cnki.1004-4493.2024.03.007

By:

Chenchen LIU;
Ao HUANG;
Yan YU;
Guoping WEI;
Shenghao LI;
Huazhi GU

Publication type:

Article

PROGRESS TOWARDS BALLOON-BASED SEISMOLOGY ON VENUS IN 2019-2020.

Published in:

LPI Contribution, 2021, p. 1

By:

Krishnamoorthy, S.;
Komjathy, A.;
Pauken, M. T.;
Cutts, J. A.;
Bowman, D. C.;
Brissaud, Q.;
Jackson, J. M.;
Martire, L.;
Chaigneau, Y.;
Garcia, R. F.;
Mimoun, D.;
Izraelevitz, J.

Publication type:

Article

High Temperature Batteries for Venus Surface Missions.

Published in:

LPI Contribution, 2021, p. 1

By:

Glass, Dean;
Jones, John-Paul;
Shevade, Abhijit;
Cutts, James;
Raub, Eric;
Bhakta, Dharmesh;
Bugga, Ratnakumar

Publication type:

Article

HYBRID AUTOMATON ROVER-VENUS.

Published in:

LPI Contribution, 2019, p. 1

By:

SAUDER, J.;
HILGEMANN, E.;
STACK, K.;
KAWATA, J.;
PARNESS, A.;
JOHNSON, M.

Publication type:

Article

HIGH TEMPERATURE DIAMOND ELECTRONICS FOR ACTUATORS AND SENSORS.

Published in:

LPI Contribution, 2019, p. 1

By:

Nemanich, Robert;
Malakoutian, Mohamadali;
Surdi, Harshad;
Benipal, Manpuneet;
Koeck, Franz;
Chowdhury, Srabanti;
Goodnick, Stephen;
Lyons, James

Publication type:

Article

PROGRESS TOWARDS BALLOON-BASED SEISMOLOGY ON VENUS.

Published in:

LPI Contribution, 2019, p. 1

By:

Krishnamoorthy, S.;
Komjathy, A.;
Pauken, M. T.;
Bowman, D. C.;
Cutts, J. A.;
Izraelevitz, J.;
Jackson, J. M.;
Martire, L.;
Garcia, R. F.;
Mimoun, D.

Publication type:

Article

High‐Temperature Oxidation‐Resistant Printed Copper Conductors.

Published in:

Advanced Electronic Materials, 2023, v. 9, n. 3, p. 1, doi. 10.1002/aelm.202200979

By:

Khuje, Saurabh;
Alshatnawi, Firas;
Alhendi, Mohammed;
Yu, Jian;
Sheng, Aaron;
Huang, Yulong;
Zhuang, Cheng‐Gang;
Armstrong, Jason;
Zhou, Chi;
Poliks, Mark;
Ren, Shenqiang

Publication type:

Article

63.4: High-Performance 4K x 2K 65-in. TV with BCE-Type Oxide TFTs.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 943, doi. 10.1002/sdtp.10419

By:

Yeh, Bo-Liang;
Lin, Chun-Nan

Publication type:

Article

51.2: The Development of a High Mobility Zinc Oxynitride TFT for AMOLED.

Published in:

SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 769, doi. 10.1002/sdtp.10213

By:

Yan, Liangchen;
Wang, Meili;
Zhang, Li;
Wang, Dongfang;
Liu, Fengjuan;
Yuan, Guangcai;
Wang, Gang

Publication type:

Article

Investigation of a Quasi-Diamagnetic Machine Based on High-Temperature Superconductor-Based Rotor.

Published in:

Journal of Superconductivity & Novel Magnetism, 2015, v. 28, n. 2, p. 663, doi. 10.1007/s10948-014-2792-9

By:

Racz, Arpad;
Hadur, Andras;
Vajda, Istvan

Publication type:

Article

High-Temperature Superconducting Fiber.

Published in:

Journal of Superconductivity & Novel Magnetism, 2014, v. 27, n. 4, p. 891, doi. 10.1007/s10948-014-2483-6

By:

Homa, Daniel;
Liang, Yongxuan;
Pickrell, Gary

Publication type:

Article

High Temperature Superconductivity in Single-Unit-Cell-FeSe/TiO2-δ.

Published in:

AAPPS Bulletin, 2017, v. 27, n. 4, p. 3

By:

LILI WANG;
QI-KUN XUE

Publication type:

Article

A "Floatilla" of Airborne Seismometers for Venus.

Published in:

Geophysical Research Letters, 2023, v. 50, n. 2, p. 1, doi. 10.1029/2022GL100978

By:

Krishnamoorthy, Siddharth;
Bowman, Daniel C.

Publication type:

Article

AN APPARATUS FOR HIGH-TEMPERATURE GAS PERMEABILITY MEASUREMENTS AND THE EVALUATION OF THE GAS BARRIER PROPERTIES OF CLAY NANOPLATE COATINGS UP TO 160°C.

Published in:

Clay Science, 2021, v. 25, n. 1/2, p. 21, doi. 10.11362/jcssjclayscience.MS-21-3

By:

TAKAFUMI AIZAWA;
TAKEO EBINA;
MUNEHIRO KUBOTA

Publication type:

Article

Thermal imaging system based on a high-temperature superconductor.

Published in:

Instruments & Experimental Techniques, 2013, v. 56, n. 4, p. 485, doi. 10.1134/S0020441213030196

By:

Gordiyenko, E.;
Shustakova, G.;
Fomenko, Yu.;
Glushchuk, N.

Publication type:

Article

Temperature dependence of the thermo-optic coefficient in 4H-SiC and GaN slabs at the wavelength of 1550 nm.

Published in:

Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-08232-x

By:

Rao, Sandro;
Mallemace, Elisa D.;
Cocorullo, Giuseppe;
Faggio, Giuliana;
Messina, Giacomo;
Della Corte, Francesco G.

Publication type:

Article

Improving the thermal and mechanical properties of poly(arylene ether nitrile) films through blending high‐ and low‐molecular‐weight polymers.

Published in:

Journal of Applied Polymer Science, 2020, v. 137, n. 11, p. N.PAG, doi. 10.1002/app.48457

By:

Tong, Lifen;
Yang, Guangyao;
Lei, Xiting;
You, Yong;
Liu, Xiaobo

Publication type:

Article

A Junctionless Silicon Carbide Transistor for Harsh Environment Applications.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5682, doi. 10.1007/s11664-021-09087-0

By:

Baruah, Ratul K.;
Mahajan, Bikram K.;
Chen, Yen-Pu;
Paily, Roy P.

Publication type:

Article

Commercial GaN-Based Power Electronic Systems: A Review.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 11, p. 6247, doi. 10.1007/s11664-020-08397-z

By:

Pushpakaran, Bejoy N.;
Subburaj, Anitha S.;
Bayne, Stephen B.

Publication type:

Article

Electrical Properties of a p-n Heterojunction of Li-Doped NiO and Al-Doped ZnO for Thermoelectrics.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 9, p. 5296, doi. 10.1007/s11664-018-6394-3

By:

Desissa, Temesgen D.;
Schrade, Matthias;
Norby, Truls

Publication type:

Article

Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 1, p. 430, doi. 10.1007/s11664-017-5792-2

By:

Lee, Byung-Suk;
Yoon, Jeong-Won

Publication type:

Article

High-Temperature Thermoelectric Properties of (1 − x) SrTiO − ( x) LaNbO Ceramic Solid Solution.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 6, p. 1803, doi. 10.1007/s11664-014-3560-0

By:

Srivastava, Deepanshu;
Azough, F.;
Molinari, M.;
Parker, S.;
Freer, R.

Publication type:

Article

Unileg Thermoelectric Generator Design for Oxide Thermoelectrics and Generalization of the Unileg Design Using an Idealized Metal.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 6, p. 1834, doi. 10.1007/s11664-014-3569-4

By:

Wijesekara, Waruna;
Rosendahl, Lasse;
Brown, David;
Snyder, G.

Publication type:

Article

Reliability Investigation of Cu/In TLP Bonding.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 1, p. 435, doi. 10.1007/s11664-014-3373-1

By:

Lee, Jong-Bum;
Hwang, How-Yuan;
Rhee, Min-Woo

Publication type:

Article

Single-Step Gas-Phase Polyperfluoroalkylation of Naphthalene Leads to Thermodynamic Products.

Published in:

Chemistry - A European Journal, 2014, v. 20, n. 15, p. 4373, doi. 10.1002/chem.201304554

By:

San, Long K.;
Bukovsky, Eric V.;
Kuvychko, Igor V.;
Popov, Alexey A.;
Strauss, Steven H.;
Boltalina, Olga V.

Publication type:

Article

Transient liquid phase bonding method of SnIn for high-temperature packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 19, p. 1, doi. 10.1007/s10854-024-13079-1

By:

Wang, Jianhao;
Yao, Yuyuan;
Jin, Haibin;
Wang, Shuiqing

Publication type:

Article

Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 24, p. 1, doi. 10.1007/s10854-023-11083-5

By:

Chen, Haixue;
Wang, Xinyue;
Zeng, Zejun;
Zhang, Guoqi;
Zhang, Jing;
Liu, Pan

Publication type:

Article

Waterproof wearable sensing electronics of thin film with high stretchability, high temperature sensitivity and low cost.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22654, doi. 10.1007/s10854-021-06750-4

By:

Xu, Jin;
Yin, Yuning;
Chen, Haoran

Publication type:

Article

Thermal Characterization of Multi‐Layer Graphene Heat Spreader by Pt/Cu/Ti Micro‐Coil.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2021, v. 218, n. 22, p. 1, doi. 10.1002/pssa.202100301

By:

Abdullah, Mohd Faizol;
Bulya Nazim, Nur Julia Nazim;
Soriadi, Nurhidaya;
Mohamad Badaruddin, Siti Aishah;
Mat Hussin, Mohd Rofei;
Syono, Mohd Ismahadi

Publication type:

Article

Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics.

Published in:

Applied Physics A: Materials Science & Processing, 2019, v. 125, n. 8, p. N.PAG, doi. 10.1007/s00339-019-2884-2

By:

Chen, Biqiang;
Chen, Zhong;
Du, Zehui;
Zhang, Guifeng

Publication type:

Article

Impact of Wide-Bandgap Technology on Renewable Energy and Smart-Grid Power Conversion Applications Including Storage.

Published in:

Energies (19961073), 2019, v. 12, n. 23, p. 4462, doi. 10.3390/en12234462

By:

Castellazzi, Alberto;
Gurpinar, Emre;
Wang, Zhenyu;
Suliman Hussein, Abdallah;
Garcia Fernandez, Pablo

Publication type:

Article

TRANSIENT ANALYSIS OF DEPRESSURIZED LOSS-OF-FORCED-CIRCULATION ACCIDENT WITHOUT SCRAM IN HIGH-TEMPERATURE GAS-COOLED REACTOR.

Published in:

Nuclear Technology, 2014, v. 185, n. 3, p. 227, doi. 10.13182/NT13-97

By:

HIROYUKI SATO;
XING L. YAN;
YUKIO TACHIBANA;
KAZUHIKO KUNITOMI;
YUKITAKA KATO

Publication type:

Article

71% PAE C-band GaN power amplifier using harmonic tuning technology.

Published in:

Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 17, p. 1207, doi. 10.1049/el.2014.2092

By:

Yang Lu;
Mengyi Cao;
Jiaxing Wei;
Bochao Zhao;
Xiaohua Ma;
Yue Hao

Publication type:

Article

Coefficients of Thermal Expansion of Al- and Y-Substituted NaSICON Solid Solution Na3+2xAlxYxZr2-2xSi2PO12.

Published in:

Batteries, 2018, v. 4, n. 3, p. 1, doi. 10.3390/batteries4030033

By:

Naqash, Sahir;
Gerhards, Marie-Theres;
Tietz, Frank;
Guillon, Olivier

Publication type:

Article

Electrically Active Defects in 3C, 4H, and 6H Silicon Carbide Polytypes: A Review.

Published in:

Crystals (2073-4352), 2025, v. 15, n. 3, p. 255, doi. 10.3390/cryst15030255

By:

Capan, Ivana

Publication type:

Article

Special Issue "Technologies for Future Distributed Engine Control Systems".

Published in:

Aerospace (MDPI Publishing), 2021, v. 8, n. 12, p. 379, doi. 10.3390/aerospace8120379

By:

Przysowa, Radoslaw

Publication type:

Article

Superconducting emitters of THz radiation.

Published in:

Nature Photonics, 2013, v. 7, n. 9, p. 702, doi. 10.1038/nphoton.2013.216

By:

Welp, Ulrich;
Kadowaki, Kazuo;
Kleiner, Reinhold

Publication type:

Article

Durability Testing of a High-Temperature Steam Electrolyzer Stack at 700 °C.

Published in:

Fuel Cells, 2014, v. 14, n. 3, p. 395, doi. 10.1002/fuce.201300150

By:

Fu, Q.;
Schefold, J.;
Brisse, A.;
Nielsen, J. U.

Publication type:

Article

Corundum Refractory Material in Alumina-Binder Resistant to High-Temperature Deformation.

Published in:

Refractories & Industrial Ceramics, 2018, v. 59, n. 1, p. 85, doi. 10.1007/s11148-018-0187-3

By:

Pletnev, P. M.;
Pogrebenkov, V. M.;
Vereshchagin, V. I.;
Tyul’kin, D. S.

Publication type:

Article

Contemporary Methods for Modeling High-Temperature Systems1.

Published in:

Refractories & Industrial Ceramics, 2018, v. 59, n. 1, p. 71, doi. 10.1007/s11148-018-0185-5

By:

Kushnerev, I. V.;
Aksel’rod, L. M.;
Platonov, A. A.

Publication type:

Article

An Integrated Charge Pump for Phase-Locked Loop Applications in Harsh Environments.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 4, p. 744, doi. 10.3390/electronics13040744

By:

Mestice, Marco;
Ciarpi, Gabriele;
Rossi, Daniele;
Saponara, Sergio

Publication type:

Article

Polymer/molecular semiconductor all-organic composites for high-temperature dielectric energy storage.

Published in:

Nature Communications, 2020, v. 11, n. 1, p. 1, doi. 10.1038/s41467-020-17760-x

By:

Yuan, Chao;
Zhou, Yao;
Zhu, Yujie;
Liang, Jiajie;
Wang, Shaojie;
Peng, Simin;
Li, Yushu;
Cheng, Sang;
Yang, Mingcong;
Hu, Jun;
Zhang, Bo;
Zeng, Rong;
He, Jinliang;
Li, Qi

Publication type:

Article