Works matching DE "EUTECTIC alloys"

Results: 960

Investigation of the Microstructural Evolution and Mechanical Properties of the AlCoCrFeNi 2.1 EHEA Fabricated by Additive Manufacturing Assisted by Heat Treatment.

Published in:

Materials (1996-1944), 2025, v. 18, n. 10, p. 2330, doi. 10.3390/ma18102330

By:

Zhang, Xin;
Feng, Wenxin;
Jia, Fanghui;
Liu, Wanhui;
Wang, Jian;
Zhu, Lisong;
Cai, Yangchuan

Publication type:

Article

Effects of Interaction Between Sn-Rich and Pb-Rich Phases on the Mechanical Properties of Sn-Pb Eutectic Solder Alloy at Cryogenic Temperature.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2368, doi. 10.1007/s11664-024-11694-6

By:

An, Qi;
Zhang, Minghua;
Wang, Ningning;
Fei, Jingming

Publication type:

Article

Long-Term Microstructural Stability of Sn-40Bi and Sn-40Bi-10In Alloys.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2455, doi. 10.1007/s11664-024-10995-0

By:

Spinelli, José E.;
Leal, Jaderson R.;
Wu, John A.;
Luktuke, Amey;
Ganju, Eshan;
Chawla, Nikhilesh

Publication type:

Article

Replacing AgTSSCH2-R with AgTSO2C-R in EGaIn-Based Tunneling Junctions Does Not Significantly Change Rates of Charge Transport.

Published in:

Angewandte Chemie, 2014, v. 126, n. 15, p. 3970, doi. 10.1002/ange.201308472

By:

Liao, Kung-Ching;
Yoon, Hyo Jae;
Bowers, Carleen M.;
Simeone, Felice C.;
Whitesides, George M.

Publication type:

Article

The influence of Li on the thermophysical properties of liquid Ga–Sn–Zn eutectic alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18970, doi. 10.1007/s10854-019-02254-4

By:

Dobosz, A.;
Plevachuk, Yu.;
Sklyarchuk, V.;
Sokoliuk, B.;
Gancarz, T.

Publication type:

Article

Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18524, doi. 10.1007/s10854-019-02206-y

By:

Wang, Z.;
Zhang, Q. K.;
Chen, Y. X.;
Song, Z. L.

Publication type:

Article

Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7423, doi. 10.1007/s10854-019-01056-y

By:

Zhou, Shiqi;
Shen, Yu-An;
Uresti, Tiffani;
Shunmugasamy, Vasanth C.;
Mansoor, Bilal;
Nishikawa, Hiroshi

Publication type:

Article

Piezoelectricity, piezoresistivity and dielectricity discovered in solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4462, doi. 10.1007/s10854-019-00735-0

By:

Xi, Xiang;
Chung, D. D. L.

Publication type:

Article

Early stages of wetting of copper by Sn-Zn eutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 24, p. 20531, doi. 10.1007/s10854-018-0197-4

By:

Pstruś, J.

Publication type:

Article

Low temperature and low pressure bonding of plateless Cu-Cu substrates by Ag-based transient liquid phase sintering.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 13, p. 9351, doi. 10.1007/s10854-017-6674-3

By:

Muhammad, Khairi Faiz;
Yamamoto, Takehiro;
Yoshida, Makoto

Publication type:

Article

Harsh service environment effects on the microstructure and mechanical properties of Sn-Ag-Cu-1 wt% nano-Al solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 11, p. 11273, doi. 10.1007/s10854-016-5250-6

By:

Gain, Asit;
Zhang, Liangchi

Publication type:

Article

Erratum to: Study of off-eutectic Zn-xMg high temperature solder alloys.

Published in:

2016

By:

Galib, Roisul;
Hasan, Rahat;
Sharif, Ahmed

Publication type:

Erratum

Performance and stability of PTB7:PCBM based polymer solar cells, with ECZ and/or PVK dopants, under the application of an external electric field.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6271, doi. 10.1007/s10854-016-4559-5

By:

Álvarez-Fernández, Armando;
Maldonado, José-Luis;
Pérez-Gutiérrez, Enrique;
Rodríguez, Mario;
Ramos-Ortíz, Gabriel;
Barbosa-García, Oracio;
Meneses-Nava, Marco-Antonio;
Zolotukhin, Mikhail

Publication type:

Article

Microstructure and fracture behavior of non eutectic Sn-Bi solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3182, doi. 10.1007/s10854-015-4143-4

By:

Lai, Zhongmin;
Ye, Dan

Publication type:

Article

Fluidity of Sn-based eutectic solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9478, doi. 10.1007/s10854-015-3415-3

By:

Morando, Carina;
Fornaro, Osvaldo;
Garbellini, Olga;
Palacio, Hugo

Publication type:

Article

Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn-0.7Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 345, doi. 10.1007/s10854-014-2406-0

By:

Zhao, N.;
Huang, M.;
Zhong, Y.;
Ma, H.;
Pan, X.

Publication type:

Article

Comparative corrosion behaviour of different Sn-based solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 1, p. 464, doi. 10.1007/s10854-014-2422-0

By:

Farina, Silvia;
Morando, Carina

Publication type:

Article

Composition control of co-electroplating Au-Sn deposits using experimental strategies.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4933, doi. 10.1007/s10854-014-2254-y

By:

Huang, M.;
Huang, F.;
Pan, J.;
Zhang, T.

Publication type:

Article

The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1446, doi. 10.1007/s10854-014-1749-x

By:

Sona, Mrunali;
Prabhu, K.

Publication type:

Article

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 478, doi. 10.1007/s10854-013-1612-5

By:

Spinelli, José;
Garcia, Amauri

Publication type:

Article

A simple process for electrodeposition of Sn-rich, Au-Sn solder films.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 2, p. 827, doi. 10.1007/s10854-012-0828-0

By:

Watt, Charles;
Liu, Qi;
Ivey, Douglas

Publication type:

Article

Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 5, p. 1108, doi. 10.1007/s10854-011-0557-9

By:

Han, Y.;
Jing, H.;
Nai, S.;
Xu, L.;
Tan, C.;
Wei, J.

Publication type:

Article

The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn-3.5Ag eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 484, doi. 10.1007/s10854-011-0422-x

By:

Şahin, Mevlüt;
Çadirli, Emin

Publication type:

Article

Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 31, doi. 10.1007/s10854-011-0398-6

By:

Çadırlı, E.;
Şahin, M.

Publication type:

Article

Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn-0.7%Cu alloy from melt.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 94, doi. 10.1007/s10854-011-0469-8

By:

Negm, Samia

Publication type:

Article

Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 11, p. 1709, doi. 10.1007/s10854-011-0350-9

By:

Çadırlı, E.;
Şahin, M.;
Kayalı, R.;
Arı, M.;
Durmuş, S.

Publication type:

Article

Shear strength of the Zn-Sn high-temperature lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 8, p. 1168, doi. 10.1007/s10854-010-0279-4

By:

Mahmudi, R.;
Eslami, M.

Publication type:

Article

A novel method of reducing melting temperatures in SnAg and SnCu solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 3, p. 281, doi. 10.1007/s10854-010-0128-5

By:

Chukka, Rami N.;
Telu, Suresh;
NRMR, Bhargava;
Chen, Lang

Publication type:

Article

Effect of rare earth element additions on the impression creep of Sn–9Zn solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 58, doi. 10.1007/s10854-009-9870-y

By:

Mahmudi, R.;
Geranmayeh, A. R.;
Zahiri, B.;
Marvasti, M. H.

Publication type:

Article

Stability of AuSn eutectic solder cap on Au socket during reflow.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 1, p. 55, doi. 10.1007/s10854-008-9606-4

By:

Yu, D. Q.;
Oppermann, H.;
Kleff, J.;
Hutter, M.

Publication type:

Article

Coarsening of eutectic silicon in squeeze-cast alumina fiber reinforced eutectic Al—Si aluminum composites.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 12, p. 861, doi. 10.1023/A:1024442115668

By:

Xue-Xi Zhang;
De-Zun Wang;
Lin Geng

Publication type:

Article

Validation of the applicability of a creep model for directionally solidified eutectics with a lamellar microstructure.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2016, v. 16, n. 1, p. 297, doi. 10.1002/pamm.201610137

By:

Albiez, Jürgen;
Sprenger, Ioannis;
Weygand, Daniel;
Heilmaier, Martin;
Böhlke, Thomas

Publication type:

Article

One-dimensional simulation of the creep behavior of directionally solidified NiAl-9Mo.

Published in:

PAMM: Proceedings in Applied Mathematics & Mechanics, 2015, v. 15, n. 1, p. 269, doi. 10.1002/pamm.201510125

By:

Albiez, Jürgen;
Sprenger, Ioannis;
Heilmaier, Martin;
Böhlke, Thomas

Publication type:

Article

The electrodeposition of Zn-Ti alloys from ZnCl-urea deep eutectic solvent.

Published in:

Journal of Solid State Electrochemistry, 2014, v. 18, n. 8, p. 2149, doi. 10.1007/s10008-014-2468-1

By:

Xu, Cunying;
Wu, Qing;
Hua, Yixin;
Li, Jian

Publication type:

Article

Investigation of Al-Si-Cu-Zn-Y-Base Alloy Powders Prepared by Ultrasonic Gas Atomization for Brazing of an Al-Base Alloy.

Published in:

Strength of Materials, 2021, v. 53, n. 4, p. 591, doi. 10.1007/s11223-021-00321-y

By:

Sheng, L. Y.;
Zhao, H.

Publication type:

Article

Influence of Tantalum Addition on Microstructure and Mechanical Properties of the Nial-Based Eutectic Alloy.

Published in:

Strength of Materials, 2017, v. 49, n. 1, p. 109, doi. 10.1007/s11223-017-9848-6

By:

Sheng, L.;
Du, B.;
Lai, C.;
Guo, J.;
Xi, T.

Publication type:

Article

New Fixed Point for an in-Orbit Calibration Scale Developed on the Basis of In–Bi Eutectic Alloy for Use in New-Generation Highly Stable Onboard Reference Sources.

Published in:

Measurement Techniques, 2021, v. 64, n. 1, p. 34, doi. 10.1007/s11018-021-01892-7

By:

Burdakin, A. A.;
Gavrilov, V. R.;
Us, E. A.;
Bormashov, V. S.

Publication type:

Article

Realization of High-Temperature Reference Point of the Temperature Scale for the Phase Transition of a δMoC–C Metal-Carbon Compound.

Published in:

Measurement Techniques, 2019, v. 61, n. 12, p. 1159, doi. 10.1007/s11018-019-01564-7

By:

Khlevnoy, B. B.;
Grigor'eva, I. A.;
Ivashin, E. A.;
Ogarev, S. A.;
Sapritsky, V. I.

Publication type:

Article

High-Temperature Blackbody Models for Use in Photometry, Radiometry, and Radiation Thermometry.

Published in:

Measurement Techniques, 2016, v. 58, n. 11, p. 1255, doi. 10.1007/s11018-016-0880-x

By:

Ogarev, S.;
Khlevnoi, B.;
Samoilov, M.;
Otryaskin, D.;
Grigor'eva, I.;
Solodilov, M.;
Sapritskii, V.

Publication type:

Article

Methods of filling high-temperature fixed-point cells based on eutectic alloys.

Published in:

Measurement Techniques, 2012, v. 55, n. 8, p. 936, doi. 10.1007/s11018-012-0064-2

By:

Sild, Yu.

Publication type:

Article

The dependence of the phase transition temperature of Ga–Zn eutectic alloy on its morphology.

Published in:

Measurement Techniques, 2009, v. 52, n. 1, p. 52, doi. 10.1007/s11018-009-9229-z

By:

A. Ivanova;
S. Gerasimov

Publication type:

Article

The use of fixed points based on metal-carbon eutectic alloys to increase the accuracy of measurements in the temperature range above 1357.77 K.

Published in:

Measurement Techniques, 2007, v. 50, n. 2, p. 179, doi. 10.1007/s11018-007-0043-1

By:

M. Sakharov

Publication type:

Article

Thermoelectric properties of a eutectic SnSe-BiSe alloy.

Published in:

Inorganic Materials, 2015, v. 51, n. 2, p. 93, doi. 10.1134/S0020168515010082

By:

Kozma, A.;
Sabov, M.;
Peresh, E.;
Barchiy, I.;
Tsygyka, V.

Publication type:

Article

Growth of magnetic eutectic GaSb-MnSb films by pulsed laser deposition.

Published in:

Inorganic Materials, 2014, v. 50, n. 9, p. 897, doi. 10.1134/S0020168514090076

By:

Marenkin, S.;
Novodvorsky, O.;
Shorokhova, A.;
Davydov, A.;
Aronzon, B.;
Kochura, A.;
Fedorchenko, I.;
Khramova, O.;
Timofeev, A.

Publication type:

Article

X-ray diffraction study of the NaF-LiF-NdF eutectic in the liquid and solid states.

Published in:

Inorganic Materials, 2013, v. 49, n. 8, p. 844, doi. 10.1134/S0020168513070170

By:

Sokol'skii, V.;
Roik, A.;
Davidenko, A.;
Faidyuk, N.;
Savchuk, R.

Publication type:

Article

Barothermal analysis and structure of the eutectic Al-Ni (2.7 at % Ni) alloy.

Published in:

Inorganic Materials, 2012, v. 48, n. 6, p. 582, doi. 10.1134/S0020168512060143

By:

Padalko, A.;
Talanova, G.;
Ponomareva, E.;
Talyat-Kelpsh, V.;
Shvorneva, L.;
Zubarev, G.;
Fedotov, V.;
Suchkov, A.;
Baklan, V.

Publication type:

Article

Structure of near-eutectic Bi-Zn liquid alloys.

Published in:

Inorganic Materials, 2012, v. 48, n. 6, p. 635, doi. 10.1134/S002016851206012X

By:

Mudry, S.;
Shevernoga, I.

Publication type:

Article

Chemical interaction of the In-Ga eutectic with Al and Al-base alloys.

Published in:

Inorganic Materials, 2006, v. 42, n. 3, p. 256, doi. 10.1134/S0020168506030083

By:

Trenikhin, M.;
Bubnov, A.;
Nizovskii, A.;
Duplyakin, V.

Publication type:

Article

Carrier Mobility in GaSb–V2Ga5 and GaSb–GaV3Sb5 Eutectic Alloys.

Published in:

Inorganic Materials, 2003, v. 39, n. 6, p. 568, doi. 10.1023/A:1024088817440

By:

Isakov, G. I.

Publication type:

Article

INFLUENCE OF ANODIC TREATMENT OF A COPPER-NICKEL ALLOY IN A EUTECTIC MIXTURE OF CHOLINE CHLORIDE AND UREA ON THE SURFACE MORPHOLOGY AND ELECTROCATALYTIC BEHAVIOR IN THE HYDROGEN EVOLUTION REACTION.

Published in:

Issues of Chemistry & Chemical Technology / Voprosy Khimii & Khimicheskoi Tekhnologii, 2024, n. 3, p. 136, doi. 10.32434/0321-4095-2024-154-3-136-144

By:

Protsenko, V. S.;
Makhota, D. O.;
Butyrina, T. E.;
Korniy, S. A.;
Danilov, F. I.

Publication type:

Article