Works matching DE "THERMAL interface materials"

Results: 360

Improved diamond particle reactivity by alumina coating.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 249, doi. 10.1177/02670844241302995

By:

Ishida, H.;
Shibuta, K.;
Groner, M.

Publication type:

Article

Structural and Surface Morphological Study of rGO/Polystyrene Composites.

Published in:

Macromolecular Symposia, 2021, v. 399, n. 1, p. 1, doi. 10.1002/masy.202100044

By:

Srivastava, Nisha;
Jain, Ankur;
Sharma, K. B.;
Tripathi, Balram

Publication type:

Article

Covalently Bonded Graphene-Carbon Nanotube Hybrid for High-Performance Thermal Interfaces.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 48, p. 7539, doi. 10.1002/adfm.201501593

By:

Chen, Jie;
Walther, Jens H.;
Koumoutsakos, Petros

Publication type:

Article

A Pyrenylpropyl Phosphonic Acid Surface Modifier for Mitigating the Thermal Resistance of Carbon Nanotube Contacts.

Published in:

Advanced Functional Materials, 2014, v. 24, n. 4, p. 465, doi. 10.1002/adfm.201301714

By:

Taphouse, John H.;
Smith, O'Neil L.;
Marder, Seth R.;
Cola, Baratunde A.

Publication type:

Article

Indium thermal interface material microstructure as a function of thermal history and bonding metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22810, doi. 10.1007/s10854-022-09048-1

By:

McClure, Peter;
Wang, Yujia

Publication type:

Article

Interfacial reactions between pure indium solder and Au/Ni metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13143, doi. 10.1007/s10854-022-08253-2

By:

Huang, Li-Chi;
Zhang, Yan-Ping;
Chen, Chih-Ming;
Hung, Liang-Yih;
Wang, Yu-Po

Publication type:

Article

Influence of composition ratio on the thermal performance of AlNB nanocomposite for an efficient heat spreading in solid-state lighting package (LED).

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 4, p. 2183, doi. 10.1007/s10854-021-07425-w

By:

El-ladan, Abdulkarim Hamza;
Subramani, Shanmugan

Publication type:

Article

Thermally conductive composite phase change materials with excellent thermal management capability for electronic devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 2, p. 1008, doi. 10.1007/s10854-021-07371-7

By:

Han, Dong-Lin;
Yang, Lu-Yao;
Wang, Shuai-Peng;
Zeng, Xian-Qing;
Tang, Lei;
Liu, Kai;
Liang, Kun;
Shen-Tu, Hong-Qian;
Guo, Lin-Qing;
Bai, Lu;
Huang, Yu-Chuan

Publication type:

Article

Robust PU foam skeleton coated with hydroxylated BN as PVA thermal conductivity filler via microwave-assisted curing.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27524, doi. 10.1007/s10854-021-07127-3

By:

Wang, Wenbo;
Liu, Botao;
Lv, Xiaomeng

Publication type:

Article

Nanostructures multilayer MgO/ZnO thin film thermal interface material for LED applications: Thermal, optical, and surface temperature performance.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16008, doi. 10.1007/s10854-021-06151-7

By:

Idris, Muhammad Sani;
Subramani, Shanmugan

Publication type:

Article

Thermal interface materials for cooling microelectronic systems: present status and future challenges.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 9, p. 11339, doi. 10.1007/s10854-021-05635-w

By:

Pathumudy, Ramakrishna Devananda;
Prabhu, K. Narayan

Publication type:

Article

Synthesis and analysis of anodic aluminum oxide-nanopore structure on Al substrates for efficient thermal management in electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 12, p. 9641, doi. 10.1007/s10854-020-03507-3

By:

Sundararajan, Muralidharan;
Subramani, Shanmugan;
Devarajan, Mutharasu;
Jaafar, Mariatti

Publication type:

Article

Comprehensive excellent performance for silicone-based thermal interface materials through the synergistic effect between graphene and spherical alumina.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 6, p. 4642, doi. 10.1007/s10854-020-03016-3

By:

Chen, Cheng;
He, Yan;
Liu, Changqing;
Xie, Huaqing;
Yu, Wei

Publication type:

Article

Growth of star gooseberry-like nickel–phosphorus films on aluminium as thermal interface material for light-emitting diode application.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14156, doi. 10.1007/s10854-019-01783-2

By:

Ramar, Alagar;
Mutharasu, Devarajan;
Puurnaraj, Nadarajah

Publication type:

Article

Thermal contact resistance of various carbon nanomaterial-based epoxy composites developed for thermal interface applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10630, doi. 10.1007/s10854-019-01408-8

By:

Raza, Mohsin Ali;
Westwood, Aidan

Publication type:

Article

Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10233, doi. 10.1007/s10854-019-01360-7

By:

Yu, Zifeng;
Wei, Song;
Guo, Jingdong

Publication type:

Article

Investigation on enhancing the thermal conductance of gallium-based thermal interface materials using chromium-coated diamond particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 7194, doi. 10.1007/s10854-019-01038-0

By:

Wei, S.;
Yu, Z. F.;
Zhou, L. J.;
Guo, J. D.

Publication type:

Article

Graphite nanoplatelet/rubbery epoxy composites as adhesives and pads for thermal interface applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 10, p. 8822, doi. 10.1007/s10854-018-8900-z

By:

Raza, Mohsin Ali;
Westwood, Aidan;
Stirling, Chris

Publication type:

Article

Analytical thermal stress model for a typical flip-chip (FC) package design.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 2676, doi. 10.1007/s10854-017-8194-6

By:

Suhir, E.

Publication type:

Article

Low temperature produced calcium-doped zinc oxide thick film via screen printing technique as thermal interface material in LED application.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13371, doi. 10.1007/s10854-017-7174-1

By:

Wen, Mah;
Subramani, Shanmugan;
Devarajan, Mutharasu;
Sulaiman, Fauziah

Publication type:

Article

Improved thermal and mechanical properties of aluminium oxide filled epoxy composites by reinforcing milled carbon fiber by partial replacement method.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13487, doi. 10.1007/s10854-017-7188-8

By:

Permal, Anithambigai;
Devarajan, Mutharasu;
Hung, Huong;
Zahner, Thomas;
Lacey, David;
Ibrahim, Kamarulazizi

Publication type:

Article

Investigation of rheological, structural, surface, optical and thermal properties of low temperature produced silver doped ZnO thick film as thermal interface material in lighting application.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 14, p. 10112, doi. 10.1007/s10854-017-6773-1

By:

Wen, Mah;
Subramani, Shanmugan;
Devarajan, Mutharasu;
Sulaiman, Fauziah

Publication type:

Article

Potential thermally conductive alumina filled epoxy composite for thermal management of high power LEDs.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 856, doi. 10.1007/s10854-016-5600-4

By:

Anithambigai, P.;
Dheepan Chakravarthii, M.;
Mutharasu, D.;
Kamarulazizi, I.;
Huong, L.;
Lacey, D.;
Zahner, T.

Publication type:

Article

Synthesis and thermal analysis of aluminium nitride filled epoxy composites and its effective application as thermal interface material for LED applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 11, p. 4814, doi. 10.1007/s10854-014-2238-y

By:

Anithambigai, P.;
Mutharasu, D.;
Huong, L.;
Lacey, D.;
Zahner, T.

Publication type:

Article

Development of the production technology of a new highly effective thermal grease.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 126, n. 1/2, p. 709, doi. 10.1007/s00170-023-11149-y

By:

Roman, Shishkin

Publication type:

Article

Fabrication of copper powder hybrid supported fillers with interconnected 1D/2D/3D nanostructures for enhanced thermal interface materials properties.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 5/6, p. 3453, doi. 10.1007/s00170-022-09551-z

By:

Wu, Shao-Wei;
Chang, Tien-Chan;
Lin, Yu-Hsuan;
Chen, Hsuan-Fan;
Fuh, Yiin-Kuen

Publication type:

Article

A review of thermal interface material fabrication method toward enhancing heat dissipation.

Published in:

International Journal of Energy Research, 2021, v. 45, n. 3, p. 3548, doi. 10.1002/er.6078

By:

Bahru, Raihana;
Zamri, Mohd Faiz Muaz Ahmad;
Shamsuddin, Abd Halim;
Shaari, Norazuwana;
Mohamed, Mohd Ambri

Publication type:

Article

Enhancement of thermal interface material properties using carbon nanotubes through simple electrophoretic deposition method.

Published in:

International Journal of Energy Research, 2020, v. 44, n. 6, p. 4944, doi. 10.1002/er.5221

By:

Bahru, Raihana;
Mohamed, Mohd Ambri

Publication type:

Article

Allotrope carbon materials in thermal interface materials and fuel cell applications: A review.

Published in:

International Journal of Energy Research, 2020, v. 44, n. 4, p. 2471, doi. 10.1002/er.5077

By:

Bahru, Raihana;
Shaari, Norazuwana;
Mohamed, Mohd Ambri

Publication type:

Article

BUSINESS & INDUSTRY.

Published in:: CoatingsTech, 2023, v. 20, n. 6, p. 10
Publication type:: Article

Arkema Acquires Polytec PT.

Published in:: CoatingsTech, 2023, v. 20, n. 4, p. 14
Publication type:: Article

WACKER INAUGURATES GLOBAL COMPETENCE CENTER FOR THERMAL INTERFACE MATERIALS IN SHANGHAI.

Published in:: CoatingsTech, 2020, v. 17, n. 10, p. 10
Publication type:: Article

AKZONOBEL RECEIVES BOEING APPROVAL FOR COLOR BLENDING IN CHINA.

Published in:: CoatingsTech, 2020, v. 17, n. 10, p. 9
Publication type:: Article

Study of microstructure, hardness and thermal properties of Sn-Bi alloys.

Published in:

Chemical Industry / Hemijska Industrija, 2021, v. 75, n. 4, p. 227, doi. 10.2298/hemind210119021b

By:

Božinović, Kristina N.;
Manasijević, Dragan M.;
Balanović, Ljubiša T.;
Gorgievski, Milan D.;
Stamenković, Uroš S.;
Marković, Miljan S.;
Mladenović, Zoran D.

Publication type:

Article

Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge.

Published in:

Nature Communications, 2024, v. 15, n. 1, p. 1, doi. 10.1038/s41467-024-47147-1

By:

Zhan, Ke;
Chen, Yucong;
Xiong, Zhiyuan;
Zhang, Yulun;
Ding, Siyuan;
Zhen, Fangzheng;
Liu, Zhenshi;
Wei, Qiang;
Liu, Minsu;
Sun, Bo;
Cheng, Hui-Ming;
Qiu, Ling

Publication type:

Article

Study of Cooling Performance of Liquid-Cooled EV Battery Module According to the TIM Compression Ratio.

Published in:

International Journal of Automotive Technology, 2025, v. 26, n. 2, p. 359, doi. 10.1007/s12239-024-00167-8

By:

Gu, Jahun;
Kim, Heung-Kyu;
Jang, Siyoul

Publication type:

Article

Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi-Directional Thermal Conduction.

Published in:

Nano-Micro Letters, 2024, v. 16, n. 1, p. 1, doi. 10.1007/s40820-024-01426-0

By:

Yu, Huitao;
Peng, Lianqiang;
Chen, Can;
Qin, Mengmeng;
Feng, Wei

Publication type:

Article

A Thermochromic, Viscoelastic Nacre-like Nanocomposite for the Smart Thermal Management of Planar Electronics.

Published in:

Nano-Micro Letters, 2023, v. 15, n. 1, p. 1, doi. 10.1007/s40820-023-01149-8

By:

Wang, Jiemin;
Yang, Tairan;
Wang, Zequn;
Sun, Xuhui;
An, Meng;
Liu, Dan;
Zhao, Changsheng;
Zhang, Gang;
Lei, Weiwei

Publication type:

Article

Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction.

Published in:

Nano-Micro Letters, 2022, v. 15, n. 1, p. 1, doi. 10.1007/s40820-022-00979-2

By:

Dai, Wen;
Ren, Xing-Jie;
Yan, Qingwei;
Wang, Shengding;
Yang, Mingyang;
Lv, Le;
Ying, Junfeng;
Chen, Lu;
Tao, Peidi;
Sun, Liwen;
Xue, Chen;
Yu, Jinhong;
Song, Chengyi;
Nishimura, Kazuhito;
Jiang, Nan;
Lin, Cheng-Te

Publication type:

Article

THERMAL DEBURRING BY SIDE RAPID REDUCTION-OXIDATION.

Published in:

Annals of 'Constantin Brancusi' University of Targu-Jiu. Engineering Series / Analele Universităţii Constantin Brâncuşi din Târgu-Jiu. Seria Inginerie, 2011, n. 1, p. 84

By:

Popescu, Gheorghe;
Stăncioiu, Alin

Publication type:

Article

EXPERIMENTAL STUDIES ON SELECTED THERMAL INTERFACE MATERIALS.

Published in:

Thermal Science, 2024, v. 28, n. 4A, p. 2857, doi. 10.2298/TSCI230911284A

By:

ASIF, Mohammad;
HUSAIN, Saddam;
REHMAN, Sanaur;
HUSSAIN, Taliv;
MOHD, Rafiuddin

Publication type:

Article

PREDICTION OF THE CONTACT THERMAL RESISTANCE OF VERTICAL CARBON NANOTUBE ARRAYS.

Published in:

Thermal Science, 2020, v. 24, n. 2A, p. 745, doi. 10.2298/TSCI180625289S

By:

Bo SHI;
Han ZHANG;
Jin ZHANG

Publication type:

Article

Enhanced Thermal Conductivity of Polyimide Insulation Materials Through Boron Nitride Nanosheets Modified by Silver Nanoparticles.

Published in:

NANO (1793-2920), 2022, v. 17, n. 10, p. 1, doi. 10.1142/S1793292022500722

By:

Liu, Peidong;
Hu, Xiaodan;
Wu, Xinjian;
Zhong, Yining;
Song, Shihui;
Chang, Shuquan;
Zhang, Haiqian;
Zhang, Xiaohong

Publication type:

Article

Synergistic enhancement of thermal conductivity in thermal interface materials by fabricating 3D‐BN‐ZnO scaffolds.

Published in:

Polymer Engineering & Science, 2022, v. 62, n. 5, p. 1641, doi. 10.1002/pen.25952

By:

Fang, Hui;
Chen, Anlin;
Zhang, Lingjie;
Chen, Sheng;
Wu, Fangjuan;
Chen, Hui

Publication type:

Article

Effect of pulse width on the accuracy of thermal diffusivity of graphite films with high thermal conductivity.

Published in:

Journal of Thermal Analysis & Calorimetry, 2024, v. 149, n. 3, p. 1029, doi. 10.1007/s10973-023-12762-5

By:

Zhang, Yingjie;
Wang, Zihan;
Liu, Yue;
Li, Chao;
Chen, Bin;
Zhu, Gang;
Sun, Lixian;
He, Guanghui

Publication type:

Article

Hybrid carbon thermal interface materials for thermoelectric generator devices.

Published in:

Scientific Reports, 2020, v. 10, n. 1, p. N.PAG, doi. 10.1038/s41598-020-75976-9

By:

Chung, Seok-Hwan;
Kim, Jong Tae;
Kim, Dong Hwan

Publication type:

Article

Crustal structure of Sicily from modelling of gravity and magnetic anomalies.

Published in:

Scientific Reports, 2020, v. 10, n. 1, p. N.PAG, doi. 10.1038/s41598-020-72849-z

By:

Milano, M.;
Kelemework, Y.;
La Manna, M.;
Fedi, M.;
Montanari, D.;
Iorio, M.

Publication type:

Article

OPTIMISATION OF A MICROELECTRONIC ASSEMBLY PACKAGE USING RESPONSE SURFACE METHODOLOGY.

Published in:

Nigerian Journal of Technology, 2020, v. 39, n. 4, p. 1058, doi. 10.4314/njt.v39i4.12

By:

Ekpu, M.

Publication type:

Article

Effect of esterification crosslinking on interfacial heat transfer between graphene and phase change material.

Published in:

Composite Interfaces, 2021, v. 28, n. 11, p. 1121, doi. 10.1080/09276440.2020.1863179

By:

Cao, Liu;
Liu, Yuanjie;
Zhang, Dong

Publication type:

Article

A procedure for efficient generation and behavioral evaluation of ultra‐packed ellipsoidal particle systems.

Published in:

International Journal for Numerical Methods in Engineering, 2022, v. 123, n. 7, p. 1547, doi. 10.1002/nme.6902

By:

Liao, Huanyu;
Achar P L, Sukshitha;
Subbarayan, Ganesh

Publication type:

Article