Works matching DE "COPPER-tin alloys"

Results: 728

Dissolution Behavior of the Cu-2.0 wt% Be Alloy (Alloy 25) in Molten Sn, Sn-3.0 wt% Ag-0.5 wt% Cu, and Sn-58 wt% Bi Lead-free Solders.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4192, doi. 10.1007/s11837-025-07324-z

By:

Yen, Yee-wen;
Laksono, Andromeda Dwi;
Liang, Chien-Lung;
Hsu, Chia-Ming;
Pan, Ssu-Chen;
Iikubo, Satoshi

Publication type:

Article

The Rate-Dependent Shear Performance of Ni-Stabilized SAC/Cu Joints Under Isothermal Aging.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4173, doi. 10.1007/s11837-025-07209-1

By:

Li, Quanzhen;
Li, Chengming;
Wang, Xiaojing;
Cai, Shanshan;
Liu, Ning;
Liu, Chen;
Sun, Shaofu

Publication type:

Article

Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4161, doi. 10.1007/s11837-025-07204-6

By:

Wang, Chao-hong;
Li, Yue-han

Publication type:

Article

Effect of casting moulds on grain morphology, mechanical and tribological properties of Sn–Cu alloy.

Published in:

Bulletin of Materials Science, 2025, v. 48, n. 2, p. 1, doi. 10.1007/s12034-025-03412-7

By:

Swamy, J M Channaveera;
Algur, Veerabhadrappa;
Satyanarayan;
Kumarswamy, M C

Publication type:

Article

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 337, doi. 10.1179/174329408X281821

By:

Hong, S. J.;
Park, B-H.;
Seo, D. S.;
Ryu, C.-R.

Publication type:

Article

Bimetallic Organic Framework‐Decorated Leaf‐like 2D Nanosheets as Flexible Air Cathode for Rechargeable Zn‐air Batteries.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 8, p. 1, doi. 10.1002/chem.202202992

By:

Li, Jiajia;
Huang, Shuhong;
Li, Zhiyong;
Zhao, Xiaohui;
Ouyang, Bo;
Kan, Erjun;
Zhao, Jie;
Zhang, Wenming

Publication type:

Article

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 12, p. 1, doi. 10.1007/s10854-023-10410-0

By:

Gao, He;
Liu, Wei;
Wang, Chunqing

Publication type:

Article

Preparation, properties, and reliability of Cu/Sn composite joints with porous Cu as interlayer for high-temperature resistant packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10123-4

By:

Wang, Jianqiang;
Duan, Fangcheng;
Wang, Jintao;
Zhang, Weiwei;
Zhang, Luobin;
Li, Mingyu;
Hang, Chunjin;
Chen, Hongtao;
Liu, Jiahao

Publication type:

Article

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x

By:

Wang, Wenhui;
Zhao, Xingke;
Zhao, Zenglei;
Rong, Yuhan

Publication type:

Article

Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09675-8

By:

Zhao, Zhili;
Xiao, Kai;
Quan, Wenlei;
Hu, Mingdeng;
Li, Jiazhe

Publication type:

Article

Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09653-0

By:

Pan, Hao;
Lu, Dashi;
Zhu, Lihua;
Li, Mingyu;
Ji, Hongjun

Publication type:

Article

The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 1, p. 1, doi. 10.1007/s10854-022-09496-9

By:

Pooshgan, Hoda;
Naffakh-Moosavy, Homam

Publication type:

Article

Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 35, p. 26190, doi. 10.1007/s10854-022-09305-3

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25964, doi. 10.1007/s10854-022-09287-2

By:

Lv, Ziwen;
Wang, Jianqiang;
Wang, Fengyi;
Wang, Jintao;
Duan, Fangcheng;
Zhang, Weiwei;
Hang, Chunjin;
Chen, Hongtao

Publication type:

Article

Investigation on high-temperature long-term aging of Cu-Sn intermetallic joints for power device packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25753, doi. 10.1007/s10854-022-09268-5

By:

Peng, Xianwen;
Wang, Yue;
Ye, Zheng;
Huang, Jihua;
Yang, Jian;
Chen, Shuhai;
Zhao, Xingke

Publication type:

Article

Formation mechanism and reliability of preferred growth full Cu6Sn5 intermetallic compound interconnect on (011) Cu single-crystal substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25274, doi. 10.1007/s10854-022-09234-1

By:

Huang, M. L.;
Zou, L.;
Wu, Y.

Publication type:

Article

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25025, doi. 10.1007/s10854-022-09210-9

By:

Xin, Meiling;
Wang, Xiuqi;
Sun, Fenglian

Publication type:

Article

Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 20769, doi. 10.1007/s10854-022-08886-3

By:

Yuan, Zeyu;
He, Yujie;
Wu, Ruize;
Xu, Ming;
Zhang, Jun;
Zhu, Yunqing;
Wang, Qiaoli;
Xie, Weibin;
Chen, Huiming

Publication type:

Article

Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 25, p. 20106, doi. 10.1007/s10854-022-08827-0

By:

Bashir, M. Nasir;
Haseeb, A. S. M. A.;
Wakeel, Saif;
Khan, Muhammad Ali;
Quazi, M. M.;
Khan, Niaz Bahadur;
Ahmed, Arslan;
Soudagar, Manzoore Elahi M.

Publication type:

Article

Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17745, doi. 10.1007/s10854-022-08637-4

By:

Wang, Fengyi;
Wang, Xinjie;
Xu, Kexin;
Wang, Jintao;
Zhang, Weiwei;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 17137, doi. 10.1007/s10854-022-08589-9

By:

Yang, Weiran;
Ding, Yu;
Liao, Mingqing;
Wang, Fengjiang

Publication type:

Article

Performance improvement of nanocrystalline Cu2O-based counter electrons for dye-sensitized solar cells by Sn alloying.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 16955, doi. 10.1007/s10854-022-08574-2

By:

Zhang, Yiqi;
Zhou, Bao;
Luo, Liang;
Xie, Zaixin;
Duan, Zhuoqi;
Hu, Yongmao

Publication type:

Article

Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16700, doi. 10.1007/s10854-022-08567-1

By:

Seo, Young-Jin;
Yoon, Jeong-Won

Publication type:

Article

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14249, doi. 10.1007/s10854-022-08353-z

By:

Amli, S. F. Muhd;
Salleh, M. A. A. Mohd;
Ramli, M. I. I.;
Aziz, M. S. Abdul;
Yasuda, H.;
Chaiprapa, J.;
Nogita, K.

Publication type:

Article

Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14240, doi. 10.1007/s10854-022-08352-0

By:

Bashir, M. Nasir;
Haseeb, A. S. M. A.

Publication type:

Article

Improved understanding of the enhancement of sintering of mixtures of Cu microparticles and sn nanoparticles for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11467, doi. 10.1007/s10854-022-08119-7

By:

Yang, Guannan;
Lin, Wei;
Lai, Haiqi;
Zhong, Chaobin;
Zhang, Yu;
Cui, Chengqiang

Publication type:

Article

Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11002, doi. 10.1007/s10854-022-08079-y

By:

Lee, Dong-hun;
Jang, Jae-il;
Kim, Young-Ho

Publication type:

Article

Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10297, doi. 10.1007/s10854-022-08018-x

By:

Huang, Jiaqiang;
Wang, Xudong;
Chen, Junyu;
Wei, Weichun;
Liu, Fengmei;
Qin, Binhao;
Wang, Haiyan;
Zhang, Yupeng

Publication type:

Article

Study of liquid-phase ultrasonically exfoliated Cu0.4Sn0.6Se ternary alloy nanoparticles-based photodetector.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 11, p. 8361, doi. 10.1007/s10854-021-06188-8

By:

Patel, Kunjal;
Patel, Anand;
Jethwa, Vibhutiba P.;
Solanki, G. K.;
Patel, K. D.;
Pathak, V. M.

Publication type:

Article

Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8270, doi. 10.1007/s10854-022-07981-9

By:

Liu, Yang;
Chang, Jian;
Xue, Yuxiong;
Cao, Rongxing;
Li, Hongxia;
Zheng, Shu;
Zeng, Xianghua

Publication type:

Article

Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8233, doi. 10.1007/s10854-022-07974-8

By:

Dele-Afolabi, T. T.;
Hanim, M. A. Azmah;
Vidyatharran, K.;
Matori, K. A.;
Azlina, O. Saliza;
Calin, R.

Publication type:

Article

Thermomigration behavior of Sn–Bi joints under different substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8127, doi. 10.1007/s10854-022-07962-y

By:

Wu, Jun;
Wang, Kaipeng;
Wang, Fengjiang;
Liao, Mingqing

Publication type:

Article

Microstructure refinement, thermodynamic characteristic, wettability and shear strength of Bi-added rapid solidification SAC305 solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8016, doi. 10.1007/s10854-022-07952-0

By:

Long, Zhiyong;
Liu, Shengfa;
Liu, Li;
Tan, Yingzhen;
Wang, Zhen;
Wang, Xinbiao

Publication type:

Article

Influence of 0.05 wt% Pr addition on interfacial microstructure and mechanical properties of Sn–0.3Ag–0.7Cu/Cu solder joint during thermal shocking.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 7099, doi. 10.1007/s10854-022-07892-9

By:

Zhang, Peng;
Xue, Songbai;
Qian, Cheng;
Wang, Jianhao;
Liu, Lu;
Wu, Jie

Publication type:

Article

A high-temperature-resistant die attach material based on Cu@In@Ag particles for high-power devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 5599, doi. 10.1007/s10854-022-07747-3

By:

Mao, Xingchao;
Liu, Jiahao;
Yu, Fuwen;
Fu, Xing;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 4924, doi. 10.1007/s10854-021-07682-9

By:

Wang, Bo;
Li, Wangyun;
Pan, Kailin

Publication type:

Article

Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3687, doi. 10.1007/s10854-021-07562-2

By:

Rajendran, Sri Harini;
Jung, Do Hyun;
Jung, Jae Pil

Publication type:

Article

Role of Ti in direct active bonding of SiC substrate using Sn–Ag–Ti alloy filler.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 3331, doi. 10.1007/s10854-021-07533-7

By:

Cheng, L. X.;
Ma, K. B.;
Yue, X. J.;
Li, Z. L.;
Li, G. Y.

Publication type:

Article

Analysis of eco-friendly tin-halide Cs2SnI6-based perovskite solar cell with all-inorganic charge selective layers.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 3, p. 1670, doi. 10.1007/s10854-022-07723-x

By:

Chauhan, Asha;
Oudhia, Anjali;
Shrivastav, A. K.

Publication type:

Article

The effects of the decreasing joint size on interfacial microstructure and shear behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 3, p. 1464, doi. 10.1007/s10854-021-07638-z

By:

Le, W. K.;
Zhou, M. B.;
Zhang, X. P.

Publication type:

Article

Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 244, doi. 10.1007/s10854-021-07289-0

By:

Qin, Hongbo;
Qin, Wei;
Li, Wangyun;
Long, Xu

Publication type:

Article

Effect of addition of Al and Cu on the properties of Sn–20Bi solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 1, p. 177, doi. 10.1007/s10854-021-07283-6

By:

Qin, Weiou;
Li, Jidong;
Zhang, Qiang;
Jiang, Shiwei;
Feng, Junli;
Yang, Wenchao;
Zhan, Yongzhong

Publication type:

Article

Strengthening mechanism of Ni-modified graphene nanosheets reinforced SnAgCuRE composite solder/Cu joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28695, doi. 10.1007/s10854-021-07245-y

By:

Wang, Huigai;
Zhang, Keke;
Wu, Yongjin;
Wang, Bingying

Publication type:

Article

Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28346, doi. 10.1007/s10854-021-07210-9

By:

Park, Dae-Young;
Kim, Jungsoo;
Yu, Dong-Yurl;
Yoo, Sehoon;
Park, Hyun-Soon;
Sohn, Yoonchul;
Ko, Yong-Ho

Publication type:

Article

Study on the performance of Cu foam with different porosity on SAC305 solder joints under ultrasonic-assisted soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28108, doi. 10.1007/s10854-021-07186-6

By:

Mao, Xin;
Zhang, Ruhua;
Yi, Xiong;
Hu, Xiaowu;
Li, Yulong;
Jiang, Xiongxin

Publication type:

Article

Effects of antimony on the microstructure, thermal properties, mechanical performance, and interfacial behavior of Sn–0.7Cu–0.05Ni–xSb/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27607, doi. 10.1007/s10854-021-07135-3

By:

Chantaramanee, Suchart;
Sungkhaphaitoon, Phairote

Publication type:

Article

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27133, doi. 10.1007/s10854-021-07105-9

By:

Zou, Yong Sheng;
Gan, Chong Leong;
Chung, Min-Hua;
Takiar, Hem

Publication type:

Article

Interfacial reaction and properties of Sn/Cu solder reinforced with graphene nanosheets during solid–liquid diffusion and reflowing.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 22, p. 26666, doi. 10.1007/s10854-021-07044-5

By:

Li, Mu-lan;
Gao, Li-li;
Zhang, Liang;
Jiang, Nan;
Zhong, Su-juan;
Zhang, Lei

Publication type:

Article

Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24507, doi. 10.1007/s10854-021-06929-9

By:

Gui, Zixiao;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Yulong;
Wang, Haozhong

Publication type:

Article

The effect of alkaline earth additions on the physical property and the corrosion behavior of Sn-0.7Cu-0.075Al solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24152, doi. 10.1007/s10854-021-06881-8

By:

Qi, Da;
Du, Zaixiang;
Fu, Yaokun;
Jiang, Shiwei;
Liu, Dianfang;
Yang, Wenchao;
Zhan, Yongzhong

Publication type:

Article