Works matching IS 09574522 AND DT 2008 AND VI 19 AND IP 5
1
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 466, doi. 10.1007/s10854-007-9364-8
- Jin-Long Tang;
- Jun Zhu;
- Wen-Feng Qin;
- Jie Xiong;
- Yan-Rong Li
- Article
2
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 487, doi. 10.1007/s10854-007-9367-5
- Talbi, N.;
- Khirouni, K.;
- Sun, G. C.;
- Samic, H.;
- Bourgoin, J. C.
- Article
3
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 457, doi. 10.1007/s10854-007-9362-x
- Fernandes, Edson Giuliani R.;
- Soares, Demetrio Artur W.;
- De Queiroz, Alvaro Antonio Alencar
- Article
4
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 476, doi. 10.1007/s10854-007-9366-6
- Bao, Amurisana;
- Chunyan Tao;
- Hua Yang
- Article
5
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 399, doi. 10.1007/s10854-007-9352-z
- Varalaxmi, Narla;
- Reddy, N. Ramamanohar;
- Ramana, Mudinepalli Venkata;
- Rajagopal, Eyunni;
- Murthy, V. Ramakrishna;
- Sivakumar, Kota Venkata
- Article
6
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 434, doi. 10.1007/s10854-007-9356-8
- Fuks-Janczarek, I.;
- Miedziński, R.;
- Gondek, E.;
- Szlachcic, P.;
- Kityk, I. V.
- Article
7
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 411, doi. 10.1007/s10854-007-9355-9
- Tan, S. Y.;
- Hsien-Chia Chiu;
- Yi-Yang Chen;
- Sung, C. L.
- Article
8
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 406, doi. 10.1007/s10854-007-9354-x
- Bo-In Noh;
- Noh-Chang Park;
- Won-Sik Hong;
- Seung-Boo Jung
- Article
9
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 429, doi. 10.1007/s10854-007-9360-z
- Qin, W. F.;
- Xiong, J.;
- Zhu, J.;
- Tang, J. L.;
- Jie, W. J.;
- Wei, X. H.;
- Zhang, Y.;
- Li, Y. R.
- Article
10
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 418, doi. 10.1007/s10854-007-9358-6
- Roy, B.;
- Reedy, R. C.;
- Readey, D. W.
- Article
11
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 442, doi. 10.1007/s10854-007-9357-7
- Zhongjun Cheng;
- Hua Yang;
- Lianxiang Yu;
- Wei Xu
- Article
12
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 424, doi. 10.1007/s10854-007-9359-5
- Pascuta, Petru;
- Pop, Lidia;
- Rada, Simona;
- Bosca, Maria;
- Culea, Eugen
- Article
13
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 463, doi. 10.1007/s10854-007-9363-9
- Liying Chen;
- Shunhua Wu;
- Shuang Wang;
- Guoqing Wang
- Article
14
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 471, doi. 10.1007/s10854-007-9365-7
- Article
15
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 448, doi. 10.1007/s10854-007-9361-y
- Dhak, Debasis;
- Dhak, Prasanta;
- Ghorai, Tanmay;
- Biswas, Soumya K.;
- Pramanik, Panchanan
- Article
16
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 5, p. 482, doi. 10.1007/s10854-007-9368-4
- Senthilarasu, S.;
- Hahn, Y. B.;
- Soo-Hyoung Lee
- Article