Works matching DE "EUTECTIC bonding process"

Results: 20

Microstructure evolution and shear behavior of Au-Sn/Ni- xCo ( x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 10, p. 7286, doi. 10.1007/s10854-017-6413-9

By:

Peng, J.;
Wang, R.;
Wang, M.;
Liu, H.

Publication type:

Article

Interfacial reactions and diffusion path in gold-tin-nickel system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3427, doi. 10.1007/s10854-015-2852-3

By:

Garnier, Arnaud;
Baillin, Xavier;
Hodaj, Fiqiri

Publication type:

Article

Effect of the composition of brazing alloys of the copper–phosphorus–antimony system on the structure and properties of copper alloys.

Published in:

Welding International, 2013, v. 27, n. 9, p. 694, doi. 10.1080/09507116.2012.753274

By:

Tavolzhansky, S.A.;
Pashkov, I.N.

Publication type:

Article

Modelo de equilibrio químico para representar solubilidades de sistemas ternarios y su aplicación a la predicción de eutécticos de sistemas cuaternarios.

Published in:

INGENIARE - Revista Chilena de Ingeniería, 2020, v. 28, n. 1, p. 31

By:

Lovera, Jorge A.;
Ushak, Svetlana;
Flores, Elsa K.;
Fernández, Angel G.;
Galleguillos, Héctor

Publication type:

Article

Effects of natural deep eutectic solvents on lactic acid bacteria viability during cryopreservation.

Published in:

Applied Microbiology & Biotechnology, 2018, v. 102, n. 13, p. 5695, doi. 10.1007/s00253-018-8996-3

By:

Qiao, Ying;
Cai, Hao-Liang;
Yang, Xi;
Zang, Yuan-Yuan;
Chen, Zhi-Gang

Publication type:

Article

Effect of Lamellar Spacing on Creep Strength of α-Mg/C14Mg<sub>2</sub>Ca Eutectic Alloy.

Published in:

Materials Transactions, 2021, v. 62, n. 9, p. 1414, doi. 10.2320/matertrans.MT-M2021101

By:

Koji Oishi;
Satoshi Araki;
Yoshihiro Terada

Publication type:

Article

Characteristics of Eutectic α(Cr,Fe)-(Cr,Fe)C in the Eutectic Fe-Cr-C Hardfacing Alloy.

Published in:

Metallurgical & Materials Transactions. Part A, 2017, v. 48, n. 1, p. 493, doi. 10.1007/s11661-016-3828-5

By:

Lai, Hsuan-Han;
Hsieh, Chih-Chun;
Lin, Chi-Ming;
Wu, Weite

Publication type:

Article

Influence of Processing Parameters on the Solidification Behavior of Single-Crystal CMSX-4 Superalloy.

Published in:

Metallurgical & Materials Transactions. Part A, 2016, v. 47, n. 7, p. 3703, doi. 10.1007/s11661-016-3542-3

By:

Wang, Fu;
Ma, Dexin;
Bogner, Samuel;
Bührig-Polaczek, Andreas

Publication type:

Article

Kinetics of triple-junctions in eutectic solidification: a sharp interface model.

Published in:

Journal of Materials Science, 2015, v. 50, n. 1, p. 176, doi. 10.1007/s10853-014-8577-5

By:

Wang, Haifeng;
Liu, Feng;
Herlach, D.

Publication type:

Article

Modeling of free eutectic growth and competitive solidification in undercooled near-eutectic alloys based on in situ measurements.

Published in:

Journal of Materials Science, 2015, v. 50, n. 1, p. 268, doi. 10.1007/s10853-014-8585-5

By:

Yang, Chao;
Gao, Jianrong

Publication type:

Article

Effect of structural transition in an amorphous NiP alloy on the wetting by a eutectic Sn-Bi solder.

Published in:

Journal of Materials Science, 2014, v. 49, n. 7, p. 2932, doi. 10.1007/s10853-013-8004-3

By:

Shen, Ping;
Yang, Jun;
Wang, Yi;
Guo, Ruifen;
Jiang, Qichuan

Publication type:

Article

Low temperature TLP bonding of AlO-ceramics using eutectic Au-(Ge, Si) alloys.

Published in:

Journal of Materials Science, 2013, v. 48, n. 20, p. 7115, doi. 10.1007/s10853-013-7526-z

By:

Weyrich, Nico;
Leinenbach, Christian

Publication type:

Article

Application of deep eutectic solvents in the extraction and separation of target compounds from various samples.

Published in:

Journal of Separation Science, 2015, v. 38, n. 6, p. 1053, doi. 10.1002/jssc.201401347

By:

Tang, Baokun;
Zhang, Heng;
Row, Kyung Ho

Publication type:

Article

Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging.

Published in:

Sensors & Materials, 2018, v. 30, n. 12, Part 2, p. 2889, doi. 10.18494/SAM.2018.1948

By:

Jenn-Ming Song;
Sin-Yong Liang;
Zong-Yu Xie;
Po-Hao Chiang;
Shang-Kun Huang;
Ying-Ta Chiu;
David Tarng;
Chih-Pin Hung;
Jing-Yuan Lin

Publication type:

Article

Microstructural Characterization of Melt Extracted High-Nb-Containing TiAl-Based Fiber.

Published in:

Materials (1996-1944), 2017, v. 10, n. 2, p. 195, doi. 10.3390/ma10020195

By:

Shuzhi Zhang;
Shuling Zhang;
Yanfei Chen;
Jianchao Han;
Changjiang Zhang;
Xiaopeng Wang;
Yuyong Chen

Publication type:

Article

Deep eutectic solvents (DESs) and the metal finishing industry: where are they now?

Published in:

Transactions of the Institute of Metal Finishing, 2013, v. 91, n. 5, p. 241, doi. 10.1179/0020296713Z.000000000120

By:

Smith*, E L

Publication type:

Article

Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 4, p. 2323, doi. 10.1007/s11664-016-5272-0

By:

Rautiainen, Antti;
Vuorinen, Vesa;
Paulasto-Kröckel, Mervi

Publication type:

Article

Al-Ge Diffusion Bonding for Hermetic Sealing Application.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2387, doi. 10.1007/s11664-015-3683-y

By:

Chidambaram, Vivek;
Wickramanayaka, Sunil

Publication type:

Article

Investigation of Au/Si EutecticWafer Bonding for MEMS Accelerometers.

Published in:

Micromachines, 2017, v. 8, n. 5, p. 158, doi. 10.3390/mi8050158

By:

Dongling Li;
Zhengguo Shang;
Yin She;
Zhiyu Wen

Publication type:

Article

The pH Behavior of Seventeen Deep Eutectic Solvents.

Published in:

BioResources, 2018, v. 13, n. 3, p. 5042, doi. 10.15376/biores.13.3.5042-5051

By:

Skulcova, Andrea;
Russ, Albert;
Jablonsky, Michal;
Sima, Jozef

Publication type:

Article