Works matching DE "MICROELECTRONIC packaging"
Results: 161
Design and control of a novel linear wire bonding head.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9
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Automated defect recognition of C-SAM images in IC packaging using Support Vector Machines.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 11/12, p. 1191, doi. 10.1007/s00170-003-1942-1
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温度冲击下多器件组装PCB板热应力及寿命分析.
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- Nonferrous Metals Engineering, 2022, v. 12, n. 2, p. 14, doi. 10.3969/j.issn.2095-1744.2022.02.003
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Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation.
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- Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00764-8
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Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy.
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- Journal of Adhesion Science & Technology, 2011, v. 25, n. 18, p. 2475, doi. 10.1163/016942411X580153
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Microelectronic packaging short courses for university...
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- Advanced Materials & Processes, 1998, v. 153, n. 3, p. 53
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- Article
Design, modeling, and performance analysis of a new dispensing system based on compliant mechanism.
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- Science Progress, 2020, v. 103, n. 2, p. 1, doi. 10.1177/0036850420923892
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Design, modeling, and performance analysis of a new dispensing system based on compliant mechanism.
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- Science Progress, 2020, v. 103, n. 2, p. 1, doi. 10.1177/0036850420923892
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Electromagnetic properties of Si-C-N based ceramics and composites.
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- International Materials Reviews, 2014, v. 59, n. 6, p. 326, doi. 10.1179/1743280414Y.0000000037
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- Article
A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics.
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- Journal of Materials Science, 2022, v. 57, n. 19, p. 8597, doi. 10.1007/s10853-022-07187-8
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Effects of W contents on the solid-state interfacial reactions of Sn/Co-W.
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- Journal of Materials Science, 2022, v. 57, n. 2, p. 1403, doi. 10.1007/s10853-021-06614-6
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The coupling effects of thermal cycling and high current density on Sn58Bi solder joints.
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- Journal of Materials Science, 2013, v. 48, n. 6, p. 2318, doi. 10.1007/s10853-012-7011-0
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Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties.
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- Polymers (20734360), 2023, v. 15, n. 4, p. 973, doi. 10.3390/polym15040973
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Physical, Thermal Transport, and Compressive Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based Thermally Conductive Nanofillers.
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- Polymers (20734360), 2022, v. 14, n. 5, p. N.PAG, doi. 10.3390/polym14051014
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Thermal and Thermo-mechanical Analysis for Design Evaluation of an Automotive Radar Module.
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- Quality & Reliability Engineering International, 2004, v. 20, n. 7, p. 709, doi. 10.1002/qre.594
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PLASTIC-STRAIN OF ALUMINIUM INTERCONNECTIONS DURING PULSED OPERATION OF IGBT MULTICHIP MODULES.
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- Quality & Reliability Engineering International, 1996, v. 12, n. 4, p. 297, doi. 10.1002/(SICI)1099-1638(199607)12:4<297::AID-QRE21>3.0.CO;2-C
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New Physics-of-Failure Software for Microelectronic Packages.
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- Quality & Reliability Engineering International, 1994, v. 10, n. 3, p. 247
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DoD/NASA MCM RELTECH Programme.
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- Quality & Reliability Engineering International, 1992, v. 8, n. 6, p. 568
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Technical Activities of the CALCE Center for Electronics Packaging Announced.
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- Quality & Reliability Engineering International, 1991, v. 7, n. 3, p. 190
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- Article
Neural network approach for comodeling design of multichip module.
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- Microwave & Optical Technology Letters, 2008, v. 50, n. 7, p. 1770, doi. 10.1002/mop.23530
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LTCC stripline resonator using embedded air cavities for millimeter wave applications.
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- Microwave & Optical Technology Letters, 2008, v. 50, n. 3, p. 658, doi. 10.1002/mop.23151
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Microwave performance of MCM-D embedded capacitors with interconnects.
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- Microwave & Optical Technology Letters, 2005, v. 46, n. 5, p. 487, doi. 10.1002/mop.21025
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Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMs.
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- Microwave & Optical Technology Letters, 2005, v. 45, n. 6, p. 557, doi. 10.1002/mop.20878
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Experiments and analysis for accurate controlling of an ultra-microvolume adhesive droplet in dispensing.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 5/6, p. 2271, doi. 10.1007/s00170-023-12097-3
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Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review.
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- Applied Sciences (2076-3417), 2019, v. 9, n. 10, p. 2044, doi. 10.3390/app9102044
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Recent Advances in Nano-conductive Adhesives.
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- Journal of Adhesion Science & Technology, 2008, v. 22, n. 8/9, p. 815, doi. 10.1163/156856108X305471
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Study of adhesion failure due to molding compound additives at chip surface in electronic devices.
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- Journal of Adhesion Science & Technology, 2001, v. 15, n. 9, p. 1039, doi. 10.1163/156856101317035477
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High-Contrast Laser Marking of Microelectronic Packaging Modules.
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- Journal of Laser Micro / Nanoengineering, 2015, v. 10, n. 2, p. 175, doi. 10.2961/jlmn.2015.02.0013
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A Droplet Generator Using Piezoelectric Ceramics to Impact Metallic Pellets.
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- Micromachines, 2024, v. 15, n. 9, p. 1139, doi. 10.3390/mi15091139
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Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties.
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- Micromachines, 2023, v. 14, n. 11, p. 2079, doi. 10.3390/mi14112079
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Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging.
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- Micromachines, 2023, v. 14, n. 8, p. 1538, doi. 10.3390/mi14081538
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Research Progress on Bonding Wire for Microelectronic Packaging.
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- Micromachines, 2023, v. 14, n. 2, p. 432, doi. 10.3390/mi14020432
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Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils.
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- Micromachines, 2022, v. 13, n. 8, p. 1307, doi. 10.3390/mi13081307
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Simulation and Experiment on Droplet Volume for the Needle-Type Piezoelectric Jetting Dispenser.
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- Micromachines, 2019, v. 10, n. 9, p. 623, doi. 10.3390/mi10090623
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Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration.
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- Micromachines, 2019, v. 10, n. 5, p. 342, doi. 10.3390/mi10050342
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A Novel Approach to Droplet's 3D Shape Recovery Based on Mask R-CNN and Improved Lambert--Phong Model.
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- Micromachines, 2018, v. 9, n. 9, p. 462, doi. 10.3390/mi9090462
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Simulation and Experiment on Droplet Formation and Separation for Needle-Type Micro-Liquid Jetting Dispenser.
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- Micromachines, 2018, v. 9, n. 7, p. 330, doi. 10.3390/mi9070330
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Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices.
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- Sensors (14248220), 2010, v. 10, n. 4, p. 3989, doi. 10.3390/s100403989
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Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling.
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- Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5486, doi. 10.1007/s11664-024-11235-1
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Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging.
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- Journal of Electronic Materials, 2017, v. 46, n. 10, p. 5503, doi. 10.1007/s11664-017-5591-9
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Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4421, doi. 10.1007/s11664-014-3375-z
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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
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- Journal of Electronic Materials, 2014, v. 43, n. 4, p. 947, doi. 10.1007/s11664-013-2967-3
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Copper Wire Bonding Concerns and Best Practices.
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- Journal of Electronic Materials, 2013, v. 42, n. 8, p. 2415, doi. 10.1007/s11664-013-2576-1
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Critical Current Density for Inhibiting (Cu,Ni)Sn Formation on the Ni Side of Cu/Solder/Ni Joints.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2653, doi. 10.1007/s11664-010-1299-9
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Structural, Elastic, and Electronic Properties of Al-Cu Intermetallics from First-Principles Calculations.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 356, doi. 10.1007/s11664-008-0587-0
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Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 365, doi. 10.1007/s11664-008-0555-8
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Thermal Stability Study of Cu(MoN<sub> x </sub>) Seed Layer on Barrierless Si.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3
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Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6
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Impression Creep Characterization of 90Pb-10Sn Microelectronic Solder Balls at Subsolvus and Supersolvus Temperatures.
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- Journal of Electronic Materials, 2005, v. 34, n. 7, p. 1040, doi. 10.1007/s11664-005-0093-6
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Effect of Volume in Interfacial Reaction between Eutectic Sn-3.5% Ag-0.5% Cu Solder and Cu Metallization in Microelectronic Packaging.
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- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 143, doi. 10.1007/s11664-005-0225-z
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