Works matching DE "ELECTRONIC packaging"
Results: 809
Miniature World.
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- Innovation, 2004, v. 4, n. 3, p. 28
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- Article
A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects.
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- Advanced Functional Materials, 2023, v. 33, n. 36, p. 1, doi. 10.1002/adfm.202301549
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- Article
Liquid crystalline epoxy resin modified cyanate ester for high performance electronic packaging.
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- Journal of Polymer Research, 2011, v. 18, n. 6, p. 1441, doi. 10.1007/s10965-010-9549-3
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- Article
Modeling and control of fluid dispensing processes: a state-of-the-art review.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 43, n. 3/4, p. 276, doi. 10.1007/s00170-008-1700-5
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- Article
A genetic-based algorithm for the operational sequence of a high speed chip placement machine.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 36, n. 9/10, p. 918, doi. 10.1007/s00170-006-0918-3
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- Article
Design and control of a novel linear wire bonding head.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1136, doi. 10.1007/s00170-006-0795-9
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- Article
An empirical approach to modelling fluid dispensing for electronic packaging.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 1/2, p. 111, doi. 10.1007/s00170-006-0552-0
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- Article
Clustering with removing outliers - a case of an IC packaging company.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 11/12, p. 1139, doi. 10.1007/s00170-005-0137-3
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- Article
An integrated system for setting the optimal parameters in IC chip-package wire bonding processes.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 3/4, p. 247, doi. 10.1007/s00170-005-0083-0
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- Article
Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 9/10, p. 902, doi. 10.1007/s00170-004-2286-1
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- Article
Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 7/8, p. 708, doi. 10.1007/s00170-004-2245-x
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- Article
Internet-based electronics manufacturing troubleshooting tool for surface mount PCB assembly.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 5/6, p. 561, doi. 10.1007/s00170-004-2233-1
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- Article
The reliability prediction of electronic packages – an expert systems approach.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 3/4, p. 381, doi. 10.1007/s00170-004-2181-9
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- Publication type:
- Article
A fast full-field 3D measurement system for BGA coplanarity inspection.
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- International Journal of Advanced Manufacturing Technology, 2004, v. 24, n. 1/2, p. 132, doi. 10.1007/s00170-003-1778-8
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- Article
Mapping the technology footprint in design for social innovation.
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- International Journal of Innovation Studies, 2022, v. 6, n. 3, p. 216, doi. 10.1016/j.ijis.2022.07.003
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- Article
Technological trajectory based on micro level technological capability: Evidence from the Brazilian rice industry.
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- International Journal of Innovation Studies, 2022, v. 6, n. 3, p. 196, doi. 10.1016/j.ijis.2022.07.001
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- Article
Study of Determining Water Vapour Transmission Rate of High Barrier Plastic Films by Calcium Corrosion Area Assessment.
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- Plastics Science & Technology / Suliao Ke-Ji, 2024, v. 52, n. 5, p. 81, doi. 10.15925/j.cnki.issn1005-3360.2024.05.017
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- Article
Highly Ordered BN<sub>⊥</sub>–BN<sub>⊥</sub> Stacking Structure for Improved Thermally Conductive Polymer Composites.
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- Advanced Electronic Materials, 2020, v. 6, n. 11, p. 1, doi. 10.1002/aelm.202000627
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- Article
Optimization of liquid cooling fins in microelectronic packaging.
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- Engineering Optimization, 2003, v. 35, n. 4, p. 359, doi. 10.1080/0305215031000147594
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- Article
THERMAL STRESS ANALYSIS AND DESIGN OPTIMIZATION OF DIRECT CHIP ATTACH (DCA) AND CHIP SCALE PACKAGE (CSP) IN FLIP CHIP TECHNOLOGY.
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- Engineering Optimization, 2002, v. 34, n. 6, p. 591, doi. 10.1080/03052150215718
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- Article
Electronic Package Leaflets for Vaccines: What Are People's Perceptions in Italy?
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- Vaccines, 2022, v. 10, n. 7, p. N.PAG, doi. 10.3390/vaccines10071075
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- Article
Low-dielectric reprocessable vitrimers via incorporating fluorine moieties and their pattern ability via direct imprinting.
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- Journal of Macromolecular Science: Pure & Applied Chemistry, 2025, v. 62, n. 3, p. 249, doi. 10.1080/10601325.2025.2458154
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- Article
Measurements and Stochastic FEA with Application in Thermomechanical Characterization of Electronic Packages.
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- Journal of Engineering & Technological Sciences, 2016, v. 48, n. 6, p. 700, doi. 10.5614/j.eng.technol.sci.2016.48.6.5
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- Publication type:
- Article
In-situ-Röntgenverfahren zur Messung von Verwindung und Wölbung elektronischer Komponenten während eines Lötvorgangs.
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- Technisches Messen, 2020, v. 87, n. 2, p. 130, doi. 10.1515/teme-2019-0106
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- Article
Synergistic Toughening of Epoxy-Copper Interface Using a Thiol-Based Coupling Layer.
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- Journal of Adhesion Science & Technology, 2011, v. 25, n. 16, p. 2081, doi. 10.1163/016942410X544875
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- Article
THE FUTURE OF ACTIVE AND INTELLIGENT PACKAGING INDUSTRY.
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- LogForum, 2013, v. 9, n. 2, p. 103
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- Article
ABSTRACTS.
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- 2012
- Publication type:
- Abstract
Tetris-Style Stacking Process to Tailor the Orientation of Carbon Fiber Scaffolds for Efficient Heat Dissipation.
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- Nano-Micro Letters, 2023, v. 15, n. 1, p. 1, doi. 10.1007/s40820-023-01119-0
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- Article
Impact of Introducing the Pletaal Assist System on Drug Adherence in Outpatients with Ischaemic Stroke: A Pilot Study.
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- Patient Preference & Adherence, 2021, v. 15, p. 835, doi. 10.2147/PPA.S297045
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- Article
ADVANCED ELECTRONIC PACKAGING MATERIALS.
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- Advanced Materials & Processes, 2005, v. 163, n. 10, p. 37
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- Article
SCANNING ACOUSTIC MICROSCOPY.
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- Advanced Materials & Processes, 2004, v. 162, n. 12, p. 29
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- Article
STRESS RELIEF.
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- Advanced Materials & Processes, 2004, v. 162, n. 3, p. 63
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- Article
Spray-Formed Silicon-Aluminum.
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- Advanced Materials & Processes, 2000, v. 157, n. 3, p. 36
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- Article
A HYBRID METHOD FOR MECHANICAL TESTING OF ELECTRONIC PACKAGING.
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- Annals of DAAAM & Proceedings, 2009, p. 1045
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- Article
Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging.
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- Advances in Materials Science & Engineering, 2015, v. 2015, p. 1, doi. 10.1155/2015/639028
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- Article
Major Pharmaceutical Conferences and Courses: February 2024 to March 2024.
- Published in:
- 2023
- Publication type:
- Proceeding
A Review on Advancement in Friction Stir Welding Considering the Tool and Material Parameters.
- Published in:
- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2021, v. 46, n. 8, p. 7681, doi. 10.1007/s13369-021-05524-8
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- Article
Recent Advances in Nanoclay‐ and Graphene‐Based Thermoplastic Nanocomposites for Packaging Applications.
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- Packaging Technology & Science, 2024, v. 37, n. 6, p. 503, doi. 10.1002/pts.2804
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- Article
The effect of process condition of the ink-jet printing process on the molten metallic droplet formation through the analysis of fluid propagation direction.
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- Canadian Journal of Physics, 2015, v. 93, n. 10, p. 1174, doi. 10.1139/cjp-2014-0259
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- Publication type:
- Article
Flame-Retardant Cycloaliphatic Epoxy Systems with High Dielectric Performance for Electronic Packaging Materials.
- Published in:
- International Journal of Molecular Sciences, 2023, v. 24, n. 3, p. 2301, doi. 10.3390/ijms24032301
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- Publication type:
- Article
Porous Polyimide Membranes Prepared by Wet Phase Inversion for Use in Low Dielectric Applications.
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- International Journal of Molecular Sciences, 2013, v. 14, n. 5, p. 8698, doi. 10.3390/ijms14058698
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- Publication type:
- Article
Mechanical strength of chip scale package with various underfills under accelerated thermal condition.
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- Materials Science & Technology, 2007, v. 23, n. 7, p. 828, doi. 10.1179/174328407X192750
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- Publication type:
- Article
The Mechanisms of Oxygen Accelerated Low‐Temperature Bonding by Ag Nanoparticles.
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- Particle & Particle Systems Characterization, 2023, v. 40, n. 7, p. 1, doi. 10.1002/ppsc.202200195
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- Publication type:
- Article
Effects of W contents on the solid-state interfacial reactions of Sn/Co-W.
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- Journal of Materials Science, 2022, v. 57, n. 2, p. 1403, doi. 10.1007/s10853-021-06614-6
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- Publication type:
- Article
Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging.
- Published in:
- Journal of Materials Science, 2019, v. 54, n. 2, p. 1741, doi. 10.1007/s10853-018-2907-y
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- Publication type:
- Article
Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics.
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- Journal of Materials Science, 2018, v. 53, n. 4, p. 2618, doi. 10.1007/s10853-017-1689-y
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- Article
Synthesis of silver nanoparticles using large-area arc discharge and its application in electronic packaging.
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- Journal of Materials Science, 2017, v. 52, n. 6, p. 3375, doi. 10.1007/s10853-016-0626-9
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- Publication type:
- Article
Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique.
- Published in:
- International Journal of Fracture, 2009, v. 156, n. 1, p. 75, doi. 10.1007/s10704-009-9348-1
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- Publication type:
- Article
Fatigue and fracture assessment for reliability in electronics packaging.
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- International Journal of Fracture, 2008, v. 150, n. 1/2, p. 91, doi. 10.1007/s10704-008-9224-4
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- Publication type:
- Article
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.
- Published in:
- Quality & Reliability Engineering International, 2015, v. 31, n. 4, p. 543, doi. 10.1002/qre.1611
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- Publication type:
- Article