Editorial.
- Published in:
- 2024
- By:
- Publication type:
- Editorial
Works matching IS 09238174 AND DT 2024 AND VI 40 AND IP 5
Results: 10
1
2
2023 JETTA-TTTC Best Paper Award: Hui Jiang, Fanchen Zhang, Jennifer Dworak, Kundan Nepal, and Theodore Manikas, "Increased Detection of Hard-to-Detect Stuck-at Faults during Scan Shift," Journal of Electronic Testing: Theory and Applications, Volume 39, Number 2, pp. 227–243, April 2023
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 591, doi. 10.1007/s10836-024-06147-1
- Publication type:
- Article
3
YOLOv8-TDD: An Optimized YOLOv8 Algorithm for Targeted Defect Detection in Printed Circuit Boards.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 645, doi. 10.1007/s10836-024-06146-2
- By:
- Publication type:
- Article
4
PCB Defect Recognition by Image Analysis using Deep Convolutional Neural Network.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 657, doi. 10.1007/s10836-024-06145-3
- By:
- Publication type:
- Article
5
Generating Synthetic Layout Test Patterns using Deep Learning.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 603, doi. 10.1007/s10836-024-06138-2
- By:
- Publication type:
- Article
6
Investigating and Improving the Performance of Radiation-Hardened SRAM Cell with the Use of Multi-Voltage Transistors.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 625, doi. 10.1007/s10836-024-06143-5
- By:
- Publication type:
- Article
7
Efficient Selective Image Fusion: A PCB Diagnosis Approach and Implementation.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 669, doi. 10.1007/s10836-024-06142-6
- By:
- Publication type:
- Article
8
Test Modules for Enhanced Testability of Single Flux Quantum Integrated Circuits.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 595, doi. 10.1007/s10836-024-06141-7
- By:
- Publication type:
- Article
9
Equivalent Circuit and Damage Threshold Study of Communication Interfaces under HEMP.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 615, doi. 10.1007/s10836-024-06140-8
- By:
- Publication type:
- Article
10
Reliability Analysis for a GaAs LNA with Temperature Stress.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 5, p. 679, doi. 10.1007/s10836-024-06144-4
- By:
- Publication type:
- Article