Works matching DE "COPPER surfaces"

Results: 1062

Adjusting the Ratio of Oxidation States in a CuO@Cu2O for the Optimization of Electrocatalytic CO2 Conversion to Ethylene.

Published in:

ChemSusChem, 2025, v. 18, n. 10, p. 1, doi. 10.1002/cssc.202401963

By:

Lu, Jun;
Ren, Yanhan;
Wang, Liang;
Zou, Lie;
Liang, Jing;
Liang, Xiaolong;
Gao, Yan;
Li, Fei;
Gao, Junfeng;
Terfort, Andreas;
Liu, Jinxuan

Publication type:

Article

AN ENHANCEMENT IN THE COPPER ELECTRODE WEAR CHARACTERISTIC ELECTRICAL DISCHARGE MACHINED INCONEL 718 THROUGH ION NITRIDING, LASER SURFACE HARDENING AND HYBRID PROCESS.

Published in:

Surface Review & Letters, 2025, v. 32, n. 6, p. 1, doi. 10.1142/S0218625X24400018

By:

DHANABALAN, S.;
RAJ KUMAR, D.;
JEYAPRAKASH, N.;
SATHEESH KUMAR, M.;
VASUDEV, HITESH

Publication type:

Article

Rational Construction of Cu Active Sites for CO2 Electrolysis to C2+ Product.

Published in:

Chemistry - An Asian Journal, 2025, v. 20, n. 9, p. 1, doi. 10.1002/asia.202500091

By:

Zheng, Chaofeng;
Zhang, Libing;
Song, Xinning;
Tan, Xingxing;
Li, Weixiang;
Jin, Xiangyuan;
Sun, Xiaofu;
Han, Buxing

Publication type:

Article

Exploring the Potential of a Green Synthesized Chromene Derivative as an Inhibitor for Copper Corrosion in Acidic Environments: A Combined Experimental and Theoretical Investigation.

Published in:

Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2025, v. 50, n. 9, p. 6359, doi. 10.1007/s13369-024-09307-9

By:

Jahdaly, Badreah A. Al;
Masaret, Ghada S.

Publication type:

Article

SYNTHESIS, CHARACTERIZATION, CRYSTAL STRUCTURES AND CORROSION INHIBITION CAPABILITIES OF THE NEW (1H-BENZOTRIAZOL-2-YL) METHYL ACETATE AND THEIR ANALOGS.

Published in:

Journal of the Chilean Chemical Society, 2024, v. 69, n. 2, p. 6110

By:

BACHO, MITCHELL;
OCAYO, FERNANDA;
TRUJILLO, ALEXANDER;
SANTOS, JUAN C.;
ARTIGAS, VANIA;
FUENTEALBA, MAURICIO;
ESCOBAR, CARLOS A.

Publication type:

Article

Copper IUD continuation, unwanted effects and cost consequences at 1 year in users aged under 30 - a secondary analysis of the EURAS-IUD study.

Published in:

2021

By:

Akintomide, Hannat;
Brima, Nataliya;
Mansour, Diana J.;
Shawe, Jill

Publication type:

journal article

Investigation of electrodeposited copper layer with island twinning structure on Zr substrate.

Published in:

Surface Engineering, 2023, v. 39, n. 5, p. 600, doi. 10.1080/02670844.2023.2247861

By:

Karimi, Meysam;
Hadipour, Ali;
Araghchi, Masoud;
Razazzadeh, Amir

Publication type:

Article

Formation of a nanoporous layer on the surface of silver and copper by dealloying of thermal diffusion coatings Me5Zn8 (Me=Ag, Cu) in a deep eutectic solvent.

Published in:

Surface Engineering, 2023, v. 39, n. 2, p. 198, doi. 10.1080/02670844.2023.2203440

By:

Kondina, A. I.;
Rozhentsev, D. A.;
Shurov, N. I.;
Tkachev, N. K.

Publication type:

Article

Study of the wettability of laser-built 3Cr13 stainless steel.

Published in:

Surface Engineering, 2021, v. 37, n. 12, p. 1484, doi. 10.1080/02670844.2020.1840716

By:

Zheng, Bo-yuan;
Kang, Jia-jie;
Di, Yue-lan;
Wang, Hai-dou;
Zhu, Li-na;
Lan, Ling

Publication type:

Article

Novel and facile method for fabrication of robust superhydrophobic film on copper surface and its chemical, mechanical, and corrosion performance.

Published in:

Surface Engineering, 2021, v. 37, n. 10, p. 1255, doi. 10.1080/02670844.2021.1951502

By:

Mohamed, M. E.;
Mahgoub, F. M.;
Ragheb, D. M.;
Abdel-Gaber, A.M.

Publication type:

Article

Fabrication of self-cleaning superhydrophobic silicone rubber insulator through laser texturing.

Published in:

Surface Engineering, 2021, v. 37, n. 3, p. 308, doi. 10.1080/02670844.2020.1780673

By:

Patil, Deepak;
Aravindan, Sivanandam;
Sarathi, Ramanujam;
Rao, Paruchuri Venkateswara

Publication type:

Article

Physical and electrical properties' evaluation of SnS:Cu thin films.

Published in:

Surface Engineering, 2021, v. 37, n. 2, p. 137, doi. 10.1080/02670844.2020.1754623

By:

Sebastian, S.;
Kulandaisamy, I.;
Valanarasu, S.;
Shkir, Mohd;
Ganesh, V.;
Yahia, I. S.;
Kim, Hyun-Seok;
Vikraman, Dhanasekaran

Publication type:

Article

Microstructural investigations on bonding mechanisms of cold-sprayed copper with SS316L steel.

Published in:

Surface Engineering, 2020, v. 36, n. 10, p. 1067, doi. 10.1080/02670844.2019.1698163

By:

Singh, Surinder;
Singh, Harpreet;
Buddu, Ramesh Kumar

Publication type:

Article

Performance investigation of a new carbon–silver microspheres/epoxy resin superhydrophobic coating.

Published in:

Surface Engineering, 2020, v. 36, n. 6, p. 565, doi. 10.1080/02670844.2018.1541297

By:

Zhao, Meiyun;
Tian, Sen;
Zhao, Xinze;
Wu, Yang;
Tan, Mingyi;
Xing, Jing Tang

Publication type:

Article

Preparation of a superhydrophobic aluminium alloy surface by UV laser.

Published in:

Surface Engineering, 2020, v. 36, n. 6, p. 558, doi. 10.1080/02670844.2017.1395982

By:

Huang, Chao;
Ye, Xia;
Yang, Xiaohong;
Yao, Aifei;
Fan, Zhenmin

Publication type:

Article

An investigation of the effect of pulse electrochemical deposition parameters on morphology, hardness and corrosion behaviour in the marine atmosphere.

Published in:

Surface Engineering, 2019, v. 35, n. 12, p. 1021, doi. 10.1080/02670844.2019.1609289

By:

Prasannakumar, R. S.;
Bhakyaraj, K.;
Chukwuike, V. I.;
Mohan, S.;
Barik, R. C.

Publication type:

Article

Corrosion and fouling behaviours of copper-based superhydrophobic coating.

Published in:

Surface Engineering, 2019, v. 35, n. 6, p. 542, doi. 10.1080/02670844.2018.1433774

By:

Lv, Yan;
Liu, Mingyan

Publication type:

Article

Ti and nitride surface modification of copper by pack cementation.

Published in:

Surface Engineering, 2018, v. 34, n. 3, p. 243, doi. 10.1080/02670844.2016.1274841

By:

Stathokostopoulos, D.;
Chaliampalias, D.;
Pliatsikas, N.;
Kassavetis, S.;
Pavlidou, E.;
Patsalas, P.;
Logothetidis, S.;
Chrissafis, K.;
Vourlias, G.

Publication type:

Article

Cold spray deposition to prevent fouling of polymer surfaces.

Published in:

Surface Engineering, 2018, v. 34, n. 3, p. 193, doi. 10.1080/02670844.2016.1229833

By:

Stenson, C.;
McDonnell, K. A.;
Yin, S.;
Aldwell, B.;
Meyer, M.;
Dowling, D. P.;
Lupoi, R.

Publication type:

Article

Effect of SiC concentration in electrolyte on Ni-SiC composite coating properties.

Published in:

Surface Engineering, 2013, v. 29, n. 3, p. 177, doi. 10.1179/1743294413Y.0000000113

By:

Aghaie, E;
Najafi, A;
Maleki-Ghaleh, H;
Mohebi, H

Publication type:

Article

Glass-Metal Adhesive Polymers from Copper(I)-Catalyzed Azide-Alkyne Cycloaddition.

Published in:

Macromolecular Chemistry & Physics, 2017, v. 218, n. 8, p. n/a, doi. 10.1002/macp.201600579

By:

Martínez‐Triana, Yeimy M.;
Whelan, Rory;
Finn, M. G.;
Díaz, David Díaz

Publication type:

Article

Characterization and In Vitro Behavior of PEO Coated Mg Modified with Antibacterial Ag(I) and Cu(II) Complexes.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 18, p. 1, doi. 10.1002/chem.202303012

By:

Tsimafeyeva, Kseniya A.;
Starykevich, Maksim;
Snihirova, Darya;
Blawert, Carsten;
Scharnagl, Nico;
Schuster, Anke;
Gavras, Sarkis;
Luthringer‐Feyerabend, Bérengère J. C.;
Zheludkevich, Mikhail L.

Publication type:

Article

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x

By:

Wang, Wenhui;
Zhao, Xingke;
Zhao, Zenglei;
Rong, Yuhan

Publication type:

Article

Surface impregnated copper influence on the sunlight-assisted photocatalysis of zinc oxide nanostructures.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 25, p. 20447, doi. 10.1007/s10854-022-08860-z

By:

Vivek, S.;
Preethi, S.;
Vachaspathi, M.;
Rengaraj, S.;
Cha, Suk Won;
Babu, K. Suresh

Publication type:

Article

Growth and characterization of Cu2O and CuO thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16154, doi. 10.1007/s10854-022-08506-0

By:

Kaur, Jatinder;
Khanna, Atul;
Kumar, Rinku;
Chandra, Ramesh

Publication type:

Article

Effects of different inhibitor on antioxidation of copper bonding wire at room temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10561, doi. 10.1007/s10854-022-08042-x

By:

He, Xiaokang;
Guo, Libin;
Gaosen, Gong;
Fengling, Su;
Zhu, Dachuan

Publication type:

Article

A double-functional carbon material as a supercapacitor electrode and hydrogen production: Cu-doped tea factory waste catalyst.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28909, doi. 10.1007/s10854-021-07275-6

By:

Özarslan, S.;
Atelge, M. R.;
Kıvrak, Hilal Demir;
Horoz, Sabit;
Yavuz, Cenk;
Kaya, M.;
Ünalan, S.

Publication type:

Article

Preparation and electrochemical performance of ball milling SiOx/(Cu,Ni) anode materials for lithium–silicon batteries.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11049, doi. 10.1007/s10854-020-03654-7

By:

Geng, Zhipeng;
Zhao, Fangxia;
Yang, Borui;
Wang, Pengpeng;
Zhang, Zhenzhong

Publication type:

Article

Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16226, doi. 10.1007/s10854-019-01991-w

By:

Chen, Yuanming;
Gao, Yali;
Jin, Xiaofeng;
Zhou, Xuan;
Wang, Shouxu;
He, Wei;
Hong, Yan;
Zhou, Guoyun;
Zhang, Weihua;
Sun, Rui;
Huang, Yunzhong;
Tang, Yao

Publication type:

Article

Effect of metal buffer layer on the thermal interface performance of liquid metal alloy on copper plate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15766, doi. 10.1007/s10854-019-01962-1

By:

Yan, Huilong;
Ji, Yulong;
Yan, Jinliang

Publication type:

Article

Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12860, doi. 10.1007/s10854-019-01601-9

By:

Du, Cheng-Jie;
Li, Xin;
Mei, Yun-Hui;
Lu, Guo-Quan

Publication type:

Article

Rapid low temperature sintering in air of copper submicron particles with synergistic surface-activation and anti-oxidative protection.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12669, doi. 10.1007/s10854-019-01630-4

By:

Qi, Tianke;
Wang, Xiaocun;
Yang, Jianfu;
Xiao, Fei

Publication type:

Article

Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bonds.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 864, doi. 10.1007/s10854-013-1658-4

By:

Bhat, Kiran;
Prabhu, K.;
Satyanarayan

Publication type:

Article

Improving dark fermentative hydrogen production through zero-valent iron/copper (Fe/Cu) micro-electrolysis.

Published in:

Biotechnology Letters, 2020, v. 42, n. 3, p. 445, doi. 10.1007/s10529-020-02793-5

By:

Zhang, Lei;
Xu, Danyu;
Kong, Deyong;
Ji, Min;
Shan, Lianbin;
Zhao, Yongjiao

Publication type:

Article

A robust method of enhancement of protection ability of electrodeposited silane film over copper surface using H2O2.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2014, v. 65, n. 10, p. 982, doi. 10.1002/maco.201307396

By:

Karthik, N.;
Sethuraman, M. G.

Publication type:

Article

Spatial and Seasonal Structure of Bacterial Communities Within Alpine Vineyards: Trentino as a Case Study.

Published in:

Microbial Ecology, 2023, v. 85, n. 1, p. 108, doi. 10.1007/s00248-021-01948-9

By:

Guzzon, Raffaele;
Bertoldi, Daniela;
Roman, Tomas;
Zanzotti, Roberto;
Franciosi, Elena

Publication type:

Article

Ultrasonic assisted electropolishing to reduce the surface roughness of laser powder bed fusion based additively manufactured copper heat exchanger components.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 134, n. 9/10, p. 4297, doi. 10.1007/s00170-024-14399-6

By:

Rahman, Md Hafizur;
McCarroll, Angus;
Siddaiah, Arpith;
Kumar, Pankaj;
Menezes, Pradeep L.

Publication type:

Article

Analysis of wall thickness variation of copper tube electrode processed by ultrasonic vibration.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 132, n. 1/2, p. 291, doi. 10.1007/s00170-024-13115-8

By:

Yu, Hanlin;
Zhao, Yugang;
Li, Zhihao;
Zhao, Chuang;
Meng, Shuo;
Tang, Yu;
Cao, Chen;
Zhang, Haiyun

Publication type:

Article

Fault detection and diagnosis using two-stage attention-based variational LSTM in electrolytic copper manufacturing process.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 3/4, p. 1269, doi. 10.1007/s00170-023-12356-3

By:

Yoo, Jaejin;
Song, Seunghwan;
Chang, Kyuchang;
Baek, Jun-Geol

Publication type:

Article

A study on the tribological behavior of water-based nanolubricant during corrugated rolling of copper plates.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 129, n. 3/4, p. 1513, doi. 10.1007/s00170-023-12286-0

By:

Ma, Linan;
Lian, Junjie;
Ma, Xiaoguang;
Bai, Siyi;
Ma, Luhu;
Zhao, Jingwei

Publication type:

Article

Detailed characterisation of batch-manufactured flexible micro-grinding tools for electrochemical assisted grinding of copper surfaces.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 128, n. 5/6, p. 2301, doi. 10.1007/s00170-023-11876-2

By:

Steinhoff, Lukas;
Ottermann, Rico;
Dencker, Folke;
Wurz, Marc Christopher

Publication type:

Article

Prediction of electrical resistance of laser-welded copper pin-pairs with surface topographical information from inline post-process observation by optical coherence tomography.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 125, n. 3/4, p. 1955, doi. 10.1007/s00170-022-10796-x

By:

Will, Thomas;
Müller, Johannes;
Müller, Ricus;
Hölbling, Claudio;
Goth, Christian;
Schmidt, Michael

Publication type:

Article

Production of a multi-functional 420 stainless steel-copper surface by laser texturing and hot pressing: a new solution for plastic injection moulds.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 123, n. 3/4, p. 1341, doi. 10.1007/s00170-022-10252-w

By:

Cunha, Ângela;
Marques, Ana;
Guimarães, Bruno;
Bartolomeu, Flávio;
Silva, Filipe Samuel;
Gasik, Michael;
Trindade, Bruno;
Carvalho, Óscar

Publication type:

Article

Influence of process parameters on the geometry and surface defects of the single-line track in the directed energy deposition of pure copper onto 304 stainless steel using a blue laser.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 1/2, p. 1091, doi. 10.1007/s00170-022-09388-6

By:

Yamaguchi, Mitsugu;
Yamazaki, Masamichi;
Funada, Yoshinori;
Yachi, Taisei;
Saikai, Ayahito;
Furumoto, Tatsuaki

Publication type:

Article

Superhydrophobicity and corrosion resistance of AISI 4140 mold made through nanosecond laser texturing.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 7/8, p. 5119, doi. 10.1007/s00170-021-08479-0

By:

Kim, Byung-Chan;
Lim, Dong-Wook;
Kim, Ji-Hun;
Lee, Hyun-Taek

Publication type:

Article

Combined lubrication of surface texturing and copper covering for broaching tool.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3617, doi. 10.1007/s00170-021-08594-y

By:

Ni, Jing;
Feng, Kai;
Zhuang, Kai;
Sang, Zhiqian;
Meng, Zhen;
Rahman, Md. Mizanur

Publication type:

Article

The wettability of metal-based composite foils with hierarchical structure prepared by ultrasonic-assisted composite electrodeposition.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 116, n. 7/8, p. 2359, doi. 10.1007/s00170-021-07526-0

By:

Wu, Chunxia;
Zhao, Hang;
Wu, Xiaoyu;
Xu, Bin;
Lei, Jianguo;
Zhu, Likuan;
Gao, Chang;
Xiao, Yongchang

Publication type:

Article

Milling path planning for helical surface copper electrodes.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 114, n. 3/4, p. 1031, doi. 10.1007/s00170-021-06886-x

By:

Shi, Zhaoyao;
Feng, Zhipeng;
Lin, Shoujin;
Tong, Aijun;
Li, Ke;
Ren, Jihua;
Wang, Peng

Publication type:

Article

Investigation on the roll-to-plate microforming of riblet features with the consideration of grain size effect.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 7/8, p. 2055, doi. 10.1007/s00170-020-05687-y

By:

Xu, Zhutian;
Peng, Linfa;
Lai, Xinmin

Publication type:

Article

Limits and solutions in processing pure Cu via selective laser melting using a high-power single-mode fiber laser.

Published in:

International Journal of Advanced Manufacturing Technology, 2019, v. 104, n. 5-8, p. 2473, doi. 10.1007/s00170-019-04015-3

By:

Colopi, Matteo;
Demir, Ali Gökhan;
Caprio, Leonardo;
Previtali, Barbara

Publication type:

Article