Works matching DE "METAL bonding"

Results: 982

Effect of adhesive systems on shear bond strength of metal brackets bonded to different ceramic surfaces.

Published in:

Tanta Dental Journal, 2025, v. 22, n. 1, p. 166, doi. 10.4103/tdj.tdj_82_24

By:

Mosbah, Mohamed Mostafa Mostafa;
ElMehy, Ghada A.-F.;
El-Marhoumy, Shaimaa M.

Publication type:

Article

Evaluation of the Bond Strengths Between Dental Ceramics and Co-Cr Frameworks Made with Digital and Conventional Techniques.

Published in:

International Journal of Prosthodontics, 2025, v. 38, n. 3, p. 355, doi. 10.11607/ijp.9055

By:

Monaco, Carlo;
Bonvicini, Martina;
Di Fiore, Adolfo;
Silvestri, Davide;
Arena, Antonio;
Consolo, Ugo;
Zicari, Francesca

Publication type:

Article

Cu(OAc)2 Catalyzed, Microwave Assisted O-Arylation of Phenols with Haloarenes Using Guanidinium Ionic Liquids as Recyclable System Under Mild Reaction Conditions.

Published in:

Russian Journal of General Chemistry, 2025, v. 95, n. 5, p. 1037, doi. 10.1134/S1070363224612791

By:

Jadhav, V.;
Jamadar, I.;
Kalkhambkar, R. G.;
Refat, M. S.;
Alsuhaibani, A. Mohammed

Publication type:

Article

Tough hydrogel-coated containment capsule of magnetic liquid metal for remote gastrointestinal operation.

Published in:

National Science Review, 2025, v. 12, n. 4, p. 1, doi. 10.1093/nsr/nwaf042

By:

Shen, Yifeng;
Cao, Jiasheng;
Zhou, Enjie;
Wang, Lei;
Zhang, Kaihang;
Xue, Yaoting;
Yuan, Hui;
Hu, Jiahao;
Li, Siyang;
Miao, Zhikun;
Zhao, Yukai;
Wong, Tuck-Whye;
Li, Tiefeng;
Chen, Mingyu;
Yang, Xuxu;
Yang, Wei

Publication type:

Article

A Review of Joining Technologies for SiC Matrix Composites.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 2046, doi. 10.3390/ma18092046

By:

Lu, Yongheng;
Zhang, Jinzhuo;
Li, Guoquan;
Wang, Zaihong;
Wu, Jing;
Wei, Chong

Publication type:

Article

Nanoarchitectonics of Palladium Nanoparticles Supported on Carbon‐Based Heterogeneous Catalysts for C─H Activation Reaction.

Published in:

ChemCatChem, 2025, v. 17, n. 9, p. 1, doi. 10.1002/cctc.202401840

By:

Sahil;
Gupta, Neeraj

Publication type:

Article

Effects of Various Fuels on the Qualified Photoluminescence and Thermoluminescence Properties of BaZrO3 Nanophosphors.

Published in:

Journal of Mines, Metals & Fuels, 2025, v. 73, n. 4, p. 1121, doi. 10.18311/jmmf/2025/48385

By:

Silpa, T. N.;
Pandurangappa, C.;
Yashaswini;
Pratibha, S.;
Jayasheelan, A.

Publication type:

Article

In situ growth of Bi0 and BiOBr on Bi-MOF nanoribbons via chemically bond for boosting the photocatalytic chlortetracycline removal by MOF framework, oxygen vacancies, and mediator-based Z-scheme heterojunction.

Published in:

Journal of Nanoparticle Research, 2025, v. 27, n. 4, p. 1, doi. 10.1007/s11051-025-06298-y

By:

Yang, Ziqi;
Ma, Fengyan;
Zhang, Yu;
Ling, Meihua;
Zheng, Hong;
Yu, Yan;
Li, Li

Publication type:

Article

Strengthening mechanism and metal/ceramic bonding interface of cold sprayed TiN p /Al5356 deposits.

Published in:

Surface Engineering, 2016, v. 32, n. 9, p. 663, doi. 10.1179/1743294415Y.0000000089

By:

Huang, C. J.;
Li, W. Y.

Publication type:

Article

Process optimisation of cold spray Al coating on AZ91 alloy.

Published in:

Surface Engineering, 2014, v. 30, n. 5, p. 323, doi. 10.1179/1743294413Y.0000000224

By:

Wang, Q.;
Birbilis, N.;
Zhang, M.-X.

Publication type:

Article

Influence of HVOF process parameters on microstructure and bond strength of NiCrAlY coatings.

Published in:

Surface Engineering, 2012, v. 28, n. 4, p. 266, doi. 10.1179/1743294411Y.0000000024

By:

Taheri, M;
Valefi, Z;
Zangeneh-Madar, K

Publication type:

Article

Moduli of Mussel‐Inspired, Metal‐Coordinated Hydrogels Comprising Four‐, Six‐, and Eight‐Arm Polymers.

Published in:

Macromolecular Chemistry & Physics, 2023, v. 224, n. 24, p. 1, doi. 10.1002/macp.202300102

By:

Darby, Daniel R.;
Stephens, Lauren F.;
Chwatko, Malgorzata;
Pham, Jonathan T.

Publication type:

Article

Self‐Healing and Flexible Porous Nickel/Polyurethane Composite Based on Multihealing Systems and Applications.

Published in:

Macromolecular Chemistry & Physics, 2021, v. 222, n. 23, p. 1, doi. 10.1002/macp.202100299

By:

Zhou, Xing;
Wang, Hao;
Li, Shaonan;
Jiang, Li;
Liu, Mengyue

Publication type:

Article

Self‐Healing Elastomers and Coatings via Metal Coordination Bonds.

Published in:

2025

By:

Yang, Song‐Ming;
Zhou, Shuo;
Yuan, Jin‐Ying

Publication type:

Literature Review

Metalized Borylene in Boron‐Gold Carbonyl Complexes: Infrared Spectra and Theoretical Calculations.

Published in:

Chemistry - A European Journal, 2025, v. 31, n. 3, p. 1, doi. 10.1002/chem.202403368

By:

Hu, Jin;
Wang, Xuefeng

Publication type:

Article

Toughening Healable Supramolecular Double Polymer Networks Based on Hydrogen Bonding and Metal Coordination.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 72, p. 1, doi. 10.1002/chem.202402511

By:

Onori, Ilaria;
Formon, Georges J. M.;
Weder, Christoph;
Augusto Berrocal, José

Publication type:

Article

Opportunities of MXenes in Heterogeneous Catalysis: V2C as Aerobic Oxidation Catalyst.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 37, p. 1, doi. 10.1002/chem.202400576

By:

Dhakshinamoorthy, Amarajothi;
Ramírez‐Grau, Rubén;
Garcia, Hermenegildo;
Primo, Ana

Publication type:

Article

Osme Bond: Geometric and Energetic Features in the Adducts between OsO4 and Lewis Bases.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 19, p. 1, doi. 10.1002/chem.202304240

By:

Calabrese, Miriam;
Pizzi, Andrea;
Daolio, Andrea;
Beccaria, Roberta;
Lo Iacono, Cristina;
Scheiner, Steve;
Resnati, Giuseppe

Publication type:

Article

Self‐Assembled Supported Ionic Liquids.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 6, p. 1, doi. 10.1002/chem.202303673

By:

Tavera‐Méndez, Cindy‐Ly;
Bergen, Alexander;
Trzeciak, Simon;
Heinemann, Frank W.;
Graf, Robert;
Zahn, Dirk;
Meyer, Karsten;
Hartmann, Martin;
Wisser, Dorothea

Publication type:

Article

Dynamically Visualized Mechano‐Responsive Supramolecular Self‐Assembly System for Small Molecule Release.

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 37, p. 1, doi. 10.1002/chem.202301100

By:

Wu, Shihong;
Qi, Jiajia;
Xia, Xin;
Zhou, Ronghui;
Zhao, Hang

Publication type:

Article

Binding, Release and Functionalization of Intact Pnictogen Tetrahedra Coordinated to Dicopper Complexes.

Published in:

Chemistry - A European Journal, 2022, v. 28, n. 45, p. 1, doi. 10.1002/chem.202201144

By:

Piesch, Martin;
Nicolay, Amélie;
Haimerl, Maria;
Seidl, Michael;
Balázs, Gábor;
Don Tilley, T.;
Scheer, Manfred

Publication type:

Article

Der elektronische Grundzustand von [Fe(CO)3(NO)]−: eine spektroskopische und theoretische Studie.

Published in:

Angewandte Chemie, 2014, v. 126, n. 7, p. 1820, doi. 10.1002/ange.201309767

By:

Klein, Johannes E. M. N.;
Miehlich, Burkhard;
Holzwarth, Michael S.;
Bauer, Matthias;
Milek, Magdalena;
Khusniyarov, Marat M.;
Knizia, Gerald;
Werner, Hans ‐ Joachim;
Plietker, Bernd

Publication type:

Article

Synthesis of Triangular Tripalladium Cations as Noble-Metal Analogues of the Cyclopropenyl Cation.

Published in:

Angewandte Chemie, 2014, v. 126, n. 7, p. 2018, doi. 10.1002/ange.201310204

By:

Blanchard, Sébastien;
Fensterbank, Louis;
Gontard, Geoffrey;
Lacôte, Emmanuel;
Maestri, Giovanni;
Malacria, Max

Publication type:

Article

Joint reliability of Al wire bonding on OSP and ENIG surface-finished substrates under complex stress induced with current and temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 21127, doi. 10.1007/s10854-022-08917-z

By:

Ahn, Byeongjin;
Kim, Jahyeon;
Cheon, Gyeong-Yeong;
Lee, Tae-Ik;
Park, Young-Bae;
Kim, Jungsoo;
Ko, Yong-Ho

Publication type:

Article

Room-temperature bonding strategy by ultra-high isostatic pressing for a heterogeneous interconnection architecture.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 3, p. 1480, doi. 10.1007/s10854-021-07656-x

By:

Guo, Fen;
Li, Tuo;
Man, Hong Tao;
Liu, Kai;
Zou, Xiao Feng;
Wang, Xiao Liang

Publication type:

Article

Colossal dielectric behavior in Al0.8GdyLa0.2-yTiO3 (y = 0.01–0.04) nanostructures.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 8017, doi. 10.1007/s10854-021-05525-1

By:

Dastagiri, S.;
Pakardin, G.;
Babu, T. Anil;
Lakshmaiah, M. V.;
Naidu, K. Chandra Babu

Publication type:

Article

CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11151, doi. 10.1007/s10854-019-01458-y

By:

Endo, Takeshi;
Sugiura, Kazuhiko;
Tsuruta, Kazuhiro;
Iwashige, Tomohito;
Chen, Chuantong;
Nagao, Shijo;
Suganuma, Katsuaki;
Sakuma, Yuichi;
Kurosaka, Seigo;
Oda, Yukinori

Publication type:

Article

A comparative study on direct Cu-Cu bonding methodologies for copper pillar bumped flip-chips.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 9347, doi. 10.1007/s10854-018-8965-8

By:

Ma, Y.;
Roshanghias, A.;
Binder, A.

Publication type:

Article

Low temperature bonding with high shear strength using micro-sized Ag particle paste for power electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 5, p. 3800, doi. 10.1007/s10854-017-8315-2

By:

Roh, Myong-Hoon;
Nishikawa, Hiroshi;
Tsutsumi, Seiichiro;
Nishiwaki, Naruhiko;
Ito, Keiichi;
Ishikawa, Koji;
Katsuya, Akihiro;
Kamada, Nobuo;
Saito, Mutsuo

Publication type:

Article

Effect of in-situ free air ball laser heating on bonding strength and grain structure for copper wire bond.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 18, p. 13750, doi. 10.1007/s10854-017-7219-5

By:

Singh, Gurbinder;
Haseeb, A.

Publication type:

Article

Pressureless sintering bonding using hybrid microscale Cu particle paste on ENIG, pure Cu and pre-oxidized Cu substrate by an oxidation-reduction process.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 7, p. 5554, doi. 10.1007/s10854-016-6220-8

By:

Liu, Xiangdong;
Nishikawa, Hiroshi

Publication type:

Article

Transient liquid phase bonding of Sn-Bi solder with added Cu particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4232, doi. 10.1007/s10854-016-4287-x

By:

Mokhtari, Omid;
Nishikawa, Hiroshi

Publication type:

Article

Bi-material assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at its ends: optimized stress relief.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4816, doi. 10.1007/s10854-016-4363-2

By:

Suhir, E.

Publication type:

Article

Low temperature chip on film bonding technology for 20 µm pitch applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 4, p. 3658, doi. 10.1007/s10854-015-4205-7

By:

Kim, Sun-Chul;
Kim, Young-Ho

Publication type:

Article

A solid-state bonding technique of large copper wires for high power devices operating at high temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3521, doi. 10.1007/s10854-015-2864-z

By:

Chen, Yi-Ling;
Wu, Yuan-Yun;
Lee, Chin

Publication type:

Article

Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 8, p. 2803, doi. 10.1007/s10854-013-1174-6

By:

Gan, C.;
Hashim, U.

Publication type:

Article

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 41, doi. 10.1007/s10854-011-0402-1

By:

Yoon, Jeong-Won;
Lee, Jong-Gun;
Lee, Jong-Bum;
Noh, Bo-In;
Jung, Seung-Boo

Publication type:

Article

Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1144, doi. 10.1007/s10854-008-9841-8

By:

Pequegnat, A.;
Hang, C. J.;
Mayer, M.;
Zhou, Y.;
Moon, J. T.;
Persic, J.

Publication type:

Article

Effects of bonding frequency on Au wedge wire bondability.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 281, doi. 10.1007/s10854-007-9312-7

By:

Yu Hin Chan;
Jang-Kyo Kim;
Deming Liu;
Liu, Peter C. K.;
Yiu Ming Cheung;
Ming Wai Ng

Publication type:

Article

Spillover Effect of Green Bond with Metal and Bullion Market.

Published in:

Asia-Pacific Financial Markets, 2025, v. 32, n. 1, p. 1, doi. 10.1007/s10690-023-09443-6

By:

Panwar, Kajal;
Yadav, Miklesh Prasad;
Puri, Neha

Publication type:

Article

Silicone‐containing polyurea elastomer possessing main‐chain boron–oxygen bonds with delayed stress relaxation and improved adhesive properties.

Published in:

Polymer International, 2024, v. 73, n. 10, p. 874, doi. 10.1002/pi.6671

By:

Zhang, Shilong;
Xiong, Youhao;
Wang, Yangwei;
Ma, Yuqi;
Li, Jialiang;
Jiang, Chaobo;
Wang, Ce;
Zhu, Yanling;
Zhao, Yongsheng;
Zhang, Guangcheng

Publication type:

Article

Electrochemical control of specific adhesion between amine-functionalized polymers and noble metal electrode interfaces.

Published in:

Materials & Corrosion / Werkstoffe und Korrosion, 2014, v. 65, n. 4, p. 362, doi. 10.1002/maco.201307581

By:

Donaldson, S. H.;
Utzig, T.;
Gebbie, M. A.;
Raman, S.;
Shrestha, B. R.;
Israelachvili, J. N.;
Valtiner, M.

Publication type:

Article

Research on the grinding performance of grinding wheel in the initial grinding stage after electric spark dressing of grinding wheel.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 131, n. 5/6, p. 3103, doi. 10.1007/s00170-024-13196-5

By:

Liu, Lifei;
Fang, Mouxin

Publication type:

Article

Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 130, n. 1/2, p. 903, doi. 10.1007/s00170-023-12747-6

By:

Takenaka, Kosuke;
Jinda, Akiya;
Nakamoto, Soutaro;
Koyari, Ryosuke;
Toko, Susumu;
Uchida, Giichiro;
Setsuhara, Yuichi

Publication type:

Article

Fast calculation of the welding gun posture for spot welding using octrees and CPU parallel processing.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 122, n. 5/6, p. 2685, doi. 10.1007/s00170-022-09378-8

By:

Man, Ruidong;
Son, Chungil;
Kim, Songkil;
Jung, Yoongho

Publication type:

Article

Experimental investigations on optimizing manufacturing parameters for electrospark deposition diamond wire saw.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 9/10, p. 6523, doi. 10.1007/s00170-022-09767-z

By:

Li, Chengyun;
Ge, Peiqi;
Bi, Wenbo;
Wang, Qihao

Publication type:

Article

Experimental research on the technology of two-pass different temperature rolling for thick steel/aluminum/aluminum-alloy composite plate.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 11/12, p. 7689, doi. 10.1007/s00170-022-09120-4

By:

Chen, Ke;
Liu, Wenwen;
Wang, Tao;
Wang, Najin;
Chen, Zhongyu

Publication type:

Article

Thermal simulation of the continuous pulse discharge for electro-spark deposition diamond wire saw.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 2923, doi. 10.1007/s00170-021-08444-x

By:

Li, Chengyun;
Ge, Peiqi;
Bi, Wenbo

Publication type:

Article

Thermal simulation of the single discharge for electro-spark deposition diamond wire saw.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 114, n. 11/12, p. 3597, doi. 10.1007/s00170-021-07132-0

By:

Li, Chengyun;
Ge, Peiqi;
Bi, Wenbo

Publication type:

Article

A short review on laser welding/brazing of aluminum alloy to steel.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 112, n. 9/10, p. 2399, doi. 10.1007/s00170-021-06607-4

By:

Wang, Jintao;
Fu, Xing;
Zhang, Luobin;
Zhang, Zheng;
Liu, Jiahao;
Chen, Si

Publication type:

Article