Works matching Bonding

Results: 5000

Investigation of mycelium film as the adhesive for poplar veneer bonding: insight into interfacial bonding mechanisms.

Published in:

Wood Material Science & Engineering, 2025, v. 20, n. 1, p. 31, doi. 10.1080/17480272.2024.2321602

By:

Cheng, Yongbin;
Long, Chun;
Zhang, Mingchang;
Wang, Wang;
Sun, Wenjing

Publication type:

Article

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.

Published in:

Nanomaterials (2079-4991), 2023, v. 13, n. 17, p. 2490, doi. 10.3390/nano13172490

By:

Huang, Yuan-Chiu;
Lin, Yu-Xian;
Hsiung, Chien-Kang;
Hung, Tzu-Heng;
Chen, Kuan-Neng

Publication type:

Article

No-primer adhesive vs. self-adhesive resin: bonding strength following LED curing.

Published in:

Journal of Orofacial Orthopedics/Fortschritte der Kieferorthopadie, 2022, v. 83, n. 2, p. 141, doi. 10.1007/s00056-021-00340-z

By:

Atik, Ezgi;
Kızılırmak, Mustafa;
Akcan, Cenk Ahmet;
Taner, Tülin

Publication type:

Article

Computational insights into halogen bonding between P&bond;Cl contact and several electron donors.

Published in:

International Journal of Quantum Chemistry, 2010, v. 110, n. 6, p. 1245, doi. 10.1002/qua.22228

By:

Xu, Lin;
Zou, Jian‐Wei;
Yu, Qing‐Sen;
Sang, Peng

Publication type:

Article

Thermosonic Bonding of Gold Wire onto Silver Bonding Layer on the Bond Pads of Chips with Copper Interconnects.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1693, doi. 10.1007/s11664-006-0220-z

By:

Cheng-Li Chuang;
Jong-Ning Aoh

Publication type:

Article

Hydrogen Bonding vs Dihydrogen Bonding in the Air Stable Primary Phosphine ortho‐Phosphinophenol.

Published in:

European Journal of Inorganic Chemistry, 2024, v. 27, n. 25, p. 1, doi. 10.1002/ejic.202400260

By:

Stone, Alexander M.;
Golden, Andrew R.;
Daniel, Shan M.;
Rheingold, Arnold L.;
Protasiewicz, John D.

Publication type:

Article

Ultrasonic bonding of Cu/Ni and its thermal reliability.

Published in:

Welding International, 2015, v. 29, n. 4, p. 270, doi. 10.1080/09507116.2014.921047

By:

Tanaka, Yo;
Fujiwara, Shinichi;
Ogura, Tomo;
Sano, Tomokazu;
Hirose, Akio

Publication type:

Article

Development of Bonding Mechanisms for Different Materials During Forming.

Published in:

Metallurgist, 2017, v. 60, n. 11/12, p. 1175, doi. 10.1007/s11015-017-0424-x

By:

Bogatov, A.;
Salikhyanov, D.

Publication type:

Article

Modelling and analysis of the bonding mechanism of CBN grains for electroplated superabrasive tools-part 1: introduction and application of a novel approach for determining the bonding force and the failure modes.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 76, n. 9-12, p. 2051, doi. 10.1007/s00170-014-6411-5

By:

Li, Xuekun;
Wolf, Sebastian;
Zhu, Tianxing;
Zhi, Geng;
Rong, Yiming (Kevin)

Publication type:

Article

NMR and FTIR studies of coordinate-bonding and intramolecular and intermolecular hydrogen bonding in zinc(II)(3,5-diisopropylsalicylate)2.

Published in:

Journal of Coordination Chemistry, 2008, v. 61, n. 18, p. 2861, doi. 10.1080/00958970802087086

By:

Sedrakyan, Gegham Z.;
Evans, Frederick E.;
Minasyan, Seyran H.;
Tavadyan, Levon A.;
Wangila, Grant W.;
Walker, Richard B.;
Sorenson, John R. J.

Publication type:

Article

Exploring Chemical Catalytic Mechanisms for Enhancing Bonding Energy in Direct Silicon Dioxide Wafer Bonding.

Published in:

Applied Sciences (2076-3417), 2025, v. 15, n. 7, p. 3883, doi. 10.3390/app15073883

By:

Calvez, Aziliz;
Larrey, Vincent;
Noël, Paul;
Rieutord, François;
Fournel, Frank

Publication type:

Article

Effect of Si Concentration of a Brazing Precursor on the Bonding Strength of Aluminum Foam Bonded via Foaming Bonding.

Published in:

Materials Transactions, 2021, v. 62, n. 8, p. 1210, doi. 10.2320/matertrans.MT-M2020393

By:

Ryosuke Suzuki;
Yoshihiko Hangai;
Yusuke Asakawa;
Ikuo Shohji;
Hidetoshi Fujii;
Masaaki Matsubara

Publication type:

Article

The Role of Hydrogen Bonding and Halogen Bonding in the Polymorphic Structures of 3,5-Dibromo-2,6-diaminopyridinium Bromide.

Published in:

Journal of Chemical Crystallography, 2010, v. 40, n. 11, p. 902, doi. 10.1007/s10870-010-9760-4

By:

Haddad, Salim;
Willett, Roger;
Twamley, Brendan

Publication type:

Article

Role of Thin Sn Layer for Low Temperature Al‐Al Thermo‐compression Bonding of Wafer‐Level Hermetic Sealing.

Published in:

Electronics & Communications in Japan, 2018, v. 101, n. 5, p. 33, doi. 10.1002/ecj.12060

By:

SATOH, S. H. I. R. O.;
FUKUSHI, H. I. D. E. Y. U. K. I.;
ESASHI, M. A. S. A. Y. O. S. H. I.;
TANAKA, S. H. U. J. I.

Publication type:

Article

OPTIMAL BONDING CONDITIONS FOR DIFFUSION BONDING OF ALUMINUM METAL MATRIX COMPOSITES USING TAGUCHI BASED RESPONSE SURFACE METHODOLOGY.

Published in:

Journal of the Balkan Tribological Association, 2016, v. 22, n. 3-I, p. 2437

By:

SITTARAMANE, A.;
MAHENDRAN, G.

Publication type:

Article

Interfacial bonding mechanism and bonding strength of AlTiCrN coating by cathodic arc ion plating.

Published in:

Surface & Interface Analysis: SIA, 2015, v. 47, n. 2, p. 198, doi. 10.1002/sia.5688

By:

Dejun, Kong;
Guizhong, Fu;
Jinchun, Wang

Publication type:

Article

Diffusion bonding systems.

Published in:

Materialwissenschaft und Werkstoffechnik, 2014, v. 45, n. 9, p. 807, doi. 10.1002/mawe.201400285

By:

Jahn, S.;
Sändig, S.;
Dahms, S.;
Gemse, F.

Publication type:

Article

Fusible Systems for Bonding.

Published in:

Textile Chemist & Colorist, 1969, v. 1, n. 27, p. 43

By:

Smith, Delmont K.

Publication type:

Article

Comparison of shear bond strength and bonding time of a novel flash-free bonding system.

Published in:

Angle Orthodontist, 2016, v. 86, n. 2, p. 265, doi. 10.2319/011715-37.1

By:

Moonyoung Lee;
Kanavakis, Georgios

Publication type:

Article

Comparison of Bonding Time and Shear Bond Strength Between a Conventional and a New Integrated Bonding System.

Published in:

Angle Orthodontist, 2005, v. 75, n. 2, p. 237

By:

Bishara, Samir E.;
Oonsombat, Charuphan;
Soliman, Manal M. A.;
Warren, John J.;
Latfoon, John F.;
Ajiouni, Raed

Publication type:

Article

Interfacial Bonding and Fracture Behaviors of AZ63 Magnesium Alloy Sheet Processed by Accumulative Roll Bonding.

Published in:

Materials (1996-1944), 2023, v. 16, n. 14, p. 4981, doi. 10.3390/ma16144981

By:

Guo, Junqing;
Sun, Wanting;
Xiang, Nan;
Chen, Fuxiao

Publication type:

Article

Some thoughts on bondability and strength of gold wire bonding.

Published in:

Gold Bulletin, 2012, v. 45, n. 3, p. 115, doi. 10.1007/s13404-012-0060-y

By:

Zulkifli, Muhammad;
Abdullah, Shahrum;
Othman, Norinsan;
Jalar, Azman

Publication type:

Article

Comparative study on the nonadditivity of methyl group in lithium bonding and hydrogen bonding.

Published in:

International Journal of Quantum Chemistry, 2009, v. 109, n. 5, p. 1127, doi. 10.1002/qua.21929

By:

Li, Qingzhong;
Cheng, Jianbo;
Li, Wenzuo;
Gong, Baoan;
Sun, Jiazhong

Publication type:

Article

σ-Hole bonding and hydrogen bonding: Competitive interactions.

Published in:

International Journal of Quantum Chemistry, 2007, v. 107, n. 15, p. 3046, doi. 10.1002/qua.21419

By:

Politzer, Peter;
Murray, Jane S.;
Lane, Pat

Publication type:

Article

Highly Active Halogen Bonding and Chalcogen Bonding Chloride Transporters with Non‐Protonophoric Activity.

Published in:

Chemistry - A European Journal, 2021, v. 27, n. 45, p. 11738, doi. 10.1002/chem.202101681

By:

Bickerton, Laura E.;
Docker, Andrew;
Sterling, Alistair J.;
Kuhn, Heike;
Duarte, Fernanda;
Beer, Paul D.;
Langton, Matthew J.

Publication type:

Article

Al-Ge Diffusion Bonding for Hermetic Sealing Application.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2387, doi. 10.1007/s11664-015-3683-y

By:

Chidambaram, Vivek;
Wickramanayaka, Sunil

Publication type:

Article

Taking the halogen bonding-hydrogen bonding competition one step further: complexes of difluoroiodomethane with trimethylphosphine, dimethyl sulfide and chloromethane.

Published in:

Acta Crystallographica Section B: Structural Science, Crystal Engineering & Materials, 2017, v. 73, n. 2, p. 168, doi. 10.1107/S2052520617001354

By:

Geboes, Yannick;
De Proft, Frank;
Herrebout, Wouter A.

Publication type:

Article

Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments.

Published in:

Micromachines, 2021, v. 12, n. 7, p. 750, doi. 10.3390/mi12070750

By:

Lee, Jun-Hao;
Li, Pin-Kuan;
Hung, Hai-Wen;
Chuang, Wallace;
Schellkes, Eckart;
Yasuda, Kiyokazu;
Song, Jenn-Ming

Publication type:

Article

Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding.

Published in:

Micromachines, 2020, v. 11, n. 5, p. 454, doi. 10.3390/mi11050454

By:

Yamamoto, Michitaka;
Matsumae, Takashi;
Kurashima, Yuichi;
Takagi, Hideki;
Suga, Tadatomo;
Takamatsu, Seiichi;
Itoh, Toshihiro;
Higurashi, Eiji

Publication type:

Article

Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames.

Published in:

Micromachines, 2018, v. 9, n. 4, p. 181, doi. 10.3390/mi9040181

By:

Tanaka, Koki;
Tanaka, Shuji;
Hirano, Hideki;
Kumano, Masafumi;
Froemel, Joerg

Publication type:

Article

Dye–tissue interactions: mechanisms, quantification and bonding parameters for dyes used in biological staining.

Published in:

Biotechnic & Histochemistry, 2005, v. 80, n. 2, p. 49, doi. 10.1080/10520290500219982

By:

Dapson, RW

Publication type:

Article

Selective Self‐Assembly of Supramolecular Helices and Macrocycles Directed by Halogen Bonding.

Published in:

Chemistry - A European Journal, 2025, v. 31, n. 7, p. 1, doi. 10.1002/chem.202403821

By:

Hu, Zhi‐Yuan;
Du, Mengxin;
Li, Wenhao;
Huang, Xin;
Ma, Ruijie;
Li, Yunhan;
Shen, Ren‐Zeng;
Wang, Tao;
Liu, Chuan‐Zhi;
Li, Zhan‐Ting

Publication type:

Article

Redox‐Active Triazole‐Derived Mesoionic Imines with Ferrocenyl Substituents and their Metal Complexes: Directed Hydrogen‐Bonding, Unusual C−H Activation and Ion‐Pair Formation.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 35, p. 1, doi. 10.1002/chem.202400730

By:

Rudolf, Richard;
Batman, Derman;
Mehner, Niklas;
Walter, Robert R. M.;
Sarkar, Biprajit

Publication type:

Article

Halogen Bonding Tripodal Metallo‐Receptors for Phosphate Recognition and Sensing in Aqueous‐Containing Organic Media.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 2, p. 1, doi. 10.1002/chem.202302775

By:

Bagha, Hena;
Hein, Robert;
Lim, Jason Y. C.;
Durr, Christopher B.;
Sambrook, Mark R.;
Beer, Paul D.

Publication type:

Article

Morphology and properties of diamond-copper/steel matrix abrasive composites prepared by roll-bonding technique.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 112, n. 3/4, p. 705, doi. 10.1007/s00170-020-05911-9

By:

Chen, Wei-dong;
Li, Yan-guo;
Zou, Qin;
Xiong, Jian-chao;
Lou, Zhi-chao;
Jiao, Zi-Jian;
Dang, Shang;
Yuan, Dong-fang;
Zhao, Yu-cheng;
Wang, Ming-zhi

Publication type:

Article

A comparative study on hot deformation and solid-state bonding behavior of aluminum alloys for the integration of solid-state joining and forming processes.

Published in:

International Journal of Advanced Manufacturing Technology, 2019, v. 104, n. 9-12, p. 3849, doi. 10.1007/s00170-019-04153-8

By:

Yu, Junquan;
Zhao, Guoqun;
Chen, Xiaoxue;
Liang, Mengchao

Publication type:

Article

传统扩散连接在金属材料加工中的研究及应用.

Published in:

Metal Working (1674-165X), 2024, n. 10, p. 70

By:

赵金辉;
郭婧;
张浩宇

Publication type:

Article

镍−钨−碳化硅复合电镀层结合强度的影响因素.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 3, p. 167, doi. 10.19289/j.1004-227x.2022.03.003

By:

黄嘉乐;
王启伟;
刘嘉楠;
朱胜;
陈利华;
李卫

Publication type:

Article

Effect of ultrasonic parameters on bonding quality of rolled T2 copper foil and Au wire.

Published in:

Integrated Ferroelectrics, 2016, v. 170, n. 1, p. 100, doi. 10.1080/10584587.2016.1169786

By:

Peng Zhang;
Qiang Zhu;
Gang Chen;
Dong Luan;
Chuanjie Wang

Publication type:

Article

Transverse heterogeneity of interfacial bonding behavior during roll bonding of Cu/Al bimetallic plates.

Published in:

Metallurgical Research & Technology, 2019, v. 116, n. 6, p. 1, doi. 10.1051/metal/2019058

By:

Gao, Xiang Yu;
Wang, Tao;
Ren, Zhong Kai;
Han, Jian Chao;
He, Dong Ping;
Li, Sha

Publication type:

Article

On an IC wire bonding machine production–inventory problem with time value of money.

Published in:

International Journal of Production Research, 2017, v. 55, n. 9, p. 2431, doi. 10.1080/00207543.2016.1213914

By:

Gong, Dah-Chuan;
Kang, Jia-Lun;
Lin, Gary C.;
Hou, T. C.

Publication type:

Article

Bonding efficiency of contemporary adhesives to the dentinoenamel junction zone.

Published in:

European Journal of Oral Sciences, 2011, v. 119, n. 3, p. 232, doi. 10.1111/j.1600-0722.2011.00819.x

By:

Li, Fang;
Liu, Xiaoyang;
Zhang, Ling;
Shen, Lijuan;
Chen, Jihua

Publication type:

Article

Optimization and Analysis of Ultrasonic Wedge Bonding Parameters for Enhanced Bonding Performance in 21700 Cylindrical Lithium Battery Modules.

Published in:

Pertanika Journal of Science & Technology, 2025, n. 3, p. 1483, doi. 10.47836/pjst.33.3.18

By:

Bin Luo;
Md Saad, Mohamad Hanif;
Molla, Altaf Hossain;
Harun, Zambri

Publication type:

Article

Effect of diamond bur cutting efficacy on dentin bond strengths of different bonding systems.

Published in:

Journal of Dental Medicine, 2009, v. 21, n. 4, p. 1

By:

Shirani, F.;
Malekipour, M.;
Shahabi, H.

Publication type:

Article

Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form.

Published in:

Welding International, 2023, v. 37, n. 11, p. 666, doi. 10.1080/09507116.2023.2230657

By:

Tanaka, Yasunori;
Koshiba, Keiko;
Iizuka, Tomonori;
Ito, Mayumi;
Higashimine, Koichi;
Tatsumi, Kohei

Publication type:

Article

Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bonding.

Published in:

Welding International, 2016, v. 30, n. 9, p. 653, doi. 10.1080/09507116.2016.1142186

By:

Fujiwara, Shinichi;
Harada, Masahide;
Fujita, Yuji

Publication type:

Article

Cocrystal screening of benznidazole based on electronic transition, molecular reactivity, hydrogen bonding, and stability.

Published in:

Journal of Molecular Modeling, 2024, v. 30, n. 11, p. 1, doi. 10.1007/s00894-024-06146-1

By:

Paneru, Tirth Raj;
Chaudhary, Manoj Kumar;
Joshi, Bhawani Datt;
Tandon, Poonam

Publication type:

Article

Intramolecular hydrogen bonding, π-π stacking interactions, and substituent effects of 8-hydroxyquinoline derivative supermolecular structures: a theoretical study.

Published in:

Journal of Molecular Modeling, 2019, v. 25, n. 8, p. N.PAG, doi. 10.1007/s00894-019-4140-2

By:

Zhang, Jian;
Li, Xiu

Publication type:

Article

Synthesis of Thiosemicarbazones and Their Organoiodine Cocrystals: Cooperative Effects of Halogen and Hydrogen Bonding.

Published in:

Journal of Chemical Crystallography, 2022, v. 52, n. 4, p. 512, doi. 10.1007/s10870-022-00931-7

By:

Peloquin, Andrew J.;
Ragusa, Arianna C.;
Arman, Hadi D.;
McMillen, Colin D.;
Pennington, William T.

Publication type:

Article

Numerical Simulation of Minimal Average Bonding Strength to Suppress Rebounding in Cold Spraying Cu/Cu: A Preliminary Study.

Published in:

Journal of Thermal Spray Technology, 2015, v. 24, n. 1/2, p. 75, doi. 10.1007/s11666-014-0150-x

By:

Wang, Kai;
Kong, Lingyan;
Tao, Yongshan;
Li, Tiefan;
Xiong, Tianying

Publication type:

Article