Works matching DE "CIRCUIT board manufacturing"
Results: 123
Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies.
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- Corrosion Engineering, Science & Technology, 2013, v. 48, n. 6, p. 436, doi. 10.1179/1743278213Y.0000000096
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- Article
A scheduling problem for PCB assembly: a case with multiple lines.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 43, n. 11/12, p. 1189, doi. 10.1007/s00170-008-1797-6
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- Article
Optimization of PCB component placements for the collect-and-place machines.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 37, n. 7/8, p. 828, doi. 10.1007/s00170-007-1014-z
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- Article
Experimental studies on cryogenic recycling of printed circuit board.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 7/8, p. 657, doi. 10.1007/s00170-006-0634-z
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- Article
A LINEAR PROGRAM FOR ECONOMIC LOT SIZES USING LABOR PRIORITIES.
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- Management Science, 1974, v. 21, n. 3, p. 277, doi. 10.1287/mnsc.21.3.277
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- Article
Detection of Banned and Restricted Ozone-Depleting Chemicals in Printed Circuit Boards.
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- Environmental Forensics, 2008, v. 9, n. 4, p. 320, doi. 10.1080/15275920802502083
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- Article
A Study on the Fabrication Parameters and Dielectric Properties of PTFE Composites Filled with Al2O3 and SiO2 Nanoparticles.
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- Journal of Industrial Textiles, 2011, v. 40, n. 4, p. 361, doi. 10.1177/1528083710379448
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- Article
Group-scheduling problems in electronics manufacturing.
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- Journal of Scheduling, 2010, v. 13, n. 2, p. 177, doi. 10.1007/s10951-009-0147-3
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- Article
Hardware-in-the-Loop Simulation System Based on Unity3D for Winding Machine.
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- Journal of Donghua University (English Edition), 2024, v. 41, n. 3, p. 298, doi. 10.19884/j.1672-5220.202311003
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- Article
Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method.
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- Journal of Donghua University (English Edition), 2023, v. 40, n. 5, p. 525, doi. 10.19884/j.1672-5220.202209003
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- Article
MODELING OF GRINDING PROCESS BY PRINTED CIRCUIT BOARDS RECYCLING.
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- Annals of DAAAM & Proceedings, 2010, p. 475
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- Article
Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder.
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- Scientific Reports, 2019, v. 9, n. 1, p. N.PAG, doi. 10.1038/s41598-019-50985-5
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- Article
Measurements of Thermally-Induced Curvatures and Warpages of Printed Circuit Board during a Solder Reflow Process Using Strain Gauges.
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- Applied Sciences (2076-3417), 2017, v. 7, n. 7, p. 739, doi. 10.3390/app7070739
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- Article
Energy Recovery from Waste of Printed Circuit Boards in Plasmatron Plasma Reactor.
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- Polish Journal of Environmental Studies, 2014, v. 23, n. 1, p. 277
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- Article
A heuristic approach for component scheduling on a high-speed PCB assembly machine.
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- Production Planning & Control, 2007, v. 18, n. 8, p. 655, doi. 10.1080/09537280701602683
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- Article
Estimating printed circuit board assembly times using neural networks.
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- International Journal of Production Research, 2010, v. 48, n. 8, p. 2201, doi. 10.1080/00207540802572574
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- Article
Integrated simulation tool for quality support in the low-volume high-complexity electronics manufacturing domain.
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- International Journal of Production Research, 2010, v. 48, n. 1, p. 45, doi. 10.1080/00207540802427886
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- Article
Genetic algorithm-based approach for makespan minimization in a flow shop with queue time limits and skipping jobs.
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- Advances in Production Engineering & Management, 2023, v. 18, n. 2, p. 152, doi. 10.14743/apem2023.2.463
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- Article
Separation of transition metals and chelated complexes in wastewaters.
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- Environmental Progress & Sustainable Energy, 2015, v. 34, n. 3, p. 761, doi. 10.1002/ep.12065
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- Article
Fabrication of Fluxgate Sensor Heads by Milling with a Circuit Board Plotter and Influence of Core Annealing Conditions on Sensor Performance.
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- Journal of Superconductivity & Novel Magnetism, 2017, v. 30, n. 11, p. 3257, doi. 10.1007/s10948-016-3681-1
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- Article
Energy saving possibilities for glass fabric finishing for printed circuit boards and construction reinforcements.
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- Technical Textiles / Technische Textilen, 2013, v. 56, n. 2, p. E66
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- Article
Small-size printed loop-type antenna integrated with two stacked coupled-fed shorted strip monopoles for eight-band LTE/GSM/UMTS operation in the mobile phone.
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- Microwave & Optical Technology Letters, 2010, v. 52, n. 7, p. 1471, doi. 10.1002/mop.25257
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- Article
Label-/tag-free traceability of electronic PCB in SMD assembly based on individual inherent surface patterns.
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- International Journal of Advanced Manufacturing Technology, 2018, v. 98, n. 9-12, p. 3081, doi. 10.1007/s00170-018-2492-x
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- Article
A metalized-hole PCB as a strain gauge.
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- Instruments & Experimental Techniques, 2016, v. 59, n. 6, p. 879, doi. 10.1134/S0020441216060051
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- Article
Passively aligned multichannel fiber-pigtailing of planar integrated optical waveguides.
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- Optical Engineering, 2017, v. 56, n. 2, p. 1, doi. 10.1117/1.OE.56.2.026115
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- Article
INTELLECTUAL SYSTEM FOR PRINTED CIRCUIT BOARD MANUFACTURE BASED ON MIRAE MX-200.
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- Electronics & Control Systems, 2021, v. 68, n. 2, p. 38, doi. 10.18372/1990-5548.68.16090
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- Article
Design of Printed Circuit Board Production using Water Jet Technology.
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- TEM Journal, 2019, v. 8, n. 4, p. 1313, doi. 10.18421/TEM84-30
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- Article
Monitoring and Interpretation of Process Variability Generated from the Integration of the Multivariate Cumulative Sum Control Chart and Artificial Intelligence.
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- Applied Sciences (2076-3417), 2024, v. 14, n. 21, p. 9705, doi. 10.3390/app14219705
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- Article
Development of an Image Processing Application for Element Detection in a Printed Circuit Board Manufacturing Cell.
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- Applied Sciences (2076-3417), 2024, v. 14, n. 13, p. 5679, doi. 10.3390/app14135679
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- Article
A Photonically-Excited Leaky-Wave Antenna Array at E-Band for 1-D Beam Steering.
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- Applied Sciences (2076-3417), 2020, v. 10, n. 10, p. 3474, doi. 10.3390/app10103474
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- Article
High Refractive Index Electromagnetic Devices in Printed Technology Based on Glide-Symmetric Periodic Structures.
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- Applied Sciences (2076-3417), 2020, v. 10, n. 9, p. 3216, doi. 10.3390/app10093216
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- Article
Bayesian process optimization using failure amplification method.
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- Applied Stochastic Models in Business & Industry, 2011, v. 27, n. 4, p. 402, doi. 10.1002/asmb.846
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- Article
PCB Defect Classification with Data Augmentation-Based Ensemble Method for Sustainable Smart Manufacturing.
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- Sustainability (2071-1050), 2024, v. 16, n. 23, p. 10417, doi. 10.3390/su162310417
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- Article
Printed Circuits: Reliability for All: Still, faulty operation in elevators must always be recognized as a possibility.
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- Elevator World, 2021, v. 69, n. 8, p. 78
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- Article
GAL Goes Lean and Green.
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- Elevator World, 2011, v. 60, n. 3, p. 136
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- Article
Effect of Hydroxyl Group Concentration Generated by Vacuum Ultraviolet Light on the Adhesion Between Epoxy Resin and Copper.
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- Journal of Electronic Materials, 2024, v. 53, n. 11, p. 7044, doi. 10.1007/s11664-024-11379-0
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- Article
In situ TEM Characterization of Phase Transformations and Kirkendall Void Formation During Annealing of a Cu–Au–Sn–Cu Diffusion Bonding Joint.
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- Journal of Electronic Materials, 2022, v. 51, n. 4, p. 1568, doi. 10.1007/s11664-021-09390-w
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- Article
Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock.
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- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6086, doi. 10.1007/s11664-016-4965-8
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- Article
Corrosion of RoHS-Compliant Surface Finishes in Corrosive Mixed Flowing Gas Environments.
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- Journal of Electronic Materials, 2012, v. 41, n. 3, p. 611, doi. 10.1007/s11664-011-1799-2
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- Article
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z
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- Article
Liquid Metal‐Based High‐Density Interconnect Technology for Stretchable Printed Circuits.
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- Advanced Functional Materials, 2024, v. 34, n. 31, p. 1, doi. 10.1002/adfm.202309707
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- Article
Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process.
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- Journal of Intelligent Manufacturing, 2019, v. 30, n. 5, p. 2291, doi. 10.1007/s10845-017-1389-0
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- Article
A case-based evolutionary model for defect classification of printed circuit board images.
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- Journal of Intelligent Manufacturing, 2008, v. 19, n. 2, p. 203, doi. 10.1007/s10845-008-0074-8
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- Article
某电路板企业生产废水处理与回用工程 实例及分析.
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- Industrial Water Treatment, 2024, v. 44, n. 8, p. 205, doi. 10.19965/j.cnki.iwt.2023-1210
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- Article
Effects of torrefaction and water washing on the properties and combustion reactivity of various wastes.
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- International Journal of Energy Research, 2021, v. 45, n. 6, p. 8125, doi. 10.1002/er.5458
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- Article
Improved Mixed-Integer Linear Programming Model for Short-Term Scheduling of the Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.
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- Mathematics (2227-7390), 2021, v. 9, n. 21, p. 2653, doi. 10.3390/math9212653
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- Article
Mixed-Integer Linear Programming Model and Heuristic for Short-Term Scheduling of Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.
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- Mathematics (2227-7390), 2021, v. 9, n. 6, p. 653, doi. 10.3390/math9060653
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- Article
A new approach to designing easily recyclable printed circuit boards.
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- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-26677-y
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- Article
End-to-end deep learning framework for printed circuit board manufacturing defect classification.
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- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-16302-3
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- Article
Transcriptome Analysis of Cyanide-Treated Rice Seedlings: Insights into Gene Functional Classifications.
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- Life (2075-1729), 2022, v. 12, n. 11, p. 1701, doi. 10.3390/life12111701
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- Article