Works matching DE "PRINTED circuits"

Results: 2013

Advanced Recovery Strategies for Metallic and Nonmetallic Fractions from Waste Printed Circuit Boards: A Comprehensive Review.

Published in:

Separation & Purification Reviews, 2025, v. 54, n. 1, p. 37, doi. 10.1080/15422119.2024.2358481

By:

Zhang, Jie;
Peng, Zhengxin;
Wang, Jiang;
Wang, Ruiqi;
Xu, Hui;
Mao, Shanshan;
Deng, Wei;
Jiang, Nan;
Feng, Qian;
Zhou, Xing

Publication type:

Article

Localised aqueous corrosion of electroless nickel immersion gold-coated copper.

Published in:

Corrosion Engineering, Science & Technology, 2022, v. 57, n. 6, p. 520, doi. 10.1080/1478422X.2022.2096322

By:

Mousavi, M.;
Kosari, A.;
Mol, J. M. C.;
Gonzalez-Garcia, Y.

Publication type:

Article

Methods for predicting corrosion on electronic products.

Published in:

Corrosion Engineering, Science & Technology, 2014, v. 49, n. 7, p. 661, doi. 10.1179/1743278214Y.0000000174

By:

Lindgren, M.;
Leisner, P.;
Poder, R.

Publication type:

Article

Intermediate bus architecture: is it for everyone?

Published in:

Power Engineer, 2003, v. 17, n. 5, p. 40, doi. 10.1049/pe:20030512

By:

Schlecht, Martin

Publication type:

Article

Multifunctional Fiber for Synchronous Bio‐Sensing and Power Supply in Sweat Environment.

Published in:

Advanced Functional Materials, 2023, v. 33, n. 30, p. 1, doi. 10.1002/adfm.202301174

By:

Tong, Xiaoling;
Yang, Dongzi;
Hua, Tianjiao;
Li, Shuo;
Wang, Bingying;
Shao, Yuanlong

Publication type:

Article

Direct Freeform Laser Fabrication of 3D Conformable Electronics.

Published in:

Advanced Functional Materials, 2023, v. 33, n. 1, p. 1, doi. 10.1002/adfm.202210084

By:

Zheng, Bujingda;
Zhao, Ganggang;
Yan, Zheng;
Xie, Yunchao;
Lin, Jian

Publication type:

Article

A Nanoporous Carbon‐MXene Heterostructured Nanocomposite‐Based Epidermal Patch for Real‐Time Biopotentials and Sweat Glucose Monitoring (Adv. Funct. Mater. 49/2022).

Published in:

Advanced Functional Materials, 2022, v. 32, n. 49, p. 1, doi. 10.1002/adfm.202270280

By:

Zahed, Md Abu;
Sharifuzzaman, Md;
Yoon, Hyosang;
Asaduzzaman, Md;
Kim, Dong Kyun;
Jeong, Seonghoon;
Pradhan, Gagan Bahadur;
Shin, Young Do;
Yoon, Sang Hyuk;
Sharma, Sudeep;
Zhang, Shipeng;
Park, Jae Yeong

Publication type:

Article

Stretchable Batteries: Stand‐Alone Intrinsically Stretchable Electronic Device Platform Powered by Stretchable Rechargeable Battery (Adv. Funct. Mater. 50/2020).

Published in:

Advanced Functional Materials, 2020, v. 30, n. 50, p. 1, doi. 10.1002/adfm.202070328

By:

Song, Woo‐Jin;
Kong, Minsik;
Cho, Sunghwan;
Lee, Sangyeop;
Kwon, Jimin;
Son, Hye Bin;
Song, Jun Hyuk;
Lee, Dong‐Gue;
Song, Gyujin;
Lee, Sang‐Young;
Jung, Sungjune;
Park, Soojin;
Jeong, Unyong

Publication type:

Article

Stand‐Alone Intrinsically Stretchable Electronic Device Platform Powered by Stretchable Rechargeable Battery.

Published in:

Advanced Functional Materials, 2020, v. 30, n. 50, p. 1, doi. 10.1002/adfm.202003608

By:

Song, Woo‐Jin;
Kong, Minsik;
Cho, Sunghwan;
Lee, Sangyeop;
Kwon, Jimin;
Son, Hye Bin;
Song, Jun Hyuk;
Lee, Dong‐Gue;
Song, Gyujin;
Lee, Sang‐Young;
Jung, Sungjune;
Park, Soojin;
Jeong, Unyong

Publication type:

Article

Soft Electronics Manufacturing Using Microcontact Printing.

Published in:

Advanced Functional Materials, 2019, v. 29, n. 51, p. N.PAG, doi. 10.1002/adfm.201906551

By:

Yalcintas, Ezgi Pinar;
Ozutemiz, Kadri Bugra;
Cetinkaya, Toygun;
Dalloro, Livio;
Majidi, Carmel;
Ozdoganlar, O. Burak

Publication type:

Article

Mechanical and spectroscopic characterization of functionalized g-C3N4 fillers loaded epoxy reinforced banana natural Fiber composite for PCB applications.

Published in:

Journal of Polymer Research, 2024, v. 31, n. 12, p. 1, doi. 10.1007/s10965-024-04218-7

By:

Sundeep, Dola;
Varadharaj, Eswaramoorthy K

Publication type:

Article

Novel semi-N-methyl substituted bisbenzimidazole based polyimide films with low coefficient of thermal expansion and high Tg.

Published in:

Journal of Polymer Research, 2021, v. 28, n. 11, p. 1, doi. 10.1007/s10965-021-02757-x

By:

Chen, Haiquan;
Dai, Fengna;
Yan, Xiaoying;
Chen, Chunhai;
Qian, Guangtao;
Yu, Youhai

Publication type:

Article

An adaptive feature reconstruction network for the precise segmentation of surface defects on printed circuit boards.

Published in:

Journal of Intelligent Manufacturing, 2023, v. 34, n. 7, p. 3197, doi. 10.1007/s10845-022-02008-w

By:

Kang, Danqing;
Lai, Jianhuang;
Zhu, Junyong;
Han, Yu

Publication type:

Article

Modeling the machine configuration and line-balancing problem of a PCB assembly line with modular placement machines.

Published in:

International Journal of Advanced Manufacturing Technology, 2011, v. 54, n. 1-4, p. 349, doi. 10.1007/s00170-010-2920-z

By:

Rong, Aiying;
Toth, Attila;
Nevalainen, Olli;
Knuutila, Timo;
Lahdelma, Risto

Publication type:

Article

Algorithm of locating PCB components based on colour distribution of solder joints.

Published in:

International Journal of Advanced Manufacturing Technology, 2011, v. 53, n. 5-8, p. 601, doi. 10.1007/s00170-010-2850-9

By:

Zeng, Zhou;
Ma, Lizhuang;
Suwa, Masaki

Publication type:

Article

Wavelet transform based image template matching for automatic component inspection.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 9-12, p. 1033, doi. 10.1007/s00170-010-2567-9

By:

Han-Jin Cho;
Tae-Hyoung Park

Publication type:

Article

Solder paste inspection using region-based defect detection.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 7/8, p. 725, doi. 10.1007/s00170-008-1639-6

By:

Tak-Wai Hui;
Grantham Pang

Publication type:

Article

Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 3/4, p. 335, doi. 10.1007/s00170-008-1599-x

By:

Yilmaz, I. O.;
Günther, H.-O.;
Jain, S.

Publication type:

Article

Analysis of sonic waves generated during laser engraving of printed circuits.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 1/2, p. 138, doi. 10.1007/s00170-008-1581-7

By:

Gorkič, Aleš;
Kovačič, Drago;
Diaci, Janez

Publication type:

Article

Heuristics to minimize makespan of parallel batch processing machines.

Published in:

International Journal of Advanced Manufacturing Technology, 2008, v. 37, n. 9-10, p. 1005, doi. 10.1007/s00170-007-1042-8

By:

Damodaran, Purushothaman;
Ping-Yu Chang

Publication type:

Article

A particle swarm optimization approach to optimize component placement in printed circuit board assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 610, doi. 10.1007/s00170-006-0777-y

By:

Yee-Ming Chen;
Chun-Ta Lin

Publication type:

Article

Automated inspection of PCB components using a genetic algorithm template-matching approach.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 3/4, p. 293, doi. 10.1007/s00170-006-0730-0

By:

Crispin, A. J.;
Rankov, V.

Publication type:

Article

Printed circuit board recycling process and its environmental impact assessment.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 9/10, p. 1030, doi. 10.1007/s00170-006-0656-6

By:

Dong Xiang;
Peng Mou;
Jinsong Wang;
Guanghong Duan;
Zhang, Hong C.

Publication type:

Article

Experimental studies on cryogenic recycling of printed circuit board.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 7/8, p. 657, doi. 10.1007/s00170-006-0634-z

By:

Yuan, Chris;
Zhang, Hong;
McKenna, Gregory;
Korzeniewski, Carol;
Li, Jianzhi

Publication type:

Article

Design and development of a new machine vision wire bonding inspection system.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 3/4, p. 323, doi. 10.1007/s00170-006-0611-6

By:

Der-Baau Perng;
Cheng-Chuan Chou;
Shu-Ming Lee

Publication type:

Article

Effectiveness study of an automated 3D laminography x-ray inspection system in a high-volume–low-mix SMT line.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 11/12, p. 1191, doi. 10.1007/s00170-005-0157-z

By:

Manjeshwar, Praveen Kumar;
Craik, Jorge;
Phadnis, Sachin;
Srihari, K.

Publication type:

Article

Printed circuit board scheduling in an openshop manufacturing environment.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 980, doi. 10.1007/s00170-005-2584-2

By:

Çatay, Bülent;
Vakharia, Asoo J.;
Erengüç, S. Selçuk

Publication type:

Article

A genetic algorithm approach to optimising component placement and retrieval sequence for chip shooter machines.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 28, n. 5/6, p. 556, doi. 10.1007/s00170-004-2390-2

By:

Ho, W.;
Ji, P.

Publication type:

Article

Integral DOE and MANOVA techniques for classification feature selection: using solder joint defects as an example.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 3/4, p. 392, doi. 10.1007/s00170-004-2186-4

By:

Wang, Chien-Chih;
Jiang, Bernard C.

Publication type:

Article

A genetic algorithm to optimise the component placement process in PCB assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 11/12, p. 1397, doi. 10.1007/s00170-004-2132-5

By:

Ho, W.;
Ji, P.

Publication type:

Article

Fatigue of SMT solder joint including torsional curvature and chip location optimization.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 7/8, p. 887, doi. 10.1007/s00170-003-2044-9

By:

Qiang Guo;
Mei Zhao

Publication type:

Article

Setup reduction in printed circuit board assembly by efficient sequencing.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 3, p. 276, doi. 10.1007/s00170-003-1634-x

By:

Narayanaswami, R.;
Iyengar, V.

Publication type:

Article

Auto-calibration of an SMT machine by machine vision.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 3, p. 243, doi. 10.1007/s00170-003-1765-0

By:

Shih, C.-L.;
Ruo, C.-W.

Publication type:

Article

Supplier management for manufacturer - a case study of flexible PCB.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 7/8, p. 785, doi. 10.1007/s00170-003-1808-6

By:

Kreng, Victor B.;
I.C. Wang

Publication type:

Article

A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board.

Published in:

International Journal of Advanced Manufacturing Technology, 2004, v. 24, n. 7/8, p. 474, doi. 10.1007/s00170-003-1583-4

By:

Leung, E.S.W.;
Yung, W.K.C.;
Lee, W.B.

Publication type:

Article

A DMAIC approach to printed circuit board quality improvement.

Published in:

International Journal of Advanced Manufacturing Technology, 2004, v. 23, n. 7/8, p. 523, doi. 10.1007/s00170-003-1721-z

By:

Tong, J. P. C.;
Tsung, F.;
Yen, B. P. C.

Publication type:

Article

The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture.

Published in:

International Journal of Advanced Manufacturing Technology, 2004, v. 23, n. 3/4, p. 245, doi. 10.1007/s00170-003-1667-1

By:

Yung, K. C.;
Chan, K. C.;
Yue, T. M.;
Yeung, K. F.

Publication type:

Article

A Novel Approach Using a Two-Dimensional Wavelet Transform in Ball Grid Array (BGA) Substrate Conducting Path Inspections.

Published in:

International Journal of Advanced Manufacturing Technology, 2003, v. 21, n. 3, p. 223

By:

Yeh, C.-H.

Publication type:

Article

Genetic algorithm optimization in discrete element simulation of electric parts separation from printed circuit board.

Published in:

Structural & Multidisciplinary Optimization, 2021, v. 64, n. 4, p. 2763, doi. 10.1007/s00158-021-02982-4

By:

Ueda, Takao;
Katagiri, Jun;
Oki, Tatsuya;
Koyanaka, Shigeki

Publication type:

Article

Analytical and Experimental Study on Suppression of Electromagnetic Interference on High Speed Printed Circuit Board for Wireless Communication Systems.

Published in:

Wireless Personal Communications, 2017, v. 92, n. 2, p. 333, doi. 10.1007/s11277-016-3546-8

By:

Packianathan, Rajeswari;
Srinivasan, Raju

Publication type:

Article

Diversity Antenna Design for Wireless Alarm Networks.

Published in:

Wireless Personal Communications, 2014, v. 78, n. 1, p. 729, doi. 10.1007/s11277-014-1780-5

By:

Bilgiç, Mustafa;
Yeğin, Korkut

Publication type:

Article

Automatic printed circuit board inspection: a comprehensible survey.

Published in:

Discover Artificial Intelligence, 2024, v. 4, n. 1, p. 1, doi. 10.1007/s44163-023-00081-5

By:

Fonseca, Luis Augusto Libório Oliveira;
Iano, Yuzo;
Oliveira, Gabriel Gomes de;
Vaz, Gabriel Caumo;
Carnielli, Giulliano Paes;
Pereira, Júlio César;
Arthur, Rangel

Publication type:

Article

泊车辅助系统控制器辐射发射测试失效分析.

Published in:

Automotive Digest, 2024, n. 11, p. 53, doi. 10.19822/j.cnki.1671-6329.20240015

By:

孙志颖;
武晓宇;
付国良

Publication type:

Article

电涡流位移传感器的仿真分析与验证.

Published in:

Automotive Digest, 2024, n. 11, p. 18, doi. 10.19822/j.cnki.1671-6329.20240013

By:

黄瑞;
张晓亮;
谢依文

Publication type:

Article

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs.

Published in:

Inventions (2411-5134), 2023, v. 8, n. 3, p. 77, doi. 10.3390/inventions8030077

By:

Korobkov, Maksim A.;
Vasilyev, Fedor V.;
Khomutskaya, Olga V.

Publication type:

Article

Radio Frequency Properties of a 3D Printed Klystron Circuit.

Published in:

Instruments (2410-390X), 2024, v. 8, n. 1, p. 9, doi. 10.3390/instruments8010009

By:

Wehner, Charlotte;
Shirley, Bradley;
Mathesen, Garrett;
Merrick, Julian;
Weatherford, Brandon;
Nanni, Emilio Alessandro

Publication type:

Article

RECURSION MODELS FOR DESCRIBING AND MANAGING THE TRANSIENT FLOW OF MATERIALS IN GENERALIZED FLOWLINES.

Published in:

Management Science, 1989, v. 35, n. 6, p. 722, doi. 10.1287/mnsc.35.6.722

By:

Saboo, S.;
Wang, L.;
Wilhelm, W. E.

Publication type:

Article

Research on Polyolefin Resin Substrates with Good Processability.

Published in:

Plastics Science & Technology / Suliao Ke-Ji, 2024, v. 52, n. 4, p. 75, doi. 10.15925/j.cnki.issn1005-3360.2024.04.015

By:

GAO Shu-jian;
FENG Chun-ming;
JIN Xia;
WU Cong;
FENG Bei-bei

Publication type:

Article

嗜酸菌好氧-厌氧耦合溶解浸出副产物研究.

Published in:

Environmental Science & Technology (10036504), 2022, v. 45, n. 12, p. 44, doi. 10.19672/j.cnki.1003-6504.1465.22.338

By:

杨远坤;
马甜;
谌书

Publication type:

Article

Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits.

Published in:

Advanced Electronic Materials, 2023, v. 9, n. 4, p. 1, doi. 10.1002/aelm.202201012

By:

Kasi, Venkat;
Zareei, Amin;
Gopalakrishnan, Sarath;
Alcaraz, Alejandro M.;
Joshi, Shantanu;
Arfaei, Babak;
Rahimi, Rahim

Publication type:

Article