Analyses of plated films by thermal desorption spectrometry (TDS).
- Published in:
- Surface Engineering, 2012, v. 28, n. 9, p. 674, doi. 10.1179/1743294411Y.0000000083
- By:
- Publication type:
- Article
Works matching DE "PRINTED circuits"
Results: 2100
1
2
The big screen [chip testing].
- Published in:
- Electronics Systems & Software, 2006, v. 4, n. 4, p. 6, doi. 10.1049/ess:20060401
- By:
- Publication type:
- Article
3
Serial I/O layout shifts signal design.
- Published in:
- Electronics Systems & Software, 2005, v. 3, n. 5, p. 32, doi. 10.1049/ess:20050505
- By:
- Publication type:
- Article
4
A complete PLC on a chip?
- Published in:
- Computing & Control Engineering, 2004, v. 15, n. 5, p. 39, doi. 10.1049/cce:20040508
- By:
- Publication type:
- Article
5
A Negative Conductivity Material Makes a dc Invisibility Cloak Hide an Object at a Distance.
- Published in:
- Advanced Functional Materials, 2014, v. 23, n. 35, p. 4306, doi. 10.1002/adfm.201300226
- By:
- Publication type:
- Article
6
Influence of adhesive on optical fiber-based strain measurements on printed circuit boards.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10017-5
- By:
- Publication type:
- Article
7
Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22372, doi. 10.1007/s10854-021-06723-7
- By:
- Publication type:
- Article
8
Chemically integrated nickel-based resistors on printed circuits and its resistance precisely controlled.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17143, doi. 10.1007/s10854-021-06159-z
- By:
- Publication type:
- Article
9
Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 10, p. 13777, doi. 10.1007/s10854-021-05954-y
- By:
- Publication type:
- Article
10
Highly dispersed polypyrrole nanotubes for improving the conductivity of electrically conductive adhesives.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 12, p. 9675, doi. 10.1007/s10854-020-03513-5
- By:
- Publication type:
- Article
11
Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 5, p. 4027, doi. 10.1007/s10854-020-02950-6
- By:
- Publication type:
- Article
12
Effect of surface finishing on signal transmission loss of microstrip copper lines for high-speed PCB.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 16226, doi. 10.1007/s10854-019-01991-w
- By:
- Publication type:
- Article
13
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 11, p. 8877, doi. 10.1007/s10854-018-8905-7
- By:
- Publication type:
- Article
14
RF characteristics of flexible circuits patterned with hybrid Ag paste.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 5074, doi. 10.1007/s10854-017-8470-5
- By:
- Publication type:
- Article
15
Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9423, doi. 10.1007/s10854-016-4988-1
- By:
- Publication type:
- Article
16
Development of high thermal conductivity via BNNTs/epoxy/organic-Si hybrid composite systems.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 5217, doi. 10.1007/s10854-016-4416-6
- By:
- Publication type:
- Article
17
Decomposition of no-clean solder flux systems and their effects on the corrosion reliability of electronics.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 23, doi. 10.1007/s10854-015-3712-x
- By:
- Publication type:
- Article
18
Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin-bismuth (Sn-Bi) solder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 781, doi. 10.1007/s10854-015-3817-2
- By:
- Publication type:
- Article
19
The comparison of electrochemical migration mechanism between electroless silver plating and silver electroplating.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 931, doi. 10.1007/s10854-015-3836-z
- By:
- Publication type:
- Article
20
Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 10062, doi. 10.1007/s10854-015-3688-6
- By:
- Publication type:
- Article
21
Detection of capacitor electrolyte residues with FTIR in failure analysis.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 635, doi. 10.1007/s10854-013-1146-x
- By:
- Publication type:
- Article
22
Advanced characterization of mechanical properties of multilayer ceramic capacitors.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 627, doi. 10.1007/s10854-013-1478-6
- By:
- Publication type:
- Article
23
Counterfeit capacitors in the supply chain.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 645, doi. 10.1007/s10854-013-1147-9
- By:
- Publication type:
- Article
24
Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 954, doi. 10.1007/s10854-009-0024-z
- By:
- Publication type:
- Article
25
Next-generation printed circuit boards manufacturing: an innovative numerical investigation using electroforming process.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 7, p. 4169, doi. 10.1007/s00170-025-15412-2
- By:
- Publication type:
- Article
26
Chip removal mechanism and hole plugging in backdrilling of high-speed printed circuit board.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 5, p. 2919, doi. 10.1007/s00170-025-15321-4
- By:
- Publication type:
- Article
27
Application of Friction Riveting technique for the assembly of electronic components on printed circuit boards (PCB).
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 11/12, p. 5163, doi. 10.1007/s00170-024-14054-0
- By:
- Publication type:
- Article
28
Enhancing efficiency in PCB assembly for the leading global electronics manufacturing services firm: a TRIZ and Ant Colony Optimization approach.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 11/12, p. 5529, doi. 10.1007/s00170-024-14025-5
- By:
- Publication type:
- Article
29
GRAAL—modeling, prototyping and assessing a gamified responsible augmented assembly line system.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 132, n. 5/6, p. 2735, doi. 10.1007/s00170-024-13460-8
- By:
- Publication type:
- Article
30
Machinability of the uncoated and Ta–C-coated single-flute microdrills in dry machining of PCBs.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 131, n. 5/6, p. 2583, doi. 10.1007/s00170-023-12069-7
- By:
- Publication type:
- Article
31
Improved uniformity and anisotropy of through-mask electrochemical micromachining by localized etching and homogeneous flow.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 130, n. 1/2, p. 995, doi. 10.1007/s00170-023-12677-3
- By:
- Publication type:
- Article
32
Drilling force prediction and drill wear monitoring for PCB drilling process based on spindle current signal.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2023, v. 126, n. 7/8, p. 3475, doi. 10.1007/s00170-023-11302-7
- By:
- Publication type:
- Article
33
Study on the mechanism affecting the quality of micro-hole in ultrasonic-assisted drilling of high-speed circuit boards.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2023, v. 124, n. 7/8, p. 2527, doi. 10.1007/s00170-022-10638-w
- By:
- Publication type:
- Article
34
Back-drilling of high-speed printed circuit boards: a review.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 3/4, p. 1483, doi. 10.1007/s00170-022-09476-7
- By:
- Publication type:
- Article
35
A divide and combine method for machine configuration and workload balancing problem in multiple product PCB assembly.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 5/6, p. 4079, doi. 10.1007/s00170-022-08819-8
- By:
- Publication type:
- Article
36
Accurate temperature characterization and experimental verification in the PCB drilling process.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 5/6, p. 3507, doi. 10.1007/s00170-022-08808-x
- By:
- Publication type:
- Article
37
Weak signal enhancement for small drill condition monitoring in PCB drilling process by using adaptive multistable stochastic resonance.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 3/4, p. 2075, doi. 10.1007/s00170-022-08915-9
- By:
- Publication type:
- Article
38
Fabrication of design-optimized multifunctional safety cage with conformal circuits for drone using hybrid 3D printing technology.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 3/4, p. 2573, doi. 10.1007/s00170-022-08831-y
- By:
- Publication type:
- Article
39
A robot learning from demonstration framework for skillful small parts assembly.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 9/10, p. 6775, doi. 10.1007/s00170-022-08652-z
- By:
- Publication type:
- Article
40
Assessing product quality from the production process logs.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2021, v. 117, n. 5/6, p. 1615, doi. 10.1007/s00170-021-07764-2
- By:
- Publication type:
- Article
41
A novel placement method for mini-scale passive components in surface mount technology.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 5/6, p. 1475, doi. 10.1007/s00170-021-07147-7
- By:
- Publication type:
- Article
42
Ultrasonic excitation during press-fit joining of electrical contacts.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 7/8, p. 2215, doi. 10.1007/s00170-020-05760-6
- By:
- Publication type:
- Article
43
Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 3, p. 749, doi. 10.1007/s00170-020-05377-9
- By:
- Publication type:
- Article
44
Micro-drilling characteristics of sequential glass fiber-reinforced resin-based/copper foil multi-layer sheets.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2020, v. 107, n. 1/2, p. 399, doi. 10.1007/s00170-020-05038-x
- By:
- Publication type:
- Article
45
Effect of filling level and fillet profile on pin-through-hole solder joint.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2019, v. 102, n. 5-8, p. 1467, doi. 10.1007/s00170-018-03285-7
- By:
- Publication type:
- Article
46
Materials and micro drilling of high frequency and high speed printed circuit board: a review.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2019, v. 100, n. 1-4, p. 827, doi. 10.1007/s00170-018-2711-5
- By:
- Publication type:
- Article
47
Applying multivariate analysis to analyze and improve component rejection by pick and place machines.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 1-4, p. 1265, doi. 10.1007/s00170-017-1475-7
- By:
- Publication type:
- Article
48
Genetic algorithm optimization in discrete element simulation of electric parts separation from printed circuit board.
- Published in:
- Structural & Multidisciplinary Optimization, 2021, v. 64, n. 4, p. 2763, doi. 10.1007/s00158-021-02982-4
- By:
- Publication type:
- Article
49
MuSAP-GAN: printed circuit board defect detection using multi-level attention-based printed circuit board with generative adversarial network.
- Published in:
- Electrical Engineering, 2025, v. 107, n. 3, p. 3573, doi. 10.1007/s00202-024-02703-2
- By:
- Publication type:
- Article
50
Surface defect prediction on printed circuit boards using a novel deep learning model with spatial and channel attention-based DenseNet.
- Published in:
- Electrical Engineering, 2025, v. 107, n. 1, p. 1299, doi. 10.1007/s00202-024-02737-6
- By:
- Publication type:
- Article