Works matching DE "PRINTED circuits"
Results: 2013
Advanced Recovery Strategies for Metallic and Nonmetallic Fractions from Waste Printed Circuit Boards: A Comprehensive Review.
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- Separation & Purification Reviews, 2025, v. 54, n. 1, p. 37, doi. 10.1080/15422119.2024.2358481
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- Article
Localised aqueous corrosion of electroless nickel immersion gold-coated copper.
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- Corrosion Engineering, Science & Technology, 2022, v. 57, n. 6, p. 520, doi. 10.1080/1478422X.2022.2096322
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- Article
Methods for predicting corrosion on electronic products.
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- Corrosion Engineering, Science & Technology, 2014, v. 49, n. 7, p. 661, doi. 10.1179/1743278214Y.0000000174
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- Article
Intermediate bus architecture: is it for everyone?
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- Power Engineer, 2003, v. 17, n. 5, p. 40, doi. 10.1049/pe:20030512
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- Article
Multifunctional Fiber for Synchronous Bio‐Sensing and Power Supply in Sweat Environment.
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- Advanced Functional Materials, 2023, v. 33, n. 30, p. 1, doi. 10.1002/adfm.202301174
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- Article
Direct Freeform Laser Fabrication of 3D Conformable Electronics.
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- Advanced Functional Materials, 2023, v. 33, n. 1, p. 1, doi. 10.1002/adfm.202210084
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- Article
A Nanoporous Carbon‐MXene Heterostructured Nanocomposite‐Based Epidermal Patch for Real‐Time Biopotentials and Sweat Glucose Monitoring (Adv. Funct. Mater. 49/2022).
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- Advanced Functional Materials, 2022, v. 32, n. 49, p. 1, doi. 10.1002/adfm.202270280
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- Article
Stretchable Batteries: Stand‐Alone Intrinsically Stretchable Electronic Device Platform Powered by Stretchable Rechargeable Battery (Adv. Funct. Mater. 50/2020).
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- Advanced Functional Materials, 2020, v. 30, n. 50, p. 1, doi. 10.1002/adfm.202070328
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- Article
Stand‐Alone Intrinsically Stretchable Electronic Device Platform Powered by Stretchable Rechargeable Battery.
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- Advanced Functional Materials, 2020, v. 30, n. 50, p. 1, doi. 10.1002/adfm.202003608
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- Article
Soft Electronics Manufacturing Using Microcontact Printing.
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- Advanced Functional Materials, 2019, v. 29, n. 51, p. N.PAG, doi. 10.1002/adfm.201906551
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- Article
Mechanical and spectroscopic characterization of functionalized g-C<sub>3</sub>N<sub>4</sub> fillers loaded epoxy reinforced banana natural Fiber composite for PCB applications.
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- Journal of Polymer Research, 2024, v. 31, n. 12, p. 1, doi. 10.1007/s10965-024-04218-7
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- Article
Novel semi-N-methyl substituted bisbenzimidazole based polyimide films with low coefficient of thermal expansion and high T<sub>g</sub>.
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- Journal of Polymer Research, 2021, v. 28, n. 11, p. 1, doi. 10.1007/s10965-021-02757-x
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- Article
An adaptive feature reconstruction network for the precise segmentation of surface defects on printed circuit boards.
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- Journal of Intelligent Manufacturing, 2023, v. 34, n. 7, p. 3197, doi. 10.1007/s10845-022-02008-w
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- Article
Modeling the machine configuration and line-balancing problem of a PCB assembly line with modular placement machines.
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- International Journal of Advanced Manufacturing Technology, 2011, v. 54, n. 1-4, p. 349, doi. 10.1007/s00170-010-2920-z
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- Article
Algorithm of locating PCB components based on colour distribution of solder joints.
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- International Journal of Advanced Manufacturing Technology, 2011, v. 53, n. 5-8, p. 601, doi. 10.1007/s00170-010-2850-9
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- Article
Wavelet transform based image template matching for automatic component inspection.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 9-12, p. 1033, doi. 10.1007/s00170-010-2567-9
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- Article
Solder paste inspection using region-based defect detection.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 7/8, p. 725, doi. 10.1007/s00170-008-1639-6
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- Article
Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 3/4, p. 335, doi. 10.1007/s00170-008-1599-x
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- Article
Analysis of sonic waves generated during laser engraving of printed circuits.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 1/2, p. 138, doi. 10.1007/s00170-008-1581-7
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- Article
Heuristics to minimize makespan of parallel batch processing machines.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 37, n. 9-10, p. 1005, doi. 10.1007/s00170-007-1042-8
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- Article
A particle swarm optimization approach to optimize component placement in printed circuit board assembly.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 610, doi. 10.1007/s00170-006-0777-y
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- Article
Automated inspection of PCB components using a genetic algorithm template-matching approach.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 3/4, p. 293, doi. 10.1007/s00170-006-0730-0
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- Article
Printed circuit board recycling process and its environmental impact assessment.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 9/10, p. 1030, doi. 10.1007/s00170-006-0656-6
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- Article
Experimental studies on cryogenic recycling of printed circuit board.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 7/8, p. 657, doi. 10.1007/s00170-006-0634-z
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- Article
Design and development of a new machine vision wire bonding inspection system.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 3/4, p. 323, doi. 10.1007/s00170-006-0611-6
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- Article
Effectiveness study of an automated 3D laminography x-ray inspection system in a high-volume–low-mix SMT line.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 11/12, p. 1191, doi. 10.1007/s00170-005-0157-z
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- Article
Printed circuit board scheduling in an openshop manufacturing environment.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 980, doi. 10.1007/s00170-005-2584-2
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- Article
A genetic algorithm approach to optimising component placement and retrieval sequence for chip shooter machines.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 28, n. 5/6, p. 556, doi. 10.1007/s00170-004-2390-2
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- Article
Integral DOE and MANOVA techniques for classification feature selection: using solder joint defects as an example.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 3/4, p. 392, doi. 10.1007/s00170-004-2186-4
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- Article
A genetic algorithm to optimise the component placement process in PCB assembly.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 11/12, p. 1397, doi. 10.1007/s00170-004-2132-5
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- Article
Fatigue of SMT solder joint including torsional curvature and chip location optimization.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 7/8, p. 887, doi. 10.1007/s00170-003-2044-9
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- Article
Setup reduction in printed circuit board assembly by efficient sequencing.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 3, p. 276, doi. 10.1007/s00170-003-1634-x
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- Article
Auto-calibration of an SMT machine by machine vision.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 3, p. 243, doi. 10.1007/s00170-003-1765-0
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- Article
Supplier management for manufacturer - a case study of flexible PCB.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 7/8, p. 785, doi. 10.1007/s00170-003-1808-6
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- Article
A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board.
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- International Journal of Advanced Manufacturing Technology, 2004, v. 24, n. 7/8, p. 474, doi. 10.1007/s00170-003-1583-4
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- Article
A DMAIC approach to printed circuit board quality improvement.
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- International Journal of Advanced Manufacturing Technology, 2004, v. 23, n. 7/8, p. 523, doi. 10.1007/s00170-003-1721-z
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- Article
The effect of waveform for pulse plating on copper plating distribution of microvia in PCB manufacture.
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- International Journal of Advanced Manufacturing Technology, 2004, v. 23, n. 3/4, p. 245, doi. 10.1007/s00170-003-1667-1
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- Article
A Novel Approach Using a Two-Dimensional Wavelet Transform in Ball Grid Array (BGA) Substrate Conducting Path Inspections.
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- International Journal of Advanced Manufacturing Technology, 2003, v. 21, n. 3, p. 223
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- Article
Genetic algorithm optimization in discrete element simulation of electric parts separation from printed circuit board.
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- Structural & Multidisciplinary Optimization, 2021, v. 64, n. 4, p. 2763, doi. 10.1007/s00158-021-02982-4
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- Article
Analytical and Experimental Study on Suppression of Electromagnetic Interference on High Speed Printed Circuit Board for Wireless Communication Systems.
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- Wireless Personal Communications, 2017, v. 92, n. 2, p. 333, doi. 10.1007/s11277-016-3546-8
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- Article
Diversity Antenna Design for Wireless Alarm Networks.
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- Wireless Personal Communications, 2014, v. 78, n. 1, p. 729, doi. 10.1007/s11277-014-1780-5
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- Article
Automatic printed circuit board inspection: a comprehensible survey.
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- Discover Artificial Intelligence, 2024, v. 4, n. 1, p. 1, doi. 10.1007/s44163-023-00081-5
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- Article
泊车辅助系统控制器辐射发射测试失效分析.
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- Automotive Digest, 2024, n. 11, p. 53, doi. 10.19822/j.cnki.1671-6329.20240015
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- Article
电涡流位移传感器的仿真分析与验证.
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- Automotive Digest, 2024, n. 11, p. 18, doi. 10.19822/j.cnki.1671-6329.20240013
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- Article
Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs.
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- Inventions (2411-5134), 2023, v. 8, n. 3, p. 77, doi. 10.3390/inventions8030077
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- Article
Radio Frequency Properties of a 3D Printed Klystron Circuit.
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- Instruments (2410-390X), 2024, v. 8, n. 1, p. 9, doi. 10.3390/instruments8010009
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- Article
RECURSION MODELS FOR DESCRIBING AND MANAGING THE TRANSIENT FLOW OF MATERIALS IN GENERALIZED FLOWLINES.
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- Management Science, 1989, v. 35, n. 6, p. 722, doi. 10.1287/mnsc.35.6.722
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- Article
Research on Polyolefin Resin Substrates with Good Processability.
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- Plastics Science & Technology / Suliao Ke-Ji, 2024, v. 52, n. 4, p. 75, doi. 10.15925/j.cnki.issn1005-3360.2024.04.015
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- Article
嗜酸菌好氧-厌氧耦合溶解浸出副产物研究.
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- Environmental Science & Technology (10036504), 2022, v. 45, n. 12, p. 44, doi. 10.19672/j.cnki.1003-6504.1465.22.338
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- Article
Flexible Hybrid Electronics via Near‐Infrared Radiation‐Assisted Soldering of Surface Mount Devices on Screen Printed Circuits.
- Published in:
- Advanced Electronic Materials, 2023, v. 9, n. 4, p. 1, doi. 10.1002/aelm.202201012
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- Article