Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 2

Results: 27

Effects of Strain Rates and Biaxial Stress Conditions on Plastic Yielding and Flow Stress of Solder Alloys.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 372, doi. 10.1007/BF02692459

By:

Liang, J.;
Dariavach, N.;
Barr, G.;
Fang, Z.

Publication type:

Article

Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 366, doi. 10.1007/BF02692458

By:

Chang, C. W.;
Lee, Q. P.;
Ho, C. E.;
Kao, C. R.

Publication type:

Article

Effects of Annealing on the Thermoelectric and Microstructural Properties of Deformed n-Type Bi2Te3-Based Compounds.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 360, doi. 10.1007/BF02692457

By:

Lee, D. M.;
Lim, C. H.;
Cho, D. C.;
Lee, Y. S.;
Lee, C. H.

Publication type:

Article

Study of Wetting Reaction Between Eutectic AuSn and Au Foil.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 353, doi. 10.1007/BF02692456

By:

Lai, Y. T.;
Liu, C. Y.

Publication type:

Article

Phase Distribution and Phase Analysis in Cu6Sn5, Ni3Sn4, and the Sn-Rich Corner in the Ternary Sn-Cu-Ni Isotherm at 240°C.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 343, doi. 10.1007/BF02692455

By:

Chia-Ying Li;
Guo-Jyun Chiou;
Jenq-Gong Duh

Publication type:

Article

Characterization Technique in Phase Distribution during Sample Preparation for Applications to Solder Joints and Wire-Bonding Chips.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 333, doi. 10.1007/BF02692454

By:

Hung-Kai Chen;
Shih-Hai Li;
Jenq-Gong Duh

Publication type:

Article

Solid-State Reaction in an Au Wire Connection with an Al-Cu Pad During Aging.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 323, doi. 10.1007/BF02692453

By:

Guh-Yaw Jang;
Jenq-Gong Duh;
Takahashi, Hideyuki;
Su, David

Publication type:

Article

Influence of Mn Incorporation on MBE Growth of (In,Mn)N.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 319, doi. 10.1007/BF02692452

By:

Gan Feng;
Yoshimoto, Masahiro

Publication type:

Article

Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 310, doi. 10.1007/BF02692451

By:

Tung-Han Chuang;
Shiu-Fang Yen;
Hui-Min Wu

Publication type:

Article

Intermetallic Reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni Surface Finishes.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 302, doi. 10.1007/BF02692450

By:

Chuang, T. H.;
Yen, S. F.;
Cheng, M. D.

Publication type:

Article

Effects of Strain Ratio and Tensile Hold Time on Low-Cycle Fatigue of Lead-Free Sn-3.5Ag-0.5Cu Solder.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 292, doi. 10.1007/BF02692449

By:

Chih-Kuang Lin;
Chun-Ming Huang

Publication type:

Article

Lead Contamination of a Transient Liquid-Phase-Processed Sn-Bi Lead-Free Solder Paste.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 284, doi. 10.1007/BF02692448

By:

Whitney, M.;
Corbin, S. F.

Publication type:

Article

Innovative Wire Bonding Method Using a Chemically Reacted Thin Layer for Chips with Copper Interconnects.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 279, doi. 10.1007/BF02692447

By:

Yeau Ren Jeng;
Sang Mao Chiu

Publication type:

Article

Electroless Nickel/Gold Bump in the Flip-Chip-Type CMOS Package for Mobile-Phone Camera Modules.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 273, doi. 10.1007/BF02692446

By:

Joong-Do Kim

Publication type:

Article

A Comparative Study of Metamorphic InP/InGaAs Double Heterojunction Bipolar Transistors with InP and InAIP Buffer Layers Grown by Molecular Beam Epitaxy.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 266, doi. 10.1007/BF02692445

By:

Yongkun Sin;
Presser, Nathan;
Adams, Paul

Publication type:

Article

Developing an Analytic Methodology to Accurately Predict Probing Depth in Integrated Circuit Structures.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 257, doi. 10.1007/BF02692444

By:

Chen, K. M.;
Chiang, K. N.

Publication type:

Article

Reliability of Lead-Free Interconnections under Consecutive Thermal and Mechanical Loadings.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 250, doi. 10.1007/BF02692443

By:

Mattila, T. T.;
Kivilahti, J. K.

Publication type:

Article

Optimization of Active Region for 1.3-µm GaInAsP Compressive-Strain Multiple-Quantum-Well Ridge Waveguide Laser Diodes.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 243, doi. 10.1007/BF02692442

By:

Po-Hsun Lei;
Chyi-Dar Yang;
Ming-Yuan Wu;
Chih-Wei Hu;
Meng-Chyi Wu;
Yin-Hsun Huang;
Wen-Jeng Ho

Publication type:

Article

A Diameter-Selective Chiral Separation of Single-Wall Carbon Nanotubes Using Nitronium Ions.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 235, doi. 10.1007/BF02692441

By:

Kay Hyeok An;
Chol-Min Yang;
Ji Yeong Lee;
Seong Chu Lim;
Chul Kang;
Joo-Hiuk Son;
Mun Seok Jeong;
Young Hee Lee

Publication type:

Article

Bonding Parameters of Blanket Copper Wafer Bonding.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 230, doi. 10.1007/BF02692440

By:

Chen, K. N.;
Fan, A.;
Tan, C. S.;
Reif, R.

Publication type:

Article

Effect of the Fabrication Method on the Electrical Properties of Poly(acrylonitrile-co-butadiene-co-styrene)/ Carbon Black Composites.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 224, doi. 10.1007/BF02692439

By:

Gupta, Sidhartha;
Ou, Runqing;
Gerhardt, Rosario A.

Publication type:

Article

Synthesis Optimization and Characterization of Multiwalled Carbon Nanotubes.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 211, doi. 10.1007/BF02692438

By:

Deck, Christian P.;
McKee, Gregg S. B.;
Vecchio, Kenneth S.

Publication type:

Article

Molecular Dynamics Study of Bamboo-Like Carbon Nanotube Nucleation.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 207, doi. 10.1007/BF02692437

By:

Feng Ding;
Bolton, Kim;
Rosén, Arne

Publication type:

Article

Indium and Tin Oxide Nanowires by Vapor-Liquid-Solid Growth Technique.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 200, doi. 10.1007/BF02692436

By:

Nguyen, Pho;
Vaddiraju, Sreeram;
Meyyappan, M.

Publication type:

Article

A Rapid Growth of Aligned Carbon Nanotube Films and High-Aspect-Ratio Arrays.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 195, doi. 10.1007/BF02692435

By:

Lingbo Zhu;
Jianwen Xu;
Yonghao Xiu;
Hess, Dennis W.;
Wong, C. P.

Publication type:

Article

Chemical Vapor Deposition Synthesis of Self-Aligned Carbon Nanotube Arrays.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 192, doi. 10.1007/BF02692434

By:

Turano, Stephan P.;
Ready, Jud

Publication type:

Article

Foreword.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 2, p. 191, doi. 10.1007/BF02692433

By:

Ready, W. Jud;
Rao, Apparao M.

Publication type:

Article

Works matching IS 03615235 AND DT 2006 AND VI 35 AND IP 2

Effects of Strain Rates and Biaxial Stress Conditions on Plastic Yielding and Flow Stress of Solder Alloys.

Cross-Interaction Between Au and Cu in Au/Sn/Cu Ternary Diffusion Couples.

Effects of Annealing on the Thermoelectric and Microstructural Properties of Deformed n-Type Bi<sub>2</sub>Te<sub>3</sub>-Based Compounds.

Study of Wetting Reaction Between Eutectic AuSn and Au Foil.

Phase Distribution and Phase Analysis in Cu<sub>6</sub>Sn<sub>5</sub>, Ni<sub>3</sub>Sn<sub>4</sub>, and the Sn-Rich Corner in the Ternary Sn-Cu-Ni Isotherm at 240°C.

Characterization Technique in Phase Distribution during Sample Preparation for Applications to Solder Joints and Wire-Bonding Chips.

Solid-State Reaction in an Au Wire Connection with an Al-Cu Pad During Aging.

Influence of Mn Incorporation on MBE Growth of (In,Mn)N.

Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish.

Intermetallic Reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni Surface Finishes.

Effects of Strain Ratio and Tensile Hold Time on Low-Cycle Fatigue of Lead-Free Sn-3.5Ag-0.5Cu Solder.

Lead Contamination of a Transient Liquid-Phase-Processed Sn-Bi Lead-Free Solder Paste.

Innovative Wire Bonding Method Using a Chemically Reacted Thin Layer for Chips with Copper Interconnects.

Electroless Nickel/Gold Bump in the Flip-Chip-Type CMOS Package for Mobile-Phone Camera Modules.

A Comparative Study of Metamorphic InP/InGaAs Double Heterojunction Bipolar Transistors with InP and InAIP Buffer Layers Grown by Molecular Beam Epitaxy.

Developing an Analytic Methodology to Accurately Predict Probing Depth in Integrated Circuit Structures.

Reliability of Lead-Free Interconnections under Consecutive Thermal and Mechanical Loadings.

Optimization of Active Region for 1.3-µm GaInAsP Compressive-Strain Multiple-Quantum-Well Ridge Waveguide Laser Diodes.

A Diameter-Selective Chiral Separation of Single-Wall Carbon Nanotubes Using Nitronium Ions.

Bonding Parameters of Blanket Copper Wafer Bonding.

Effect of the Fabrication Method on the Electrical Properties of Poly(acrylonitrile-co-butadiene-co-styrene)/ Carbon Black Composites.

Synthesis Optimization and Characterization of Multiwalled Carbon Nanotubes.

Molecular Dynamics Study of Bamboo-Like Carbon Nanotube Nucleation.

Indium and Tin Oxide Nanowires by Vapor-Liquid-Solid Growth Technique.

A Rapid Growth of Aligned Carbon Nanotube Films and High-Aspect-Ratio Arrays.

Chemical Vapor Deposition Synthesis of Self-Aligned Carbon Nanotube Arrays.

Foreword.