Works matching Integrated Circuits

Results: 5000

Fully integrated CMOS overvoltage protection circuit for automotive applications.

Published in:

Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 16, p. 1316, doi. 10.1049/el.2015.1813

By:

Boni, A.;
Tonelli, M.;
Magnanini, A.;
Caselli, M.

Publication type:

Article

Microwave Flexible Electronics Directly Transformed from Foundry‐Produced, Multilayered Monolithic Integrated Circuits.

Published in:

Advanced Electronic Materials, 2022, v. 8, n. 7, p. 1, doi. 10.1002/aelm.202101350

By:

Qin, Guoxuan;
Jung, Yei Hwan;
Zhang, Huilong;
Jiang, Ningyue;
Ma, Pingxi;
Stetson, Scott;
Racanelli, Marco;
Ma, Zhenqiang

Publication type:

Article

Low-Power Current Integrating Flat-Passband Infinite Impulse Response Filter for Sensor Read-Out Integrated Circuit in 65-nm CMOS Technology.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 5, p. 1191, doi. 10.3390/electronics12051191

By:

Jo, Sung-Hun

Publication type:

Article

集成电路发展与光电融合探讨.

Published in:

Study on Optical Communications / Guangtongxin Yanjiu, 2025, n. 2, p. 240056-01, doi. 10.13756/j.gtxyj.2025.240056

By:

张新全;
肖希

Publication type:

Article

集成电路废水的达标排放、资源回收和再生处理.

Published in:

Industrial Water Treatment, 2024, v. 44, n. 4, p. 1, doi. 10.19965/j.cnki.iwt.2023-0423

By:

肖卓远;
黄南;
巫寅虎;
张倬玮;
徐雨晴;
吴乾元;
王文龙;
熊江磊;
罗嘉豪;
廖翔;
胡洪营

Publication type:

Article

集成电路用电子特气合成与纯化技术研究进展.

Published in:

Chemical Engineering (China) / Huaxue Gongcheng, 2024, v. 52, n. 5, p. 46, doi. 10.3969/j.issn.1005-9954.2024.05.008

By:

孟祥军;
花莹曦;
冯昭宇;
郑凯天;
尚青;
姚冰洁;
李茹霞;
李绍波;
许春建

Publication type:

Article

集成电路电磁兼容性分析方法及展望.

Published in:

Safety & EMC (1005-9776), 2024, n. 6, p. 9

By:

阎照文

Publication type:

Article

Discussion on Improving Safety of Station Tracks Equipped with Integrated Track Circuits of High-speed Railways.

Published in:

Railway Signalling & Communication Engineering, 2024, v. 21, n. 6, p. 13, doi. 10.3969/j.issn.1673-4440.2024.06.003

By:

Li Jin

Publication type:

Article

站内ZPW-2000A一体化轨道电路低道床适应性研究.

Published in:

Railway Signalling & Communication Engineering, 2022, v. 19, n. 11, p. 1, doi. 10.3969/j.issn.1673-4440.2022.11.001

By:

邵嘉声

Publication type:

Article

站内一体化轨道电路股道防邻线干扰分析及解决方案.

Published in:

Railway Signalling & Communication Engineering, 2021, v. 18, n. 11, p. 61, doi. 10.3969/j.issn.1673-4440.2021.11.013

By:

李强;
何健

Publication type:

Article

基于PMU的小型集成电路测试系统实现及性能分析.

Published in:

Computer Measurement & Control, 2018, v. 26, n. 4, p. 52, doi. 10.16526/j.cnki.11-4762/tp.2018.04.014

By:

祝新军;
纪效礼;
何少佳

Publication type:

Article

3D-MMA: 基于3D集成电路的矩阵乘加速结构.

Published in:

Computer Engineering & Science / Jisuanji Gongcheng yu Kexue, 2019, v. 41, n. 12, p. 2110, doi. 10.3969/j.issn.1007-130X.2019.12.003

By:

王吉军;
郝子宇;
李宏亮

Publication type:

Article

集成电路协同仿真的数据管理与应用.

Published in:

Journal of Mechanical & Electrical Engineering, 2017, v. 34, n. 9, p. 1081, doi. 10.3969/j.issn.1001-4551.2017.09.025

By:

陈佳;
余昭杰;
毕锦栋

Publication type:

Article

Using Variations in the Frequency of a Ring Oscillator to Measure the Thermal Resistance of Digital Integrated Circuits.

Published in:

Measurement Techniques, 2018, v. 61, n. 2, p. 154, doi. 10.1007/s11018-018-1402-9

By:

Teten'kin, Ya. G.;
Sergeev, V. A.

Publication type:

Article

Production Process Control Subsystem for Manufacture of Integrated Circuits.

Published in:

Measurement Techniques, 2017, v. 60, n. 6, p. 529, doi. 10.1007/s11018-017-1227-y

By:

Lvovich, I.;
Lvovich, Ya.;
Preobrazhenskiy, A.;
Choporov, O.;
Saleev, D.

Publication type:

Article

Radio frequency reliability studies of CMOS RF integrated circuits for ultra‐thin flexible packages.

Published in:

Electronics Letters (Wiley-Blackwell), 2020, v. 56, n. 5, p. 280, doi. 10.1049/el.2019.3420

By:

Mitra, D.;
Hamidi, S.B.;
Roy, P.;
Biswas, C.;
Biswas, A.;
Dawn, D.

Publication type:

Article

Fractal series stacked inductor for radio frequency integrated circuit applications.

Published in:

Electronics Letters (Wiley-Blackwell), 2017, v. 53, n. 19, p. 1387, doi. 10.1049/el.2017.2623

By:

Akhendra Kumar, P.;
Bheema Rao, N.

Publication type:

Article

Highly reliable automotive integrated protection circuit for human body model ESD of +6 kV, over voltage, and reverse voltage.

Published in:

Electronics Letters (Wiley-Blackwell), 2017, v. 53, n. 12, p. 843, doi. 10.1049/el.2017.0780

By:

Cho, S.;
Lee, D.;
Ali, I.;
Kim, S.;
Pu, Y.;
Yoo, S.;
Lee, K.

Publication type:

Article

Miniaturised X‐band balanced microwave limiter based on thin film hybrid integrated circuit technology.

Published in:

Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 14, p. 1318, doi. 10.1049/el.2016.1301

By:

Ai, Jing;
Zhang, Yong Hong;
Xu, Kai Da;
Yang, Yang;
Tian, Yin;
Joines, William Thomas

Publication type:

Article

Distance‐based large margin classifier suitable for integrated circuit implementation.

Published in:

Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 24, p. 1967, doi. 10.1049/el.2015.1644

By:

Torres, L.C.B.;
Castro, C.L.;
Coelho, F.;
Sill Torres, F.;
Braga, A.P.

Publication type:

Article

Fast and effective method of CMRR enhancement for multichannel integrated circuits dedicated to biomedical measurements.

Published in:

Electronics Letters (Wiley-Blackwell), 2015, v. 51, n. 20, p. 1736, doi. 10.1049/el.2015.1933

By:

Kmon, P.;
Grybos, P.;
Zoladz, M.;
Lisicka, A.

Publication type:

Article

混合集成薄膜电阻的误差来源分析及修正方法.

Published in:

Electronic Components & Materials, 2017, v. 36, n. 11, p. 43, doi. 10.14106/j.cnki.1001-2028.2017.11.008

By:

王春富;
秦跃利

Publication type:

Article

集成电路二划分的一维泊松方程方法.

Published in:

Journal of Fuzhou University, 2023, v. 51, n. 6, p. 749, doi. 10.7631/issn.1000-2243.22183

By:

余永昕;
潘萍梅;
朱文兴

Publication type:

Article

Graphene‐Based Lateral Heterojunctions for 2D Integrated Circuits.

Published in:

Advanced Electronic Materials, 2024, v. 10, n. 5, p. 1, doi. 10.1002/aelm.202300761

By:

Haidari, Mohd.Musaib;
Jang, Dong Jin;
Yoon, Duhee;
Kim, Hakseong;
Choi, Hong Kyw;
Yi, Yoonsik;
Kim, Jin Hong;
Ko, Jin‐Yong;
Lee, Dooho;
Kee, Eun Hee;
Jeong, Hu Young;
Park, Jeong Young;
Park, Bae Ho;
Choi, Jin Sik

Publication type:

Article

Bottom‐Up Growth of n‐Type Polymer Monolayers for High‐Performance Complementary Integrated Circuits.

Published in:

Advanced Electronic Materials, 2023, v. 9, n. 5, p. 1, doi. 10.1002/aelm.202201307

By:

Guo, Yifu;
Yang, Mingqun;
Deng, Junyang;
Ding, Chenming;
Duan, Chunhui;
Li, Mengmeng;
Li, Ling;
Liu, Ming

Publication type:

Article

Radiation-Hardened Design and Experimental Validation Using a Mixed-Stage Model for Reliability Assessment of Integrated Circuits in Radiation Environments.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 7, p. 1296, doi. 10.3390/electronics14071296

By:

Lee, Minwoong;
Lee, Namho;
Ki, Donghan;
Cho, Seongik

Publication type:

Article

A Gain-Enhanced Low Hardware Complexity Charge-Domain Read-Out Integrated Circuit Using a Sampled Charge Redistribution Technique.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 23, p. 3846, doi. 10.3390/electronics11233846

By:

Jo, Sung-Hun

Publication type:

Article

Design of Three-Dimensional Virtual Simulation Experiment Platform for Integrated Circuit Course.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 9, p. N.PAG, doi. 10.3390/electronics11091437

By:

Lai, Ziliang;
Cui, Yansong;
Zhao, Tonggang;
Wu, Qiang

Publication type:

Article

Review of Polynomial Chaos-Based Methods for Uncertainty Quantification in Modern Integrated Circuits.

Published in:

Electronics (2079-9292), 2018, v. 7, n. 3, p. 30, doi. 10.3390/electronics7030030

By:

Kaintura, Arun;
Dhaene, Tom;
Spina, Domenico

Publication type:

Article

Variational Learning of Integrated Quantum Photonic Circuits via Genetic Algorithm.

Published in:

Laser & Photonics Reviews, 2025, v. 19, n. 7, p. 1, doi. 10.1002/lpor.202400359

By:

Zhang, Hui;
Yang, Chengran;
Mok, Wai‐Keong;
Wan, Lingxiao;
Cai, Hong;
Li, Qiang;
Gao, Feng;
Luo, Xianshu;
Lo, Guo‐Qiang;
Chin, Lip Ket;
Shi, Yuzhi;
Thompson, Jayne;
Gu, Mile;
Liu, Ai Qun

Publication type:

Article

Widely Tunable (2.47–2.64 µm) Hybrid Laser Based on GaSb/GaInAsSb Quantum‐Wells and a Low‐Loss Si<sub>3</sub>N<sub>4</sub> Photonic Integrated Circuit.

Published in:

Laser & Photonics Reviews, 2023, v. 17, n. 7, p. 1, doi. 10.1002/lpor.202201028

By:

Ojanen, Samu‐Pekka;
Viheriälä, Jukka;
Zia, Nouman;
Koivusalo, Eero;
Hilska, Joonas;
Tuorila, Heidi;
Guina, Mircea

Publication type:

Article

320×256 Readout Integrated Circuit for Infrared Focal Plane Arrays with Low-temperature MOSFET Model.

Published in:

IETE Journal of Research, 2011, v. 57, n. 6, p. 550, doi. 10.4103/0377-2063.92271

By:

Weifeng Sun;
Liang Xie;
Kan Jia;
Yangfan Zhou;
Qingsong Qian;
Longxing Shi

Publication type:

Article

Curvilinear effect of policy intensity on innovation performance in the integrated circuit industry: Too much of a good thing?

Published in:

Economic Analysis & Policy, 2024, v. 82, p. 1337, doi. 10.1016/j.eap.2024.05.009

By:

Wang, Tianchi;
Sun, Ting;
Chen, Qiuling

Publication type:

Article

A COMPARISON OF DETERMINISTIC AND STATISTICAL SAMPLING TECHNIQUES FOR QUALITY ANALYSIS OF INTEGRATED CIRCUITS.

Published in:

Quality & Reliability Engineering International, 1993, v. 9, n. 6, p. 489, doi. 10.1002/qre.4680090606

By:

Ilumoka, A. A.

Publication type:

Article

A COMPUTER-CONTROLLED ENVIRONMENTAL TEST SYSTEM FOR HIGH PIN-COUNT INTEGRATED CIRCUIT PACKAGES.

Published in:

Quality & Reliability Engineering International, 1993, v. 9, n. 2, p. 95, doi. 10.1002/qre.4680090206

By:

Barrett, John;
Donavan, John Ó.;
Hayes, Thomas;
Mathúna, Seán C. Ó.

Publication type:

Article

A new source formulation for FDTD simulation of high-frequency integrated circuits with and without ground planes.

Published in:

Microwave & Optical Technology Letters, 1997, v. 14, n. 6, p. 321, doi. 10.1002/(SICI)1098-2760(19970420)14:6<321::AID-MOP4>3.0.CO;2-K

By:

Wang, Xudong;
Hwu, R. Jennifer

Publication type:

Article

Temperature gradient‐aware thermal simulator for three‐dimensional integrated circuits.

Published in:

IET Computers & Digital Techniques (Wiley-Blackwell), 2017, v. 11, n. 5, p. 190, doi. 10.1049/iet-cdt.2016.0149

By:

Lu, Liang‐Ying;
Chiou, Lih‐Yih

Publication type:

Article

Optimisation of test architecture in three‐dimensional stacked integrated circuits for partial stack/complete stack using hard system‐on‐chips.

Published in:

IET Computers & Digital Techniques (Wiley-Blackwell), 2015, v. 9, n. 5, p. 268, doi. 10.1049/iet-cdt.2014.0137

By:

Roy, Surajit Kumar;
Giri, Chandan;
Rahaman, Hafizur

Publication type:

Article

Survey of hardware protection of design data for integrated circuits and intellectual properties.

Published in:

IET Computers & Digital Techniques (Wiley-Blackwell), 2014, v. 8, n. 6, p. 274, doi. 10.1049/iet-cdt.2014.0028

By:

Colombier, Brice;
Bossuet, Lilian

Publication type:

Article

Power bumps and through‐silicon‐vias placement with optimised power mesh structure for power delivery network in three‐dimensional‐integrated circuits.

Published in:

IET Computers & Digital Techniques (Wiley-Blackwell), 2013, v. 7, n. 1, p. 11, doi. 10.1049/iet-cdt.2012.0047

By:

Jang, Cheoljon;
Kim, Jaehwan;
Ahn, Byunggyu;
Chong, Jongwha

Publication type:

Article

集成电路设计与集成系统 S-CDIO 实践教学体系构建.

Published in:

Research & Exploration in Laboratory, 2016, v. 35, n. 2, p. 179

By:

刘有耀;
杜慧敏;
张丽果

Publication type:

Article

Fabrication of Low Cost and Low Temperature Poly-Silicon Nanowire Sensor Arrays for Monolithic Three-Dimensional Integrated Circuits Applications.

Published in:

Nanomaterials (2079-4991), 2020, v. 10, n. 12, p. 2488, doi. 10.3390/nano10122488

By:

Tang, Siqi;
Yan, Jiang;
Zhang, Jing;
Wei, Shuhua;
Zhang, Qingzhu;
Li, Junjie;
Fang, Min;
Zhang, Shuang;
Xiong, Enyi;
Wang, Yanrong;
Yang, Jianglan;
Zhang, Zhaohao;
Wei, Qianhui;
Yin, Huaxiang;
Wang, Wenwu;
Tu, Hailing

Publication type:

Article

High-efficiency broadband light coupling between optical fibers and photonic integrated circuits.

Published in:

Nanophotonics (21928606), 2018, v. 7, n. 12, p. 1845, doi. 10.1515/nanoph-2018-0075

By:

Son, Gyeongho;
Han, Seungjun;
Park, Jongwoo;
Kwon, Kyungmok;
Yu, Kyoungsik

Publication type:

Article

Highly integrated optical phased arrays: photonic integrated circuits for optical beam shaping and beam steering.

Published in:

Nanophotonics (21928606), 2017, v. 6, n. 1, p. 93, doi. 10.1515/nanoph-2015-0152

By:

Heck, Martijn J.R.

Publication type:

Article

Silicon photonic devices and integrated circuits.

Published in:

Nanophotonics (21928606), 2014, v. 3, n. 4/5, p. 215, doi. 10.1515/nanoph-2013-0023

By:

Dong, Po;
Chen, Young-Kai;
Duan, Guang-Hua;
Neilson, David T.

Publication type:

Article

Development of Integrated Circuits Using Artificial Conducting Liquid (Synthetic Plasma) - A Novel Research.

Published in:

American Journal of Biomedical Sciences, 2018, v. 10, n. 2, p. 65, doi. 10.5099/aj180200065

By:

Pandya, Killol

Publication type:

Article

A Fully Integrated Memristive Chaotic Circuit Based on Memristor Emulator with Voltage-Controlled Oscillator.

Published in:

Micromachines, 2025, v. 16, n. 3, p. 246, doi. 10.3390/mi16030246

By:

Duan, Zhikui;
Chen, Jiahui;
He, Shaobo;
Yu, Xinmei;
Wang, Qiang;
Zhang, Xin;
Xiong, Peng

Publication type:

Article

Progress on a Carbon Nanotube Field-Effect Transistor Integrated Circuit: State of the Art, Challenges, and Evolution.

Published in:

Micromachines, 2024, v. 15, n. 7, p. 817, doi. 10.3390/mi15070817

By:

Chen, Zhifeng;
Chen, Jiming;
Liao, Wenli;
Zhao, Yuan;
Jiang, Jianhua;
Chen, Chengying

Publication type:

Article

A Fast Simulation Method for Evaluating the Single-Event Effect in Aerospace Integrated Circuits.

Published in:

Micromachines, 2023, v. 14, n. 10, p. 1887, doi. 10.3390/mi14101887

By:

Zhang, Xiaorui;
Liu, Yi;
Xu, Changqing;
Liao, Xinfang;
Chen, Dongdong;
Yang, Yintang

Publication type:

Article

Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects.

Published in:

Micromachines, 2022, v. 13, n. 6, p. 883, doi. 10.3390/mi13060883

By:

Zhao, Wen-Sheng;
Zhang, Rui;
Wang, Da-Wei

Publication type:

Article