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Mineral Interface Doping: Hydroxyapatite Deposited on Silicon to Trigger the Electronic Properties.
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- Advanced Materials Interfaces, 2024, v. 11, n. 31, p. 1, doi. 10.1002/admi.202400061
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- Article
Detection and Prediction of Probe Mark Damage in Wafer Testing.
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- Electronics (2079-9292), 2024, v. 13, n. 20, p. 4075, doi. 10.3390/electronics13204075
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- Article
Editor's letter.
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- 2006
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- Publication type:
- Editorial
Water cooling goes down the die.
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- Electronics Systems & Software, 2005, v. 3, n. 3, p. 10
- Publication type:
- Article
Direct Nanomachining on Semiconductor Wafer By Scanning Electrochemical Microscopy.
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- Angewandte Chemie, 2020, v. 132, n. 47, p. 21315, doi. 10.1002/ange.202008697
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- Article
Reactive diffusion in W-Mo-Si thin films.
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- Journal of Thermal Analysis & Calorimetry, 2011, v. 103, n. 1, p. 111, doi. 10.1007/s10973-010-1136-7
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- Article
Wafer yield prediction using derived spatial variables.
- Published in:
- Quality & Reliability Engineering International, 2017, v. 33, n. 8, p. 2327, doi. 10.1002/qre.2192
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- Article
The Negative Binomial Exponentially Weighted Moving Average Chart with Estimated Control Limits.
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- Quality & Reliability Engineering International, 2015, v. 31, n. 2, p. 239, doi. 10.1002/qre.1574
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- Article
A Spatial-EWMA Framework for Detecting Clustering.
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- Quality & Reliability Engineering International, 2014, v. 30, n. 2, p. 181, doi. 10.1002/qre.1484
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- Publication type:
- Article
Run-to-run process control of a plasma etch process with neural network modelling.
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- Quality & Reliability Engineering International, 1998, v. 14, n. 4, p. 247, doi. 10.1002/(SICI)1099-1638(199807/08)14:4<247::AID-QRE188>3.0.CO;2-V
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- Article
Matching implant doses using design of experiments.
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- Quality & Reliability Engineering International, 1998, v. 14, n. 4, p. 211, doi. 10.1002/(SICI)1099-1638(199807/08)14:4<211::AID-QRE191>3.0.CO;2-Z
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- Publication type:
- Article
Run-to-run control charts with contrasts.
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- Quality & Reliability Engineering International, 1998, v. 14, n. 4, p. 261, doi. 10.1002/(SICI)1099-1638(199807/08)14:4<261::AID-QRE192>3.0.CO;2-R
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- Publication type:
- Article
A case study on process monitoring for surface features.
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- Quality & Reliability Engineering International, 1998, v. 14, n. 4, p. 219, doi. 10.1002/(SICI)1099-1638(199807/08)14:4<219::AID-QRE193>3.0.CO;2-5
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- Publication type:
- Article
NIST and Prometrix Collaborating to Reduce Contamination During Wafer Testing.
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- Quality & Reliability Engineering International, 1993, v. 9, n. 4, p. 387
- Publication type:
- Article
Techniques for On-wafer Reliability Testing for MMICs.
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- Quality & Reliability Engineering International, 1993, v. 9, n. 5, p. 460
- Publication type:
- Article
An improved optically controlled phase shifter on Si wafer.
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- Microwave & Optical Technology Letters, 2005, v. 44, n. 6, p. 540, doi. 10.1002/mop.20690
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- Publication type:
- Article
Design and fabrication of slant-counter electrodes for optical switches.
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- Microwave & Optical Technology Letters, 2004, v. 41, n. 4, p. 273, doi. 10.1002/mop.20115
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- Publication type:
- Article
Temperature-tunable silicon-wafer etalon for frequency chirp measurements.
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- Microwave & Optical Technology Letters, 1999, v. 20, n. 3, p. 190, doi. 10.1002/(SICI)1098-2760(19990205)20:3<190::AID-MOP13>3.0.CO;2-N
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- Publication type:
- Article
Intrinsically matched high-resistivity silicon slot-loop antenna.
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- Microwave & Optical Technology Letters, 1999, v. 20, n. 1, p. 26, doi. 10.1002/(SICI)1098-2760(19990105)20:1<26::AID-MOP6>3.0.CO;2-C
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- Publication type:
- Article
AN OPTICALLY CONTROLLED DIELECTRIC RESONATOR.
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- Microwave & Optical Technology Letters, 1995, v. 10, n. 4, p. 247, doi. 10.1002/mop.4650100416
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- Publication type:
- Article
Bayesian spatial defect pattern recognition in semiconductor fabrication using support vector clustering.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 51, n. 5-8, p. 671, doi. 10.1007/s00170-010-2647-x
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- Publication type:
- Article
A bi-criteria nonlinear fluctuation smoothing rule incorporating the SOM–FBPN remaining cycle time estimator for scheduling a wafer fab—a simulation study.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 49, n. 5-8, p. 709, doi. 10.1007/s00170-009-2424-x
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- Publication type:
- Article
Experimental verification of super-resolution optical inspection for semiconductor defect by using standing wave illumination shift.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 46, n. 9-12, p. 863, doi. 10.1007/s00170-008-1901-y
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- Article
Advances in measurement technology and intelligent instruments for manufacturing engineering.
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- 2010
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- Publication type:
- Editorial
Constrained scheduling of the inspection activities on semiconductor wafers grouped in families with sequence-dependent set-up times.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 46, n. 5-8, p. 695, doi. 10.1007/s00170-009-2112-x
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- Publication type:
- Article
ACO-based multi-objective scheduling of parallel batch processing machines with advanced process control constraints.
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- International Journal of Advanced Manufacturing Technology, 2010, v. 44, n. 9/10, p. 985, doi. 10.1007/s00170-008-1904-8
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- Article
Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of selected process parameters.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 11/12, p. 1118, doi. 10.1007/s00170-008-1672-5
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- Article
Simulation-based optimization of dispatching rules for semiconductor wafer fabrication system scheduling by the response surface methodology.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 41, n. 1/2, p. 110, doi. 10.1007/s00170-008-1462-0
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- Publication type:
- Article
A SOM-FBPN-ensemble approach with error feedback to adjust classification for wafer-lot completion time prediction.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 37, n. 7/8, p. 782, doi. 10.1007/s00170-007-1007-y
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- Article
A hybrid neural network and selective allowance approach for internal due date assignment in a wafer fabrication plant.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 36, n. 5/6, p. 570, doi. 10.1007/s00170-006-0869-8
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- Article
Studies of chipping mechanisms for dicing silicon wafers.
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- International Journal of Advanced Manufacturing Technology, 2008, v. 35, n. 11/12, p. 1206, doi. 10.1007/s00170-006-0800-3
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- Article
Optimal replenishment policies for deteriorating control wafers inventory.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 7/8, p. 736, doi. 10.1007/s00170-006-0750-9
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- Article
Design of due-date oriented look-ahead batching rule in wafer fabrication.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 596, doi. 10.1007/s00170-006-0723-z
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- Publication type:
- Article
A hybrid look-ahead SOM-FBPN and FIR system for wafer-lot-output time prediction and achievability evaluation.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 35, n. 5/6, p. 575, doi. 10.1007/s00170-006-0741-x
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- Article
A simulated model for cycle time reduction by acquiring optimal lot size in semiconductor manufacturing.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 34, n. 9/10, p. 1008, doi. 10.1007/s00170-006-0884-9
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- Article
Machining characteristics on the ultra-precision dicing of silicon wafer.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 33, n. 7/8, p. 662, doi. 10.1007/s00170-006-0499-1
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- Article
A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 32, n. 7/8, p. 631, doi. 10.1007/s00170-005-0364-7
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- Article
Micro channel forming with ultra thin metallic foil by cold isostatic pressing.
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- International Journal of Advanced Manufacturing Technology, 2007, v. 32, n. 3/4, p. 265, doi. 10.1007/s00170-005-0321-5
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- Article
The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 7/8, p. 655, doi. 10.1007/s00170-005-0245-0
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- Article
PET-laminated thin-film capillary electrophoresis chips by sandwiching method.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 30, n. 1/2, p. 87, doi. 10.1007/s00170-005-0044-7
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- Publication type:
- Article
Differentiated preemptive dispatching for automatic materials handling services in 300 mm semiconductor foundry.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 9-10, p. 890, doi. 10.1007/s00170-005-2610-4
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- Article
Surface integrity of silicon wafers in ultra precision machining.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 29, n. 3/4, p. 372, doi. 10.1007/s00170-005-2508-1
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- Article
Yield improvement planning for the recycle processes of test wafers.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 11/12, p. 1228, doi. 10.1007/s00170-004-2316-z
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- Article
Relative control philosophy – balance and continual change for forecasting abnormal quality characteristics in a silicon wafer slicing process.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 9/10, p. 1109, doi. 10.1007/s00170-004-2067-x
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- Article
A service level model for the control wafers safety inventory problem.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 5/6, p. 591, doi. 10.1007/s00170-003-2028-9
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- Article
Downgrade decision for control/dummy wafers in a fab.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 26, n. 5/6, p. 585, doi. 10.1007/s00170-003-2031-1
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- Article
Fabricating a micromould insert using a novel process.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 7/8, p. 678, doi. 10.1007/s00170-003-1889-2
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- Article
A linear programming model for the control wafers downgrading problem.
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- International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 3/4, p. 377, doi. 10.1007/s00170-003-1854-0
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- Article
A daily production model for wafer fabrication.
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- International Journal of Advanced Manufacturing Technology, 2004, v. 23, n. 1/2, p. 58, doi. 10.1007/s00170-002-1506-9
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- Publication type:
- Article
A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2003, v. 22, n. 5/6, p. 401, doi. 10.1007/s00170-003-1544-y
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- Publication type:
- Article