Works matching DE "ION implantation"
1
- Solid State Technology, 2001, v. 44, n. 9, p. 77
- Article
2
- Solid State Technology, 2001, v. 44, n. 6, p. 83
- Okumura, Katsuya;
- Mikata, Yu-ichi;
- Suguro, Kyoichi;
- Tsunashima, Yoshitaka;
- Shimazaki, Ayako
- Article
3
- Solid State Technology, 2001, v. 44, n. 6, p. 77
- Article
4
- Solid State Technology, 2001, v. 44, n. 6, p. 42
- Article
5
- Solid State Technology, 2001, v. 44, n. 1, p. 69
- Article
6
- Solid State Technology, 2000, v. 43, n. 11, p. 103
- Parrill, Thomas M.;
- Ameen, Michael S.;
- Graf, Michael;
- Mazzola, Richard
- Article
7
- Solid State Technology, 2000, v. 43, n. 9, p. 81
- Article
8
- Solid State Technology, 2000, v. 43, n. 8, p. 135
- Article
9
- Solid State Technology, 2000, v. 43, n. 6, p. 50
- Demmin, Jeff;
- Haavind, Bob
- Article
10
- Solid State Technology, 2000, v. 43, n. 4, p. 63
- Fleming, David A.;
- Mullis, Celeste
- Article
11
- Solid State Technology, 2000, v. 43, n. 2, p. 51
- Article
12
- Solid State Technology, 1998, v. 41, n. 12, p. 43
- Foad, Majeed A.;
- Jennings, Dean
- Article
13
- Solid State Technology, 1998, v. 41, n. 10, p. 113
- Arno, Josep;
- Hayes, Michael
- Article
14
- Solid State Technology, 1998, v. 41, n. 7, p. 38
- Article
15
- Solid State Technology, 1998, v. 41, n. 2, p. 97
- Giles, Martin D.;
- Shaofeng Yu;
- Kennel, Harold W.;
- Packan, Paul A.
- Article
16
- Solid State Technology, 1997, v. 40, n. 12, p. 71
- Downey, Daniel F.;
- Osburn, Carlton M.
- Article
17
- Surface Engineering, 2025, v. 41, n. 2, p. 259, doi. 10.1177/02670844241310431
- Cvrček, Ladislav;
- Nehasil, Václav;
- Buřil, Matěj
- Article
18
- Surface Engineering, 2022, v. 38, n. 1, p. 79, doi. 10.1080/02670844.2022.2045786
- Liao, Bin;
- Chen, Lin;
- Luo, Jun;
- Pang, Pan;
- Wang, Guoliang
- Article
19
- Surface Engineering, 2015, v. 31, n. 12, p. 934, doi. 10.1179/1743294414Y.0000000452
- Wang, S.;
- Wang, F.;
- Liao, Z.;
- Wang, Q.;
- Tyagi, R.;
- Liu, W.
- Article
20
- Surface Engineering, 2014, v. 30, n. 11, p. 842, doi. 10.1179/1743294414Y.0000000329
- Feng, X. G.;
- Ma, X. X.;
- Tang, G. Z.;
- Zhou, H.
- Article
21
- Surface Engineering, 2012, v. 28, n. 2, p. 149, doi. 10.1179/1743294411Y.0000000071
- Shum, P W;
- Xu, Y F;
- Zhou, Z F;
- Li, K Y
- Article
22
- Surface Engineering, 2010, v. 26, n. 4, p. 277, doi. 10.1179/026708410X12671039164606
- Lei, M. K.;
- Zhou, Q.;
- Ou, Y. X.;
- Song, T. K.;
- Guo, Y.
- Article
23
- Surface Engineering, 2008, v. 24, n. 3, p. 176, doi. 10.1179/174329408X281803
- Article
24
- Surface Engineering, 2008, v. 24, n. 1, p. 4, doi. 10.1179/174329407X265875
- Rao, K. Ram Mohan;
- Mukherjee, S.;
- Roy, S. K.;
- Manna, I.
- Article
25
- Surface Engineering, 2007, v. 23, n. 4, p. 257, doi. 10.1179/174329407X215177
- Saklakoğlu, N.;
- Saklakoğlu, I. E.;
- Ceyhun, V.;
- Ağaçhan, N.;
- Short, K. T.;
- Collins, G. A.
- Article
26
- Surface Engineering, 2003, v. 19, n. 5, p. 369, doi. 10.1179/026708403225007554
- Wang, J.;
- Liu, X.;
- Wang, X.;
- Chen, Y.
- Article
27
- Surface Engineering, 2003, v. 19, n. 5, p. 395, doi. 10.1179/026708403322703076
- Article
28
- Macromolecular Symposia, 2021, v. 399, n. 1, p. 1, doi. 10.1002/masy.202100079
- Yadav, Jyoti;
- M. Divakaran, Anoop;
- Yadav, Nisha;
- Singh, Rini;
- Rao, N. Srinivasa;
- Singh, Fouran;
- Ichikawa, Takayuki;
- Jain, Ankur;
- Awasthi, Kamlendra;
- Kumar, Manoj
- Article
29
- Macromolecular Symposia, 2015, v. 347, n. 1, p. 58, doi. 10.1002/masy.201400036
- Sinha, S.K.;
- Nair, K.G.M.;
- Tyagi, A.K.
- Article
30
- Macromolecular Symposia, 2015, v. 347, n. 1, p. 39, doi. 10.1002/masy.201400037
- Shikha, Deep;
- Jha, Usha;
- Sinha, S.K.;
- Nair, K. G. M.;
- Tyagi, A. K.
- Article
31
- Advanced Functional Materials, 2015, v. 25, n. 24, p. 3666, doi. 10.1002/adfm.201500981
- Wang, Gang;
- Zhang, Miao;
- Liu, Su;
- Xie, Xiaoming;
- Ding, Guqiao;
- Wang, Yongqiang;
- Chu, Paul K.;
- Gao, Heng;
- Ren, Wei;
- Yuan, Qinghong;
- Zhang, Peihong;
- Wang, Xi;
- Di, Zengfeng
- Article
32
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10072-y
- Gholizadeh, A. Baset;
- Byrne, Conor;
- Walton, Alex S.;
- Smith, Richard;
- England, Jonathan;
- Craig, Christopher;
- Hewak, Dan;
- Curry, Richard J.
- Article
33
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 19, p. 15679, doi. 10.1007/s10854-022-08471-8
- Omotoso, Ezekiel;
- Meyer, Walter E.;
- Igumbor, Emmanuel;
- Hlatshwayo, Thulani T.;
- Prinsloo, Aletta R. E.;
- Auret, F. Danie;
- Sheppard, Charles J.
- Article
34
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 6816, doi. 10.1007/s10854-022-07860-3
- Dassi, Minaxi;
- Madan, Jaya;
- Pandey, Rahul;
- Sharma, Rajnish
- Article
35
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 6681, doi. 10.1007/s10854-022-07842-5
- Li, Yanru;
- Yang, Meiyin;
- Luo, Jun
- Article
36
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 23, p. 27777, doi. 10.1007/s10854-021-07160-2
- Lalitha, P.;
- Arumugam, S.;
- Pandurangan, A.;
- Krishna, J. B. M.;
- Sinthiya, A.
- Article
37
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16079, doi. 10.1007/s10854-021-06156-2
- Haider, Md.;
- Shaim, A.;
- Elsayed-Ali, Hani E.
- Article
38
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 7455, doi. 10.1007/s10854-021-05458-9
- Wang, Gang;
- Jing, Yaqi;
- Dai, Haitao;
- Liu, Changlong
- Article
39
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6185, doi. 10.1007/s10854-021-05335-5
- Gupta, Tripti;
- Chauhan, R. P.
- Article
40
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 20, p. 17892, doi. 10.1007/s10854-020-04342-2
- Piętak, Karolina;
- Złotnik, Sebastian;
- Rozbiegała, Ewelina;
- Michałowski, Paweł P.;
- Wójcik, Marek;
- Gaca, Jarosław;
- Rudziński, Mariusz
- Article
41
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2246, doi. 10.1007/s10854-019-02756-1
- Tinishbaeva, K.;
- Kadyrzhanov, K. K.;
- Kozlovskiy, A. L.;
- Uglov, V. V.;
- Zdorovets, M. V.
- Article
42
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 1, p. 144, doi. 10.1007/s10854-019-02325-6
- Liu, Tai-Hsiang;
- Hung, Fei-Yi;
- Chien, Tao;
- Chen, Kuan-Jen
- Article
43
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 1, p. 98, doi. 10.1007/s10854-019-01274-4
- Qin, Changliang;
- Yin, Huaxiang;
- Wang, Guilei;
- Zhang, Yanbo;
- Liu, Jinbiao;
- Zhang, Qinzhu;
- Zhu, Huilong;
- Zhao, Chao;
- Radamson, Henry H.
- Article
44
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 1, p. 18, doi. 10.1007/s10854-018-00650-w
- Zhao, Xuewei;
- Moeen, M.;
- Toprak, M. S.;
- Wang, Guilei;
- Luo, Jun;
- Ke, Xingxing;
- Li, Zhihua;
- Liu, Daoqun;
- Wang, Wenwu;
- Zhao, Chao;
- Radamson, Henry H.
- Article
45
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 18, p. 16740, doi. 10.1007/s10854-019-01212-4
- Chicilo, Farley;
- Koughia, Cyril;
- Curry, Richard;
- Gwilliam, Russel;
- Ahumada-Lazo, Ruben;
- Edgar, Andy;
- Binks, David J.;
- Chapman, Dean;
- Kasap, Safa
- Article
46
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12577, doi. 10.1007/s10854-019-01618-0
- Wang, Xing;
- Liu, Hongxia;
- Zhao, Lu;
- Wang, Yongte;
- Wang, Shulong
- Article
47
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10152, doi. 10.1007/s10854-019-01351-8
- Liu, Sai;
- Xue, Yuming;
- Jia, Rui;
- Tao, Ke;
- Jiang, Shuai;
- Wu, Yiqing;
- Sun, Haoyu;
- Guo, Qing;
- Zhang, Liming;
- Feng, Shaojun
- Article
48
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 7, p. 6617, doi. 10.1007/s10854-019-00969-y
- Jiang, Shuai;
- Jia, Rui;
- Tao, Ke;
- Wu, Yiqing;
- Liu, Sai
- Article
49
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 20, p. 17416, doi. 10.1007/s10854-018-9839-9
- Huang, Zhikun;
- Xu, Wenlong;
- Liu, Guiwu;
- Wang, Tingting;
- Zhang, Xiangzhao;
- Qiao, Guanjun
- Article
50
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15708, doi. 10.1007/s10854-018-9177-y
- Smirnov, A. B.;
- Savkina, R. K.;
- Nasieka, Iu. M.;
- Strelchuk, V. V.;
- Demchenko, I. N.;
- Kryshtab, T.
- Article